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DK370881A - Fremgangsmaade til fremsilling af en elektroteknisk komponent samt en saadan ved fremgangsmaaden fremstillet komponent - Google Patents

Fremgangsmaade til fremsilling af en elektroteknisk komponent samt en saadan ved fremgangsmaaden fremstillet komponent

Info

Publication number
DK370881A
DK370881A DK370881A DK370881A DK370881A DK 370881 A DK370881 A DK 370881A DK 370881 A DK370881 A DK 370881A DK 370881 A DK370881 A DK 370881A DK 370881 A DK370881 A DK 370881A
Authority
DK
Denmark
Prior art keywords
component
procedure
manufacturing
electrotechnical
manufactured
Prior art date
Application number
DK370881A
Other languages
English (en)
Inventor
H Hoffmann
T Hargita
Original Assignee
Ruf Kg Wilhelm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruf Kg Wilhelm filed Critical Ruf Kg Wilhelm
Publication of DK370881A publication Critical patent/DK370881A/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/07—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by resistor foil bonding, e.g. cladding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adjustable Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacture Of Switches (AREA)
DK370881A 1980-08-22 1981-08-21 Fremgangsmaade til fremsilling af en elektroteknisk komponent samt en saadan ved fremgangsmaaden fremstillet komponent DK370881A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803031751 DE3031751A1 (de) 1980-08-22 1980-08-22 Verfahren zur herstellung elektrotechnischer bauteile und nach diesem verfahren hergestellter schiebe- oder drehwiderstand

Publications (1)

Publication Number Publication Date
DK370881A true DK370881A (da) 1982-02-23

Family

ID=6110218

Family Applications (1)

Application Number Title Priority Date Filing Date
DK370881A DK370881A (da) 1980-08-22 1981-08-21 Fremgangsmaade til fremsilling af en elektroteknisk komponent samt en saadan ved fremgangsmaaden fremstillet komponent

Country Status (3)

Country Link
DE (1) DE3031751A1 (da)
DK (1) DK370881A (da)
FR (1) FR2489072A1 (da)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE21291T1 (de) * 1982-11-25 1986-08-15 Preh Elektro Feinmechanik Einrichtung zur erfassung einer x-y-position.
DE3322382A1 (de) * 1983-06-22 1985-01-10 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Verfahren zur herstellung von gedruckten schaltungen
IL72112A (en) * 1983-06-24 1990-04-29 Amoco Corp Printed circuits
DE3631058A1 (de) * 1986-09-12 1988-03-24 Preh Elektro Feinmechanik Verfahren zur herstellung von leit- und/oder widerstandsbahnen an einem substrat und nach diesem verfahren hergestelltes potentiometer
DE3991179T1 (de) * 1989-09-26 1990-10-11 Rogers Corp Gekruemmter plastikkoerper mit schaltungsmuster, und herstellungsverfahren dafuer
EP0457071A3 (en) * 1990-05-12 1992-09-16 Du Pont De Nemours (Deutschland) Gmbh Process for generating fine conductor lines
DE4141775A1 (de) * 1991-12-18 1993-06-24 Manfred Band Verfahren zur herstellung einer elektronischen schaltung
JP3118103B2 (ja) * 1992-12-21 2000-12-18 矢崎総業株式会社 電気回路用導電部材、電気回路体及びその製造方法
JP3372636B2 (ja) * 1994-03-16 2003-02-04 アルプス電気株式会社 抵抗基板の製造方法
JP3099640B2 (ja) * 1994-06-14 2000-10-16 株式会社村田製作所 焼結体内蔵抵抗体の製造方法及び積層セラミック電子部品の製造方法
GB0106417D0 (en) * 2001-03-15 2001-05-02 Oxford Biosensors Ltd Transfer screen-printing
FI20045235L (fi) * 2004-06-22 2005-12-23 Intune Circuits Oy Menetelmä sähköisesti johtavan kuvion käsittelemiseksi
FI20055515A7 (fi) * 2005-09-28 2007-07-06 Aspact Oy Johdinrakenteen kiinnittäminen kohteeseen

Also Published As

Publication number Publication date
FR2489072A1 (fr) 1982-02-26
DE3031751A1 (de) 1982-04-15

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