DE8130512U1 - CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES - Google Patents
CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODESInfo
- Publication number
- DE8130512U1 DE8130512U1 DE19818130512 DE8130512U DE8130512U1 DE 8130512 U1 DE8130512 U1 DE 8130512U1 DE 19818130512 DE19818130512 DE 19818130512 DE 8130512 U DE8130512 U DE 8130512U DE 8130512 U1 DE8130512 U1 DE 8130512U1
- Authority
- DE
- Germany
- Prior art keywords
- clip
- transistors
- diodes
- coolers
- fastening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000639 Spring steel Inorganic materials 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 6
- 238000002955 isolation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 210000003746 feather Anatomy 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Die !feuerung betrifft eiz» Clip zur Befestigung von Kußlblechen an Transistoren und D'.oden mit mindestens einer ebenen, zur Wär- The fire concerns a clip for attaching kiss plates to transistors and D'.oden with at least one flat, for heating
% % meabfuhr geeigneten Fläche. Speziell für Halbleiterbauelementesuitable area for drainage. Especially for semiconductor components ;■ im' TO-220-Gehäuse oder ähnlichen Gehäusen.; ■ in the 'TO-220 housing or similar housing.
ρ In der Elektronik werden mit zunehmender Miniaturisierung der Bauelemente, insbesondere der Halbleiterbauelemente der Leistungselektronik Mittel benötigt, um die nach wie vor entstehen- de Verlustwärme der Bauelemente an die Umwelt abzugeben. In der Re^sI geschieht das durch geeignete Kühlkörper. ρ In electronics, with increasing miniaturization of the components, in particular the semiconductor components of power electronics, means are required in order to dissipate the heat loss that the components still generate into the environment. In the Re ^ sI this happens through suitable heat sinks.
( ) Um die auf einer Leiterkarte bereits eingelöteten Bauelemente rasch mit einer Kühlfläche zu verbinden, werden Clips oder cliptare Kühlkörper verwendet.( ) Clips or clip-on heat sinks are used to quickly connect the components already soldered on a circuit board to a cooling surface.
Es sind Clips bekannt, die es gestatten, das Bauelement z.B. einen Transistor im TO-220-Gehäuse an seiner Kühllasche, die in der Regel auch ein Loch zum Anschrauben aufweist, an eine geeignete Gehäusewand anzuclippen.Clips are known which allow the component, e.g. a transistor in the TO-220 housing, to be attached to its cooling tab, which is shown in usually also has a screw hole to clip onto a suitable housing wall.
Nachteilig ist bei diesen Clips, daß man Löcher zum Einrasten der Clips benötigt, die ziemlich genau dort sitzen müssen, wo sich auch das zu kühlende Bauelement befindet, was bei eingelöteten Bauelementen oft schwer ist. Außerdem lassen sich diese Clips nur schwer handhaben.The disadvantage of these clips is that you need holes for the clips to snap into place, which must be located pretty much exactly where is also the component to be cooled, which is soldered Components is often heavy. In addition, these clips are difficult to handle.
Der Neuerung liegt deshalb äie Aufgabe zugrunde, einen Clip zu schaffen, der ohne Kraftanstrengung zu montieren bzw. zu demontieren ists und an die Genauigkeit der Höhenlage des Bauelementes nur geringe Anforderungen stellt und das an ein Gehäuseoder Chassisblech anclipbar ist.The innovation is therefore based on the task of creating a clip that can be mounted or dismantled without exertion s and makes only minor demands on the accuracy of the height of the component and which can be clipped onto a housing or chassis plate.
