DE878236C - High resistance - Google Patents
High resistanceInfo
- Publication number
- DE878236C DE878236C DEH9648A DEH0009648A DE878236C DE 878236 C DE878236 C DE 878236C DE H9648 A DEH9648 A DE H9648A DE H0009648 A DEH0009648 A DE H0009648A DE 878236 C DE878236 C DE 878236C
- Authority
- DE
- Germany
- Prior art keywords
- layer
- resistance
- high resistance
- thin
- metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/08—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by vapour deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C10/00—Adjustable resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Adjustable Resistors (AREA)
Description
Hochohmiger Widerstand Die Herstellung hochohmiger Widerstände durch Aufbringen dünner Metallfilme auf Porzellan und Glas ist bekannt. Es wurden auch schon: harte Polvplaste als Unterlagen für die leitenden Metailsc'hichten verwandt. Es, bestand jedoch bisher der :Mangel, d@aß die dünnen, beispielsweise durch Kathodenzerstäubung aufgebrachten Metallschichten eine unbefriedigende Haftfestigkeit auf der Unterlage aufwiesen, was ihre Verwendbarkeit für stetig veränderbare hochohrnige Widerstände in Drehpotentiometern u. dgl., beispielsweise in der Radiotechnik, aussc'hloß, da an Aden Kontaktstellen zu hohe reibende Kräfte auftreten.High-ohmic resistance The production of high-ohmic resistors by Applying thin metal films to porcelain and glass is known. There were too yes: hard polypropylene used as a base for the leading Metailsc'hichten. There was, however, so far the: Deficiency that ate the thin ones, for example through cathode sputtering applied metal layers have an unsatisfactory adhesive strength on the substrate showed what their usability for continuously changeable high-eared resistances in rotary potentiometers and the like, for example in radio technology, because Excessive frictional forces occur at the contact points.
Dieser empfindliche Mangel wird nun durch die Erfindung in überraschend günstiger Weise dadurch behoben, daß der Widerstand nach der Erfindung aus einer Unterlage aus einem Polyplast, einer auf diese Unterlage im Vakuum aufgedampften, sehr dünnen Schicht eines anorganischen, beständigen dielektrischen Stoffes, insbesondere eines beständigen Oxydes, und einer auf diese Schicht ebenfalls im Vakuum aufgedampften, dünnen, leitenden Metall- oder Halbleiterschicht besteht. Es hat sieh nämlich ergeben, daß bei einem ,derartig aufgebauten Widerstand die Haftfestigkeit der aufgedampften Metallschicht durch die dünne diele'ktrische, anorganische, Zwischenschicht verbessert wird.This sensitive deficiency is now surprising as a result of the invention fixed in a favorable manner that the resistor according to the invention from a Base made of a polyplast, a vacuum vapor-deposited onto this base, very thin layer of an inorganic, permanent dielectric material, in particular of a stable oxide, and one that is also vapor-deposited on this layer in a vacuum, thin, conductive metal or semiconductor layer. You see, it turned out that with a resistor constructed in this way, the adhesive strength of the vapor-deposited Metal layer improved by the thin dielectric, inorganic, intermediate layer will.
Vorzügliche Ergebnisse wurden. insbesondere mit Siliciummonoxyderzielt, das am besten durch Verdampfun@g im Vakuum in dünner Schicht auf der Schichtstoffunterlage aufzubringen ist. Die Dicke der Schicht kann in der Größenordnung von ioo bis ioooÄ liegen. Die darauf aufgedampfte Metall-oder Halbleiterschicht, beispielsweise aus Aluminium, Chrom, Kupfer, Silicium oder Legierungen, 'hat möglichst eine solche Dicke, daß die bekannten, die Leitfä'hig'keit beeinträchtigenden Anomalien sehr dünner Metallfilme nicht mehr auftreten, also Dicken von über ioo A bis zu einigen Mikron.Excellent results have been. Achieved in particular with silicon monoxy, This is best done by evaporation in a vacuum in a thin layer on the laminate base is to be raised. The thickness of the layer can be on the order of 10,000 to 10,000 Å lie. The metal or vapor-deposited on it Semiconductor layer, for example made of aluminum, chromium, copper, silicon or alloys, 'has if possible such a thickness that the known anomalies affecting conductivity very thin metal films no longer occur, i.e. thicknesses of over 100 A up to a few microns.
