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DK128095A - Process for hermetically tight joining of oxide materials at relatively low temperatures - Google Patents

Process for hermetically tight joining of oxide materials at relatively low temperatures Download PDF

Info

Publication number
DK128095A
DK128095A DK128095A DK128095A DK128095A DK 128095 A DK128095 A DK 128095A DK 128095 A DK128095 A DK 128095A DK 128095 A DK128095 A DK 128095A DK 128095 A DK128095 A DK 128095A
Authority
DK
Denmark
Prior art keywords
relatively low
low temperatures
oxide materials
hermetically tight
tight joining
Prior art date
Application number
DK128095A
Other languages
Danish (da)
Inventor
Frank K Christensen
Original Assignee
Amp Danmark Af Amp Holland B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Danmark Af Amp Holland B V filed Critical Amp Danmark Af Amp Holland B V
Priority to DK128095A priority Critical patent/DK128095A/en
Priority to JP9518518A priority patent/JP2000500111A/en
Priority to EP96938027A priority patent/EP0861521A1/en
Priority to PCT/DK1996/000470 priority patent/WO1997018628A1/en
Priority to CN 96198351 priority patent/CN1202283A/en
Publication of DK128095A publication Critical patent/DK128095A/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Optical Integrated Circuits (AREA)
  • Ceramic Products (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DK128095A 1995-11-16 1995-11-16 Process for hermetically tight joining of oxide materials at relatively low temperatures DK128095A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DK128095A DK128095A (en) 1995-11-16 1995-11-16 Process for hermetically tight joining of oxide materials at relatively low temperatures
JP9518518A JP2000500111A (en) 1995-11-16 1996-11-15 Method for hermetically bonding oxide materials at relatively low temperatures
EP96938027A EP0861521A1 (en) 1995-11-16 1996-11-15 A method of hermetically bonding oxide materials at relative low temperatures
PCT/DK1996/000470 WO1997018628A1 (en) 1995-11-16 1996-11-15 A method of hermetically bonding oxide materials at relative low temperatures
CN 96198351 CN1202283A (en) 1995-11-16 1996-11-15 Method for hermetically bonding oxide materials at relative low temperatures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DK128095A DK128095A (en) 1995-11-16 1995-11-16 Process for hermetically tight joining of oxide materials at relatively low temperatures

Publications (1)

Publication Number Publication Date
DK128095A true DK128095A (en) 1997-05-17

Family

ID=8103067

Family Applications (1)

Application Number Title Priority Date Filing Date
DK128095A DK128095A (en) 1995-11-16 1995-11-16 Process for hermetically tight joining of oxide materials at relatively low temperatures

Country Status (5)

Country Link
EP (1) EP0861521A1 (en)
JP (1) JP2000500111A (en)
CN (1) CN1202283A (en)
DK (1) DK128095A (en)
WO (1) WO1997018628A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105784189B (en) * 2016-05-05 2018-12-25 厦门纵能电子科技有限公司 Si-glass-silicon structure surface acoustic wave temperature and pressure integrated sensor and preparation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5594979A (en) * 1984-09-13 1997-01-21 Raytheon Company Method for packaging a surface acoustic wave device
US4995149A (en) * 1990-03-26 1991-02-26 At&T Bell Laboratories Method for hermetically sealing electronic devices
US5453652A (en) * 1992-12-17 1995-09-26 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device with interdigital transducers formed on a holding substrate thereof and a method of producing the same
DE69426789T2 (en) * 1993-04-28 2001-08-02 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device and manufacturing method therefor

Also Published As

Publication number Publication date
CN1202283A (en) 1998-12-16
WO1997018628A1 (en) 1997-05-22
EP0861521A1 (en) 1998-09-02
JP2000500111A (en) 2000-01-11

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment