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DK0600070T3 - Magnetsamling til forbedret plan magnetronkatodeforstøvning - Google Patents

Magnetsamling til forbedret plan magnetronkatodeforstøvning

Info

Publication number
DK0600070T3
DK0600070T3 DK93914096T DK93914096T DK0600070T3 DK 0600070 T3 DK0600070 T3 DK 0600070T3 DK 93914096 T DK93914096 T DK 93914096T DK 93914096 T DK93914096 T DK 93914096T DK 0600070 T3 DK0600070 T3 DK 0600070T3
Authority
DK
Denmark
Prior art keywords
magnetic
pole piece
central magnet
magnets
lobe
Prior art date
Application number
DK93914096T
Other languages
Danish (da)
English (en)
Inventor
Barry W Manley
Original Assignee
Manley Kelly
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25398683&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK0600070(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Manley Kelly filed Critical Manley Kelly
Application granted granted Critical
Publication of DK0600070T3 publication Critical patent/DK0600070T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Catching Or Destruction (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Microwave Tubes (AREA)
DK93914096T 1992-06-01 1993-05-25 Magnetsamling til forbedret plan magnetronkatodeforstøvning DK0600070T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/891,707 US5262028A (en) 1992-06-01 1992-06-01 Planar magnetron sputtering magnet assembly
PCT/US1993/004898 WO1993024674A1 (en) 1992-06-01 1993-05-25 Improved planar magnetron sputtering magnet assembly

Publications (1)

Publication Number Publication Date
DK0600070T3 true DK0600070T3 (da) 1999-05-10

Family

ID=25398683

Family Applications (1)

Application Number Title Priority Date Filing Date
DK93914096T DK0600070T3 (da) 1992-06-01 1993-05-25 Magnetsamling til forbedret plan magnetronkatodeforstøvning

Country Status (9)

Country Link
US (1) US5262028A (de)
EP (1) EP0600070B1 (de)
JP (1) JP3473954B2 (de)
AT (1) ATE169349T1 (de)
AU (1) AU4388293A (de)
DE (1) DE69320151T2 (de)
DK (1) DK0600070T3 (de)
ES (1) ES2122024T3 (de)
WO (1) WO1993024674A1 (de)

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US20060049040A1 (en) * 2004-01-07 2006-03-09 Applied Materials, Inc. Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels
US7087145B1 (en) 2005-03-10 2006-08-08 Robert Choquette Sputtering cathode assembly
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CN101203935A (zh) * 2005-06-04 2008-06-18 应用材料合资有限公司 溅射磁控管
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BRPI0711644B1 (pt) * 2006-05-16 2019-03-19 Oerlikon Trading Ag, Trübbach Fonte de arco voltaico com um alvo e processo para a produção de peças revestidas por arco voltaico
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US8236152B2 (en) * 2006-11-24 2012-08-07 Ascentool International Ltd. Deposition system
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US8628645B2 (en) 2007-09-04 2014-01-14 Front Edge Technology, Inc. Manufacturing method for thin film battery
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US8016982B2 (en) * 2007-11-30 2011-09-13 Panasonic Corporation Sputtering apparatus and sputtering method
US10043642B2 (en) * 2008-02-01 2018-08-07 Oerlikon Surface Solutions Ag, Pfäffikon Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement
WO2010021613A1 (en) * 2008-08-20 2010-02-25 Ascentool, Inc. Deposition system
KR101094995B1 (ko) 2009-08-25 2011-12-19 금오공과대학교 산학협력단 스퍼터링 장치
US8502494B2 (en) 2009-08-28 2013-08-06 Front Edge Technology, Inc. Battery charging apparatus and method
JPWO2012035603A1 (ja) * 2010-09-13 2014-01-20 株式会社シンクロン 磁場発生装置、マグネトロンカソード及びスパッタ装置
JP5692374B2 (ja) * 2011-05-30 2015-04-01 日立金属株式会社 レーストラック形状のマグネトロンスパッタリング用磁場発生装置
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US8864954B2 (en) 2011-12-23 2014-10-21 Front Edge Technology Inc. Sputtering lithium-containing material with multiple targets
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US9257695B2 (en) 2012-03-29 2016-02-09 Front Edge Technology, Inc. Localized heat treatment of battery component films
JP5873557B2 (ja) * 2012-07-11 2016-03-01 キヤノンアネルバ株式会社 スパッタリング装置および磁石ユニット
US9159964B2 (en) 2012-09-25 2015-10-13 Front Edge Technology, Inc. Solid state battery having mismatched battery cells
US8753724B2 (en) 2012-09-26 2014-06-17 Front Edge Technology Inc. Plasma deposition on a partially formed battery through a mesh screen
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JP2015017304A (ja) * 2013-07-11 2015-01-29 ソニー株式会社 磁界発生装置、及びスパッタリング装置
TWI527924B (zh) * 2014-02-12 2016-04-01 兆陽真空動力股份有限公司 電磁控濺鍍陰極
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US20190043701A1 (en) * 2017-08-02 2019-02-07 HIA, Inc. Inverted magnetron for processing of thin film materials
US11594402B2 (en) 2017-12-05 2023-02-28 Oerlikon Surface Solutions Ag, Pfaffikon Magnetron sputtering source and coating system arrangement
GB201817176D0 (en) * 2018-10-22 2018-12-05 Univ Sheffield Apparatus and methods for targeted drug delivery
CN113755808A (zh) * 2021-09-28 2021-12-07 北海惠科半导体科技有限公司 磁控溅射装置及其控制方法

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Also Published As

Publication number Publication date
JPH07507360A (ja) 1995-08-10
EP0600070A1 (de) 1994-06-08
WO1993024674A1 (en) 1993-12-09
US5262028A (en) 1993-11-16
EP0600070A4 (de) 1994-10-26
ATE169349T1 (de) 1998-08-15
JP3473954B2 (ja) 2003-12-08
DE69320151T2 (de) 1999-01-14
AU4388293A (en) 1993-12-30
DE69320151D1 (de) 1998-09-10
EP0600070B1 (de) 1998-08-05
ES2122024T3 (es) 1998-12-16

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