Diese Widerstände kommen einem in, der Hochfrequenztechnik bestehenden Bedürfnis entgegen, stetig regelbare, hochohmige Widerstände sehr größerBeständigkeit herzustellen. Hierzu wird beispielsweise eine ringförmige unterbrochene und erfindungsgemäß an ihrer Oberfläche leitend gemachte Schichtstoffplatte mit einem beweglichen Kontakt-Nebel in geeigneter Weise so verbunden; daß ein beliebig abzugreifender Teil der Schicht in den zu regelnden Stromkreis als Widerstand eingeht. Der Kontakthebel gleitet zu diesem Zweck mit dem gerade erforderlichen Kontaktdruck auf der Widerstandsschicht. Durch seine Drehung wird die Widerstandsgröße eingestellt. Bei den bisher bekannten Widerstandsschichten blätterten nun nach kurzem Gebrauch die leitenden Metallschichten ab durch die Wirkung der beim Drehen des Kontakt-' Nebels auftretenden Reibungskräfte. Dies ist nun bei den erfindungsgemäßen Widerständen nicht mehr der Fall. Sie sind vielmehr durch eine lange Lebensdauer ausgezeichnet.These resistors come from an existing high frequency technology Opposed to the need, continuously adjustable, high-ohmic resistances very greater resistance to manufacture. For this purpose, for example, an annular interrupted and according to the invention Laminate board made conductive on its surface with a moving contact mist appropriately so connected; that any part of the layer to be tapped off enters the circuit to be controlled as a resistor. The contact lever slides for this purpose with just the required contact pressure on the resistance layer. By rotating it, the resistance value is set. With the previously known Resistance layers peeled off the conductive metal layers after a short period of use from the effect of the frictional forces that occur when the contact fog is turned. This is no longer the case with the resistors according to the invention. they are rather, it is characterized by a long service life.
In der Abb. i ist als Beispiel ein ringförmniges, unterbrochenes Widerstandselement für ein stetig veränderbares Potentiometer gezeigt. Auf einer Unterlage aus einem geschichteten Phenolharz i liegt die oxydische Verankerungsschicht 2, beispielsweise aus Si O, und darüber die leitende dünne Metallschicht 3: Die Schichten sind irr Schnitt überhöht gezeichnet zur besseren Deutlichkeit.In Fig. I is an example of a ring-shaped, interrupted resistance element shown for a continuously variable potentiometer. On a pad of one layered phenolic resin i is the oxidic anchoring layer 2, for example made of Si O, and on top of it the conductive thin metal layer 3: The layers are insane Section drawn exaggerated for better clarity.
Um einen gewünschten Widerstandsverlauf herzustellen, steht, wie bekannt, die Variationsmöglic'hkeit der Schichtdicke zur Verfügung. Durch Variieren der Schichtdicke allein gelingt es aber nicht, über mehrere Dekaden veränderbare Widerstände: herzustellen. Deswegen wird als, weiterer Erfindungsgedanke für die Herstellung solcher Wider-,stände folgendes. in Aalspruch genommen, wobei zum Verständnis auf Ab-b. 2 verwiesen wird, die ein Ausführungsbeispiel zeigt: Längs edier Widerstandsschicht 3 besteht diese nicht aus einem bestimmten Metall bzw. Legierung mit einer sich ändernden Schichtdicke, sondern aus mindestens. zwei verschiedenen Metallen bzw. Legierungen 3a, 3b USW., so daß sich die verschiedenen Metallschichten verschiedener Leitfä'hig'keit überlappen, wobei auch noch deren Schichtdicke in geeigneter Weise variiert wird. Durch aufeinanderfolgendes Bedampfen von verschiedenen Verdampfungsquellen aus und unter Verwendung passend geformter Blenden kann dieser Schichtaufbau in gewünschter Weise erhalten werden. An den Endkontaktstellen 4 des! Widerstands wird die Metallschicht vorteilhaft noch besonders verstärkt, beispielsweise mit Silber.As is known, the possibility of varying the layer thickness is available in order to produce a desired resistance profile. By varying the layer thickness alone, however, it is not possible to produce resistances that can be changed over several decades. Therefore, the following is a further inventive idea for the production of such resistors. made use of, whereby for understanding on Ab-b. Reference is made to FIG. 2, which shows an exemplary embodiment: Along the resistance layer 3, this does not consist of a specific metal or alloy with a changing layer thickness, but of at least. two different metals or alloys 3a, 3b, etc., so that the different metal layers of different conductivity overlap, with their layer thickness also being varied in a suitable manner. This layer structure can be obtained in the desired manner by successive vapor deposition from different evaporation sources and using appropriately shaped screens. At the end contact points 4 of the! Resistance, the metal layer is advantageously particularly reinforced, for example with silver.
