DE924818C - Manufacture of high-vacuum-tight solder connections between parts made of ceramic and metallic material by melting the solder under the action of mechanical pressure - Google Patents
Manufacture of high-vacuum-tight solder connections between parts made of ceramic and metallic material by melting the solder under the action of mechanical pressureInfo
- Publication number
- DE924818C DE924818C DEL5368D DEL0005368D DE924818C DE 924818 C DE924818 C DE 924818C DE L5368 D DEL5368 D DE L5368D DE L0005368 D DEL0005368 D DE L0005368D DE 924818 C DE924818 C DE 924818C
- Authority
- DE
- Germany
- Prior art keywords
- ceramic
- solder
- metallic material
- vacuum
- melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 title claims description 13
- 229910000679 solder Inorganic materials 0.000 title claims description 13
- 239000007769 metal material Substances 0.000 title claims 2
- 238000002844 melting Methods 0.000 title description 2
- 230000008018 melting Effects 0.000 title description 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 5
- 238000010309 melting process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/32—Seals for leading-in conductors
Landscapes
- Ceramic Products (AREA)
Description
Bei elektrischen Entladungsgefäßen, insbesondere Elektronenröhren; bei dienen deas Vakuumgefäß aus Keramik besteht oder unter Verwendung von keramischem Werkstoff aufgebaut .ist, macht es Schwierigkeiten, die Stramdurchfühzunegen, <lie beispielsweise .aus Molyybd'än, Wolfram oder einem anderen Einschmelzmaterial bestehen, dessen Wärmeausdehnungskoeffizi.ent kleiner .ist als dIerjenige der Kerani,ik, einwandfrei, insbesondere hochvakuumAicht, zu befestigen. Zum Einlöten der Stromdurchführungen wird vielfach ,ein SÜber-oder Kupferlot verwendet. Es -ergibt isich nun. die Schwierigkeit, :daß das Lot beim Löten auf der freien Oberfläche der Keramik eine unregelmäßige Verteilung aufweist oder gar nicht erst in den Raum zwischen Stift und Keramik hineinläuft, wenn man es außen in Ring- oder Bandform auflegt. Der Grund für dieses Verhalten ist in der Tatsache begründet, daß .der eine der beiden zu verlötenden Teile aus Keramik besteht, die von dem Lot nicht in .der Weise benetzt wird, wie,das Metall.In the case of electrical discharge vessels, in particular electron tubes; at serve the vacuum vessel is made of ceramic or using ceramic If the material is built up, it makes it difficult to carry out the string, <lie for example. made of molyybdenum, tungsten or another melting material, whose coefficient of thermal expansion is smaller than that of the Kerani, ik, perfect, especially high vacuum For soldering the power feedthroughs Often, an SÜber or copper solder is used. It surrenders to me now. the difficulty, : that the solder when soldering on the free surface of the ceramic is an irregular Shows distribution or does not even run into the space between the pin and the ceramic, if you put it on the outside in a ring or ribbon shape. The reason for this behavior is due to the fact that .the one of the two parts to be soldered is made of Ceramic is made, which is not wetted by the solder in the same way as the metal.
Zur Vermeidung dieser Nachteile wird erfindungsgemäß vorgeschlagen, den einzulötenden Metallteil, beispielsweise den Stromdurchführungsstift, mit einem Absatz zu versehen, während die Keramik ebenfalls entsprechend abgesetzt ist, zwischen Keramik und Stift einen Lotring einzulegen und nach :der Erweichung des Lotes von oben auf den Metallteil einen Druck auszuüben, der das Lot zwingt, sich auf die zu verlötende Fläche zu verteilen. Das neue Verfahren hat den Vorteil, daß sich leas Lot gleichmäßig in der Lötfuge verteilt, wodurch eine einwandfreie, d..h. hochvakuumdichte Verlötung erzielt wird.To avoid these disadvantages, it is proposed according to the invention that the metal part to be soldered, for example the power feedthrough pin, with a To provide paragraph, while the ceramic is also offset accordingly, between Ceramic and pin to insert a solder ring and after: the softening of the solder of Apply pressure on top of the metal part, forcing the solder to touch the to distribute the area to be soldered. The new method has the advantage that leas solder evenly distributed in the soldering joint, whereby a flawless, d..h. high vacuum density Soldering is achieved.
