[go: up one dir, main page]

DK158215C - Tykfilmlederkompositioner til anvendelse paa et dielektrisk keramisk underlag samt dielektrisk underlag med et tyndt lag af kompositionen bundet dertil - Google Patents

Tykfilmlederkompositioner til anvendelse paa et dielektrisk keramisk underlag samt dielektrisk underlag med et tyndt lag af kompositionen bundet dertil

Info

Publication number
DK158215C
DK158215C DK474980A DK474980A DK158215C DK 158215 C DK158215 C DK 158215C DK 474980 A DK474980 A DK 474980A DK 474980 A DK474980 A DK 474980A DK 158215 C DK158215 C DK 158215C
Authority
DK
Denmark
Prior art keywords
dielectric
thicken
movie
compositions
thin layer
Prior art date
Application number
DK474980A
Other languages
English (en)
Other versions
DK474980A (da
DK158215B (da
Inventor
Joseph Richard Rellick
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of DK474980A publication Critical patent/DK474980A/da
Publication of DK158215B publication Critical patent/DK158215B/da
Application granted granted Critical
Publication of DK158215C publication Critical patent/DK158215C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
DK474980A 1979-11-08 1980-11-07 Tykfilmlederkompositioner til anvendelse paa et dielektrisk keramisk underlag samt dielektrisk underlag med et tyndt lag af kompositionen bundet dertil DK158215C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9271179 1979-11-08
US06/092,711 US4323483A (en) 1979-11-08 1979-11-08 Mixed oxide bonded copper conductor compositions

Publications (3)

Publication Number Publication Date
DK474980A DK474980A (da) 1981-05-09
DK158215B DK158215B (da) 1990-04-09
DK158215C true DK158215C (da) 1990-09-03

Family

ID=22234701

Family Applications (1)

Application Number Title Priority Date Filing Date
DK474980A DK158215C (da) 1979-11-08 1980-11-07 Tykfilmlederkompositioner til anvendelse paa et dielektrisk keramisk underlag samt dielektrisk underlag med et tyndt lag af kompositionen bundet dertil

Country Status (7)

Country Link
US (1) US4323483A (da)
EP (1) EP0028819B1 (da)
JP (1) JPS592398B2 (da)
CA (1) CA1149150A (da)
DE (1) DE3066718D1 (da)
DK (1) DK158215C (da)
IE (1) IE50652B1 (da)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5879837A (ja) * 1981-10-31 1983-05-13 Tdk Corp 磁器コンデンサ
US4567111A (en) * 1982-11-04 1986-01-28 Uop Inc. Conductive pigment-coated surfaces
US4511601A (en) * 1983-05-13 1985-04-16 North American Philips Corporation Copper metallization for dielectric materials
US4521329A (en) * 1983-06-20 1985-06-04 E. I. Du Pont De Nemours And Company Copper conductor compositions
JPS604552A (ja) * 1983-06-23 1985-01-11 Mitsubishi Gas Chem Co Inc 導電性組成物
US4594181A (en) * 1984-09-17 1986-06-10 E. I. Du Pont De Nemours And Company Metal oxide-coated copper powder
US4659406A (en) * 1985-04-22 1987-04-21 International Business Machines Corporation Method of bonding to ceramic and glass
US4623482A (en) * 1985-10-25 1986-11-18 Cts Corporation Copper conductive paint for porcelainized metal substrates
US4687597A (en) * 1986-01-29 1987-08-18 E. I. Du Pont De Nemours And Company Copper conductor compositions
US4877555A (en) * 1987-04-13 1989-10-31 Matsushita Electric Industrial Co., Ltd. Conductor composition and method of manufacturing a ceramic multilayer structure using the same
US4906405A (en) * 1987-05-19 1990-03-06 Matsushita Electric Industrial Co., Ltd. Conductor composition and method of manufacturing a multilayered ceramic body using the composition
JPH01192781A (ja) * 1988-01-26 1989-08-02 Dai Ichi Kogyo Seiyaku Co Ltd 銅厚膜導体組成物
US4868034A (en) * 1988-02-11 1989-09-19 Heraeus Incorporated Cermalloy Division Non-oxidizing copper thick film conductors
US4906404A (en) * 1988-11-07 1990-03-06 Dai-Ichi Kogyo Seiyaku Co., Ltd. Copper conductor composition
US5250229A (en) * 1991-10-10 1993-10-05 E. I. Du Pont De Nemours And Company Silver-rich conductor compositions for high thermal cycled and aged adhesion
KR100275820B1 (ko) * 1992-10-21 2000-12-15 도낀 가부시끼가이샤 금속화용 금속분말 조성물 및 금속화 기판(metal powder composition for metallization and metallized substrate)
JPH0817241A (ja) * 1994-06-30 1996-01-19 Mitsuboshi Belting Ltd 銅導体ペーストおよび銅導体膜の製造方法
EP0698590B1 (en) * 1994-08-23 2003-10-22 AT&T Corp. Metallization of ceramics through application of an adherent reducible layer
US5976628A (en) * 1995-12-08 1999-11-02 Mitsuboshi Belting Ltd. Copper conductor paste and production method of copper conductor film
EP2804183B1 (en) * 2013-05-14 2019-04-17 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Brown-red cu-comprising composition and a composite comprising the brown-red cu-comprising composition
WO2014195097A1 (de) * 2013-06-05 2014-12-11 Ceramtec Gmbh Metallisierung auf keramischen substraten
WO2017108939A1 (en) * 2015-12-22 2017-06-29 Heraeus Deutschland GmbH & Co. KG Thick-film paste mediated ceramics bonded with metal or metal hybrid foils
EP3419390A1 (en) * 2017-06-21 2018-12-26 Heraeus Deutschland GmbH & Co. KG Thick-film paste mediated ceramics bonded with metal or metal hybrid foils and vias
EP4073008B8 (en) * 2019-12-12 2024-12-25 Bert Thin Films, Inc. Pastes for solar cells, solar cells, and methods of making same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE854473C (de) 1941-07-30 1952-11-04 Steatit Magnesia Ag Verfahren zur Herstellung festhaftender loetfaehiger Kupferschichten auf keramischenKoerpern
US2993815A (en) * 1959-05-25 1961-07-25 Bell Telephone Labor Inc Metallizing refractory substrates
GB1378520A (en) * 1971-05-10 1974-12-27 Atomic Energy Authority Uk Metallising pastes
SE354461B (da) 1971-05-21 1973-03-12 Bil City I Pitea Ab
GB1374763A (en) 1971-12-21 1974-11-20 Atomic Energy Authority Uk Metalising pastes
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3943168A (en) * 1974-11-13 1976-03-09 E. I. Du Pont De Nemours And Company Conductor compositions comprising nickel borides
US4001146A (en) 1975-02-26 1977-01-04 E. I. Du Pont De Nemours And Company Novel silver compositions
US4122232A (en) * 1975-04-21 1978-10-24 Engelhard Minerals & Chemicals Corporation Air firable base metal conductors
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
US4072771A (en) * 1975-11-28 1978-02-07 Bala Electronics Corporation Copper thick film conductor
US4172919A (en) * 1977-04-22 1979-10-30 E. I. Du Pont De Nemours And Company Copper conductor compositions containing copper oxide and Bi2 O3
US4130671A (en) * 1977-09-30 1978-12-19 The United States Of America As Represented By The United States Department Of Energy Method for preparing a thick film conductor

