DE9113744U1 - Three-dimensional micromechanical acceleration sensor with integrated electronics - Google Patents
Three-dimensional micromechanical acceleration sensor with integrated electronicsInfo
- Publication number
- DE9113744U1 DE9113744U1 DE9113744U DE9113744U DE9113744U1 DE 9113744 U1 DE9113744 U1 DE 9113744U1 DE 9113744 U DE9113744 U DE 9113744U DE 9113744 U DE9113744 U DE 9113744U DE 9113744 U1 DE9113744 U1 DE 9113744U1
- Authority
- DE
- Germany
- Prior art keywords
- micromechanical acceleration
- dimensional
- acceleration sensor
- integrated electronics
- dimensional micromechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001133 acceleration Effects 0.000 title claims description 13
- 238000005259 measurement Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
Description
DREIDIMENSIONALER MIKROMECHANISCHER BESCHLEUNIGUNGSSENSOR MIT INTEGRIERTER ELEKTRONIKTHREE-DIMENSIONAL MICROMECHANICAL ACCELERATION SENSOR WITH INTEGRATED ELECTRONICS
Die Erfindung betrifft einen dreidimensionalen mikromechanischen Beschleunigungssensor mit integrierter Elektronik.The invention relates to a three-dimensional micromechanical acceleration sensor with integrated electronics.
Bekannte mikromechanische Beschleunigungssensoren sind dadurch
gekennzeichnet, daß sie als eindimensionale Sensoren auf einem geeigneten Trägersubstrat mit einer elektronischen Schaltung
zur Aufbereitung des Meßsignals versehen sind und nachfolgend gemeinsam mit dieser Elektronik durch eine geeignete Umhüllung
vor äußeren Einflüssen geschützt werden. Ist eine dreidimensionale Erfassung von Beschleunigungssignalen erforderlich,
werden drei dieser Baugruppen auf einem geeigneten Formkörper angeordnet und miteinander verschaltet. Nachteilig ist bei
dieser Lösung der große Platzbedarf, der relativ hohe äußere Verdrahtungsaufwand und das Gewicht dieser Anordnung, welches
bei einigen Anwendungen sogar das Meßsignal verfälschen kann.
In der DE-OS 37 41 036 wird ein integrierter dreidimensionaler Beschleunigungssensor beschrieben, bei dem drei jeweils für
eine Richtung empfindliche mikromechanische Sensorelemente in planarer Technologie in einem Chip integriert sind. Diese
Lösung weist zwar einen minimalen Platzbedarf auf, die Sensoren sind jedoch aufgrund ihrer geometrischen Gestaltung
in den drei Meßachsen unterschiedlich empfindlich.Known micromechanical acceleration sensors are characterized by the fact that they are one-dimensional sensors on a suitable carrier substrate with an electronic circuit for processing the measurement signal and are then protected together with this electronics from external influences by a suitable casing. If three-dimensional detection of acceleration signals is required, three of these modules are arranged on a suitable molded body and connected to one another. The disadvantages of this solution are the large amount of space required, the relatively high external wiring effort and the weight of this arrangement, which can even distort the measurement signal in some applications.
DE-OS 37 41 036 describes an integrated three-dimensional acceleration sensor in which three micromechanical sensor elements, each sensitive to one direction, are integrated in a chip using planar technology. Although this solution requires minimal space, the sensors are sensitive to different degrees in the three measuring axes due to their geometric design.
Ziel der Erfindung ist die Herstellbarkeit von dreidimensionalen mikromechanischen Beschleunigungssensoren mit minimalem Volumen und Gewicht und gleicher Meßempfindlichkeit in allen drei Achsen.The aim of the invention is to produce three-dimensional micromechanical acceleration sensors with minimal volume and weight and the same measurement sensitivity in all three axes.
Aufgabe der Erfindung ist es, eindimensionale mikromechanische Beschleunigungssensoren in drei Meßachsen und elektronische Bauelemente zur Auswertung der Sensorsignale auf kleinstem Raum effektiv anzuordnen.The object of the invention is to effectively arrange one-dimensional micromechanical acceleration sensors in three measuring axes and electronic components for evaluating the sensor signals in the smallest possible space.
Erfindungsgemäß wird die Aufgabe dadurch gelöst, daß drei eindimensionale mikromechanische Beschleunigungssensoren auf drei orthogonal zueinander ausgerichteten Seiten eines prismatischen Grundkörpers angeordnet sind, sich auf weiteren Seiten dieses prismatischen Grundkörpers elektronische Bau-According to the invention, the object is achieved in that three one-dimensional micromechanical acceleration sensors are arranged on three sides of a prismatic base body that are aligned orthogonally to one another, and electronic components are arranged on further sides of this prismatic base body.
elemente zur Auswertung der Sensorsignale befinden und die Grundfläche des prismatischen Grundkörpers der Befestigung der Baugruppe auf einem Träger dient.elements for evaluating the sensor signals and the base of the prismatic body serves to attach the assembly to a carrier.
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben.
Auf einem als Würfel 1 ausgebildeten prismatischen Grundkörper werden auf drei Seiten eindimensionale mikromechanische
Beschleunigungssensoren 2 angeordnet, während weitere zwei Seiten und der verbleibende Platz auf den mit den Beschleunigungssensoren
bestückten Seiten für die elektronischen Bauelemente 3 der Auswerteelektronik genutzt werden. Die
Verdrahtung der Baugruppe wird durch auf dem Würfel 1 aufgebrachte Leiterzüge 4 realisiert, wobei diese in geeigneter
Weise um die Kanten des Grundkörpers herumgeführt werden, die Grundfläche 5 des Würfels 1 dient der Befestigung der Baugruppe
auf einem Träger 6, der als Substrat oder Gehäuse ausgebildet sein kann.An embodiment of the invention is shown in the drawing and is described in more detail below.