Die Zeichnung zeigt ein Ausführungsbeispiel der neuen Lötverbindung. Der abgesetzte Durchführungsstift z sitzt in der ebenfalls mit einem Ansatz versehenen Keramik 2, so daßsich zwischen der Wandung der Keramik und dem Stift nur ein gering-ex Zwischenraum befindet. Zwischen den abgesetzten Teilen des Metallstiftes und der Keramik ist ein Lotring 3 angeordnet. Nach dem Schmelzen des Lootmetalls wird auf .den Stromdurchfüb:rungssüift z in Pfeilrichtung ein Druck ausgeübt, leer das geschmolzene Lot zwingt, sich über die zu verlötenden Flächen zu verteilen.The drawing shows an embodiment of the new soldered connection. The remote feed-through pin z sits in the also provided with a shoulder Ceramic 2, so that between the wall of the ceramic and the pin only a slight-ex Space is located. Between the remote parts of the metal pin and the Ceramic, a solder ring 3 is arranged. After the loot metal has melted, it will open .the Stromdurchfüb: rungssüift z in the direction of the arrow exerted a pressure, empty the melted Solder forces itself to be distributed over the surfaces to be soldered.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEL5368D DE924818C (en) | 1944-11-05 | 1944-11-05 | Manufacture of high-vacuum-tight solder connections between parts made of ceramic and metallic material by melting the solder under the action of mechanical pressure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEL5368D DE924818C (en) | 1944-11-05 | 1944-11-05 | Manufacture of high-vacuum-tight solder connections between parts made of ceramic and metallic material by melting the solder under the action of mechanical pressure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE924818C true DE924818C (en) | 1955-03-07 |
Family
ID=7256786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEL5368D Expired DE924818C (en) | 1944-11-05 | 1944-11-05 | Manufacture of high-vacuum-tight solder connections between parts made of ceramic and metallic material by melting the solder under the action of mechanical pressure |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE924818C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2556123A1 (en) * | 1983-12-01 | 1985-06-07 | Ceraver | Method for producing a sealed electrical penetration through a wall |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE668623C (en) * | 1937-06-30 | 1938-12-07 | Aeg | Vacuum-tight connection between parts made of ceramic material and made of metal by means of a solder, in particular vacuum-tight power feed |
| DE674734C (en) * | 1937-01-26 | 1939-04-21 | Porzellanfabrik Kahla | Method for combining metallic parts with insulating bodies made of inorganic, in particular ceramic, material |
| DE682962C (en) * | 1935-03-10 | 1939-10-25 | Siemens & Halske Akt Ges | Process for the production of tight and resistant connections between ceramic bodies among themselves or between ceramic and metallic bodies |
| DE739972C (en) * | 1936-05-13 | 1943-10-08 | Aeg | Process for the production of vacuum-tight connections between bodies made of metal and non-pre-metallized ceramic surfaces |
-
1944
- 1944-11-05 DE DEL5368D patent/DE924818C/en not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE682962C (en) * | 1935-03-10 | 1939-10-25 | Siemens & Halske Akt Ges | Process for the production of tight and resistant connections between ceramic bodies among themselves or between ceramic and metallic bodies |
| DE739972C (en) * | 1936-05-13 | 1943-10-08 | Aeg | Process for the production of vacuum-tight connections between bodies made of metal and non-pre-metallized ceramic surfaces |
| DE674734C (en) * | 1937-01-26 | 1939-04-21 | Porzellanfabrik Kahla | Method for combining metallic parts with insulating bodies made of inorganic, in particular ceramic, material |
| DE668623C (en) * | 1937-06-30 | 1938-12-07 | Aeg | Vacuum-tight connection between parts made of ceramic material and made of metal by means of a solder, in particular vacuum-tight power feed |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2556123A1 (en) * | 1983-12-01 | 1985-06-07 | Ceraver | Method for producing a sealed electrical penetration through a wall |
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