In der Abb, 2 ist der Schichtaufbau in überhöhter Zeichnung dargestellt. 3" ist eine Silicium-, 3b eine Chrom-, 3c eine Kupferschicht. In dieser Reihenfolge nimmt der Widerstand der Schicht ab.In Fig, 2 the layer structure is shown in an exaggerated drawing. 3 " is a silicon, 3b a chromium, 3c a copper layer. The resistance of the layer decreases in this order.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEH9648A DE878236C (en) | 1951-09-05 | 1951-09-05 | High resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEH9648A DE878236C (en) | 1951-09-05 | 1951-09-05 | High resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE878236C true DE878236C (en) | 1953-06-01 |
Family
ID=7146059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEH9648A Expired DE878236C (en) | 1951-09-05 | 1951-09-05 | High resistance |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE878236C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1064604B (en) * | 1957-04-12 | 1959-09-03 | Siemens Ag | Hall generator with semiconductor plates stuck to a carrier |
| DE1151859B (en) * | 1957-05-20 | 1963-07-25 | Servomechanismus Inc | Resistance element for a resistance that can be changed by means of a sliding contact and a method for its production |
| DE1156289B (en) * | 1952-10-31 | 1963-10-24 | Libbey Owens Ford Glass Co | Process for the production of transparent and electrically conductive coatings on translucent bodies of an inorganic or organic nature |
| DE1157301B (en) * | 1960-08-03 | 1963-11-14 | Werk Fuer Bauelemente Der Nach | Device for the production of resistors by vapor deposition of layers in a vacuum on carrier |
| DE1299752B (en) * | 1962-08-01 | 1969-07-24 | Standard Elektrik Lorenz Ag | Process for the production of metal film resistors |
| DE3631057A1 (en) * | 1986-09-12 | 1988-03-24 | Preh Elektro Feinmechanik | METHOD FOR PRODUCING NON-LINEAR RESISTANCE TRACKS AND ROTATION POTENTIOMETER PRODUCED BY THIS METHOD |
-
1951
- 1951-09-05 DE DEH9648A patent/DE878236C/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1156289B (en) * | 1952-10-31 | 1963-10-24 | Libbey Owens Ford Glass Co | Process for the production of transparent and electrically conductive coatings on translucent bodies of an inorganic or organic nature |
| DE1064604B (en) * | 1957-04-12 | 1959-09-03 | Siemens Ag | Hall generator with semiconductor plates stuck to a carrier |
| DE1151859B (en) * | 1957-05-20 | 1963-07-25 | Servomechanismus Inc | Resistance element for a resistance that can be changed by means of a sliding contact and a method for its production |
| DE1157301B (en) * | 1960-08-03 | 1963-11-14 | Werk Fuer Bauelemente Der Nach | Device for the production of resistors by vapor deposition of layers in a vacuum on carrier |
| DE1299752B (en) * | 1962-08-01 | 1969-07-24 | Standard Elektrik Lorenz Ag | Process for the production of metal film resistors |
| DE3631057A1 (en) * | 1986-09-12 | 1988-03-24 | Preh Elektro Feinmechanik | METHOD FOR PRODUCING NON-LINEAR RESISTANCE TRACKS AND ROTATION POTENTIOMETER PRODUCED BY THIS METHOD |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE1490927C3 (en) | Process for the production of a layer resistance element using tantalum metal | |
| DE3785946T2 (en) | SEMICONDUCTOR COMPONENT MADE OF POSITIVE CERAMIC. | |
| CH626468A5 (en) | ||
| DE878236C (en) | High resistance | |
| DE1590768C3 (en) | Process for the production of a coherent thin, metal-conductive resistance layer on an insulating support body | |
| DE4026061C1 (en) | ||
| DE2307322B2 (en) | Varistor | |
| DE1465205C3 (en) | Resistance element | |
| DE3543586C2 (en) | ||
| DE1648209A1 (en) | Indirectly heated thermistor | |
| DE1665426A1 (en) | Ohmic resistance and process for its manufacture | |
| DE1275221B (en) | Process for the production of an electronic solid state component having a tunnel effect | |
| CH224046A (en) | Voltage dependent resistance. | |
| DE1764477B1 (en) | CERAMIC CAPACITOR | |
| DE812379C (en) | Process for the production of thin coherent surface layers made of precious metal, especially silver and gold | |
| DE1790082B2 (en) | METAL FILM RESISTANT ELEMENT AND METHOD OF MANUFACTURING IT | |
| DE702898C (en) | ||
| AT145746B (en) | Resistors for high-frequency currents produced by sputtering metal alloys from cathodes of different metals that are brought into action at the same time on insulating substrates. | |
| DE738529C (en) | Process for the production of metallic short-circuit and start-up wedges for adjustable wireless resistors or potentiometers | |
| DE2814010C2 (en) | Potted voltage multiplier cascade made up of capacitors and diodes | |
| DE4139908A1 (en) | SEMICONDUCTOR ARRANGEMENT WITH METAL LAYER SYSTEM AND METHOD FOR PRODUCTION | |
| DE2741553A1 (en) | CHANGEABLE ELECTRICAL COMPONENT | |
| AT231010B (en) | Adjustable semiconductor resistance | |
| DD132090B1 (en) | METHOD FOR THE PRODUCTION OF ELECTRODES IN CERAMIC CAPACITORS | |
| DE1953039A1 (en) | Thin-film resistor for measuring instruments that can be changed by a grinder |