One-dimensional micromechanical acceleration sensors 2 are arranged on three sides of a prismatic base body designed as a cube 1, while another two sides and the remaining space on the sides equipped with the acceleration sensors are used for the electronic components 3 of the evaluation electronics. The wiring of the assembly is implemented by conductor tracks 4 applied to the cube 1, whereby these are routed in a suitable manner around the edges of the base body, the base area 5 of the cube 1 serves to attach the assembly to a carrier 6, which can be designed as a substrate or housing.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9113744U DE9113744U1 (en) | 1991-11-05 | 1991-11-05 | Three-dimensional micromechanical acceleration sensor with integrated electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9113744U DE9113744U1 (en) | 1991-11-05 | 1991-11-05 | Three-dimensional micromechanical acceleration sensor with integrated electronics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE9113744U1 true DE9113744U1 (en) | 1992-01-16 |
Family
ID=6872944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE9113744U Expired - Lifetime DE9113744U1 (en) | 1991-11-05 | 1991-11-05 | Three-dimensional micromechanical acceleration sensor with integrated electronics |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE9113744U1 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0595735A1 (en) * | 1992-10-29 | 1994-05-04 | Sextant Avionique S.A. | Sensor for a directional physical value |
| EP0632275A1 (en) * | 1993-07-03 | 1995-01-04 | VDO Adolf Schindling AG | Support for accelerometers |
| EP0686830A1 (en) * | 1994-06-08 | 1995-12-13 | Bodenseewerk Gerätetechnik GmbH | Inertial sensor unit |
| WO1996002848A1 (en) * | 1994-07-20 | 1996-02-01 | Honeywell Inc. | Three axis packaging |
| WO1996006328A1 (en) * | 1994-08-25 | 1996-02-29 | Paul Christopher Declan Elford | Three-dimensional measurement unit and position indicator |
| US5563630A (en) * | 1993-10-28 | 1996-10-08 | Mind Path Technologies, Inc. | Computer mouse |
| DE19750350C1 (en) * | 1997-11-13 | 1999-08-05 | Univ Dresden Tech | Three-dimensional chip acceleration sensor |
| DE10064170A1 (en) * | 2000-12-22 | 2002-07-11 | Stn Atlas Elektronik Gmbh | Device for measuring acceleration/angular velocity in axes of measurement uses measurement sensors fixed on a carrier like a printed circuit board with a fixed allocation of space in relation to each other. |
| DE19610554B4 (en) * | 1995-04-19 | 2006-09-21 | Smiths Group Plc | Acceleration sensor assembly |
| WO2006122780A3 (en) * | 2005-05-18 | 2007-03-01 | Hl Planar Technik Gmbh | Field measuring device, measurement module for a field measuring device and method of producing a plurality of measurement modules |
| WO2012101174A1 (en) * | 2011-01-25 | 2012-08-02 | Epcos Ag | Sensor arrangement |
-
1991
- 1991-11-05 DE DE9113744U patent/DE9113744U1/en not_active Expired - Lifetime
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2697628A1 (en) * | 1992-10-29 | 1994-05-06 | Sextant Avionique | Sensor of an oriented physical quantity. |
| US5433110A (en) * | 1992-10-29 | 1995-07-18 | Sextant Avionique | Detector having selectable multiple axes of sensitivity |
| EP0595735A1 (en) * | 1992-10-29 | 1994-05-04 | Sextant Avionique S.A. | Sensor for a directional physical value |
| EP0632275A1 (en) * | 1993-07-03 | 1995-01-04 | VDO Adolf Schindling AG | Support for accelerometers |
| US5563630A (en) * | 1993-10-28 | 1996-10-08 | Mind Path Technologies, Inc. | Computer mouse |
| EP0848231A1 (en) * | 1994-06-08 | 1998-06-17 | BODENSEEWERK GERÄTETECHNIK GmbH | Inertial sensor unit |
| EP0686830A1 (en) * | 1994-06-08 | 1995-12-13 | Bodenseewerk Gerätetechnik GmbH | Inertial sensor unit |
| WO1996002848A1 (en) * | 1994-07-20 | 1996-02-01 | Honeywell Inc. | Three axis packaging |
| US6169254B1 (en) | 1994-07-20 | 2001-01-02 | Honeywell, Inc. | Three axis sensor package on flexible substrate |
| WO1996006328A1 (en) * | 1994-08-25 | 1996-02-29 | Paul Christopher Declan Elford | Three-dimensional measurement unit and position indicator |
| DE19610554B4 (en) * | 1995-04-19 | 2006-09-21 | Smiths Group Plc | Acceleration sensor assembly |
| DE19750350C1 (en) * | 1997-11-13 | 1999-08-05 | Univ Dresden Tech | Three-dimensional chip acceleration sensor |
| DE10064170A1 (en) * | 2000-12-22 | 2002-07-11 | Stn Atlas Elektronik Gmbh | Device for measuring acceleration/angular velocity in axes of measurement uses measurement sensors fixed on a carrier like a printed circuit board with a fixed allocation of space in relation to each other. |
| DE10064170C2 (en) * | 2000-12-22 | 2002-11-07 | Stn Atlas Elektronik Gmbh | Device for measuring acceleration and / or angular velocity |
| WO2006122780A3 (en) * | 2005-05-18 | 2007-03-01 | Hl Planar Technik Gmbh | Field measuring device, measurement module for a field measuring device and method of producing a plurality of measurement modules |
| WO2012101174A1 (en) * | 2011-01-25 | 2012-08-02 | Epcos Ag | Sensor arrangement |
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