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DK502783A - Fremgangsmaade og apparat til fremstilling af flerlags kredsloebsplader - Google Patents

Fremgangsmaade og apparat til fremstilling af flerlags kredsloebsplader Download PDF

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Publication number
DK502783A
DK502783A DK502783A DK502783A DK502783A DK 502783 A DK502783 A DK 502783A DK 502783 A DK502783 A DK 502783A DK 502783 A DK502783 A DK 502783A DK 502783 A DK502783 A DK 502783A
Authority
DK
Denmark
Prior art keywords
circuit boards
multiple circuit
manufacturing multiple
manufacturing
boards
Prior art date
Application number
DK502783A
Other languages
English (en)
Other versions
DK502783D0 (da
Inventor
Peter P Pelligrino
Original Assignee
Economics Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Economics Lab filed Critical Economics Lab
Publication of DK502783A publication Critical patent/DK502783A/da
Publication of DK502783D0 publication Critical patent/DK502783D0/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Burglar Alarm Systems (AREA)
DK5027/83A 1982-03-04 1983-11-03 Fremgangsmade og apparat til fremstilling af flerlags kredsloebsplader DK502783D0 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35473682A 1982-03-04 1982-03-04
PCT/US1983/000292 WO1983003065A1 (en) 1982-03-04 1983-03-04 A method and apparatus for manufacturing multi-layer circuit boards

Publications (2)

Publication Number Publication Date
DK502783A true DK502783A (da) 1983-11-03
DK502783D0 DK502783D0 (da) 1983-11-03

Family

ID=23394704

Family Applications (1)

Application Number Title Priority Date Filing Date
DK5027/83A DK502783D0 (da) 1982-03-04 1983-11-03 Fremgangsmade og apparat til fremstilling af flerlags kredsloebsplader

Country Status (8)

Country Link
EP (1) EP0103627A4 (da)
JP (1) JPS59500341A (da)
CA (1) CA1222574A (da)
DK (1) DK502783D0 (da)
IN (1) IN158376B (da)
IT (1) IT1163136B (da)
NO (1) NO834009L (da)
WO (1) WO1983003065A1 (da)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258996A (ja) * 1984-03-09 1985-12-20 アール．ダブリュ．キュー．インコ． 多層プリント配線板の積層方法および装置
EP0204568A3 (en) * 1985-06-05 1988-07-27 Harry Arthur Hele Spence-Bate Low power circuitry components
US4927477A (en) * 1985-08-26 1990-05-22 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board
GB2212333A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Method of fabricating multi-layer circuits
US4875966A (en) * 1988-09-12 1989-10-24 General Dynamics Corp., Pomona Div. Pressure transfer plate assembly for a heat bonding apparatus
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
CN106538080B (zh) 2014-07-18 2021-04-16 三菱瓦斯化学株式会社 层叠体及半导体元件搭载用基板以及它们的制造方法
EP3007526A1 (en) * 2014-10-08 2016-04-13 T-Kingdom Co., Ltd. Manufacturing method and structure of circuit board with very fine conductive circuit lines
US10332832B2 (en) 2017-08-07 2019-06-25 General Electric Company Method of manufacturing an electronics package using device-last or device-almost last placement
JPWO2019098043A1 (ja) 2017-11-16 2020-11-19 三菱瓦斯化学株式会社 パターニングされた金属箔付き積層体の製造方法及びパターニングされた金属箔付き積層体
KR102645236B1 (ko) 2017-12-14 2024-03-07 미츠비시 가스 가가쿠 가부시키가이샤 절연성 수지층이 형성된 동박
WO2020045112A1 (ja) 2018-08-30 2020-03-05 三菱瓦斯化学株式会社 積層体、金属箔張積層板、パターニングされた金属箔付き積層体、ビルドアップ構造を有する積層体、プリント配線板、多層コアレス基板、及びその製造方法
CN113573887A (zh) 2019-03-29 2021-10-29 三菱瓦斯化学株式会社 带绝缘性树脂层的铜箔、以及使用其的层叠体和层叠体的制造方法
KR102884159B1 (ko) 2019-05-31 2025-11-10 미츠비시 가스 가가쿠 가부시키가이샤 절연성 수지층 부착 기재, 그리고, 이것을 사용한 적층체 및 적층체의 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3219749A (en) * 1961-04-21 1965-11-23 Litton Systems Inc Multilayer printed circuit board with solder access apertures
GB964349A (en) * 1961-08-31 1964-07-22 Rogers Corp Improvements in printed circuit and method of making the same
US3350250A (en) * 1962-03-21 1967-10-31 North American Aviation Inc Method of making printed wire circuitry
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
GB1259837A (en) * 1968-11-18 1972-01-12 Boeing Co Composite structure and method of making the same
US3627902A (en) * 1970-02-02 1971-12-14 Control Data Corp Interconnections for multilayer printed circuit boards
US3972755A (en) * 1972-12-14 1976-08-03 The United States Of America As Represented By The Secretary Of The Navy Dielectric circuit board bonding
US4159222A (en) * 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards

Also Published As

Publication number Publication date
NO834009L (no) 1983-11-03
IT1163136B (it) 1987-04-08
JPS59500341A (ja) 1984-03-01
DK502783D0 (da) 1983-11-03
EP0103627A1 (en) 1984-03-28
WO1983003065A1 (en) 1983-09-15
EP0103627A4 (en) 1985-09-18
CA1222574A (en) 1987-06-02
IT8319877A1 (it) 1984-09-03
IT8319877A0 (it) 1983-03-03
IN158376B (da) 1986-11-01

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