Also Published As

Publication number Publication date
DK474980A (da) 1981-05-09
DK158215B (da) 1990-04-09
EP0028819A1 (en) 1981-05-20
IE50652B1 (en) 1986-06-11
JPS592398B2 (ja) 1984-01-18
IE802302L (en) 1981-05-08
DE3066718D1 (en) 1984-03-29
CA1149150A (en) 1983-07-05
EP0028819B1 (en) 1984-02-22
JPS5693396A (en) 1981-07-28
US4323483A (en) 1982-04-06

Similar Documents

Publication Publication Date Title
DK158215C (da) Tykfilmlederkompositioner til anvendelse paa et dielektrisk keramisk underlag samt dielektrisk underlag med et tyndt lag af kompositionen bundet dertil
DK339483D0 (da) Fremgangsmade til fremstilling af harpiksimpraegnerede fiberkompositmaterialer
DK520879A (da) Fremgangsmaade til fremstilling af kompositmaterialer
DK178880A (da) Vandig silicaholdig belaegningssammensaetning substrat og genstand belagt med samme samt fremgangsmaade til dannelse af en slidbestandig belaegning paa et substrat
DK163823C (da) Overtraeksmateriale og fremgangsmaade til overtraekning af et substrat med overtraeksmaterialet
DK157011C (da) Analogifremgangsmaade til fremstilling af 2-carboxy-perhydroindolderivater
BR8300545A (pt) Composicao de revestimento e substrato
ES495413A0 (es) Un procedimiento para la preparacion de un sustrato recubierto con un recubrimiento de esmalte alto en solidos de doble-capa.
IT1141087B (it) Composizione rivestente in resina siliconica
BE854309A (fr) Compositions de liant de silicone utiles pour la fabrication de joints et garnitures
DK574481A (da) Fremgangsmaade til fremstilling af pyridylmethylestere
DK164790C (da) Fremgangsmaade til belaegning med grafit af et polymert substrat
NZ184805A (en) Coating glass or ceramic surfaces with two hydroxylated materials
IT7828674A0 (it) Superfici di vetro con uno strato procedimento per rivestire protettivo di materia artificiale.
DK159824C (da) Analogifremgangsmaade til fremstilling af succinylferroproteiner
DK10181A (da) Fremgangsmaade til fremstilling af azolylvinylketoner samt vedfremgangsmaaden anvendelige udgangsmaterialer
FR2343033A1 (fr) Composition de matiere bitumineuse et de copolymeres a blocs pour le revetement de tuyaux
DK615684D0 (da) Fremgangsmaade til belaegning af overflader med glasagtig emalje
DK161521C (da) Fremgangsmaade til fremstilling af cephalosporiner samt thiestere til anvendelse som udgangsmateriale ved fremgangsmaaden
DK63383A (da) Fremgangsmaade til fremstilling af termoruder, der er forsynet med et metallisk, reflekterende overfladelag
DK144180A (da) Fremgangsmaade til fremstilling af betalactamaseinhibitorer
DK43283A (da) Fremgangsmaade til fremstilling af rynkefri piezoelektriske film ved poling
DK152817C (da) Bladfjeder af kompositmateriale samt fremgangsmaade til fremstilling af samme
DK213783A (da) Fremgangsmaade til fremstilling af formdele af laminerede materialer
DK44981A (da) Lipasesubstrat

Legal Events

Date Code Title Description
PBP Patent lapsed