Die Aufgabe wird neuerungsgemäß ' dadurch gelöst, daß ein Federjt blech verwendet wird, das nur mit seinem federnden Ende auf das Bauelement drückt und es dadurch gegen die Kühlfläche preßt. Haben das zu kühlende Bauelement und das zur Wärmeableitung benutzte Blech wenigstens eine gemeinsame Kante und stehen unmittelbar zusammen, d.h. das Bauelement am Rande der Platine, wird das Federblech in der Art einer Klammer zusammengebogen. Sind keine gemeinsamen Kanten vorhanden, bleibt die Feder ausgestreckt The object is achieved according to the invention in that a spring sheet is used which only presses with its resilient end on the component and thereby presses it against the cooling surface. If the component to be cooled and the sheet metal used for heat dissipation have at least one common edge and are directly together, ie the component at the edge of the board, the spring steel sheet is bent together like a clip. If there are no common edges, the feather will remain extended
** lllltft*!'lllltft *! '
und kann entweder mit dem'kiihlblefch' läsbär'öder unlösbar verbunden werden. In beiden Fällen kann das gleiche Stanzteil ver wendet werden.and can either be inextricably linked with the 'kiihlblefch' läsbär'öder will. The same stamped part can be used in both cases.
Der Vorteil der Neuerung liegt in der vielseitigen Verwendbarkeit eines einfach formbaren Federelementes.The advantage of the innovation lies in the versatility of an easily malleable spring element.
An einem Ausführungsbeispiel soll die Neuerung kurz erläutert werden. The innovation will be briefly explained using an exemplary embodiment.
Die zugehörigen Zeichnungen zeigenThe accompanying drawings show
Fig. 1 Clips auf Kühlblech aufgepunktet Fig. 2 Clip als Klammer verwendet
Fig. 3 Gleichrichter angeclipt.Fig. 1 clips punctured on cooling plate Fig. 2 clip used as a clamp
Fig. 3 clip on rectifier.
In Fig. 1 sind die Clips auf einem Kühlblech 1 auf gepunktet. Sind die Potentiale der leitenden Rückwände der Transistoren 3 unterschiedlich, müssen herkömmliche Isolationsbuchsen und Isolationsscheiben verwendet werden.In Fig. 1, the clips on a cooling plate 1 are dotted. Are the potentials of the conductive back walls of the transistors 3 different, conventional isolation bushings and isolation washers must be used.
In Fig. 2 ist das Clip 2 als Klammer zugebogen und dadurch verwendbar, wenn die zur Kühlung benutzte Gehäusewand und der Tran sistor 3 mindestens eine gemeinsame Kante haben.In Fig. 2 the clip 2 is bent closed as a clip and can therefore be used, if the housing wall used for cooling and the Tran sistor 3 have at least one common edge.
Ίι" ί '· Ίι "ί '· ·· <<
Il ItIIIl ItII
Verwendete BezeichnungenTerms used
1 - Kühlkörperblech1 - heat sink sheet
2 - Clip, gestrechkt2 - clip, stretched
3 - Transistor3 - transistor
4 - Gehäusewand4 - housing wall
5 - Klammerclip5 - clip clip
6 - Platine6 - circuit board
7 - Gleichrichter7 - rectifier
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19818130512 DE8130512U1 (en) | 1981-10-19 | 1981-10-19 | CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19818130512 DE8130512U1 (en) | 1981-10-19 | 1981-10-19 | CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE8130512U1 true DE8130512U1 (en) | 1982-06-16 |
Family
ID=6732228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19818130512 Expired DE8130512U1 (en) | 1981-10-19 | 1981-10-19 | CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE8130512U1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3236262A1 (en) * | 1982-09-30 | 1984-04-05 | Siemens AG, 1000 Berlin und 8000 München | Arrangement for cooling electrical assembly magazines |
| EP0124715A1 (en) * | 1983-05-09 | 1984-11-14 | International Business Machines Corporation | Clip-fastening of a solid state device to a heatsink |
| DE3331207A1 (en) * | 1983-08-30 | 1985-03-07 | Robert Bosch Gmbh, 7000 Stuttgart | Assembly for electronic controllers |
| FR2581250A1 (en) * | 1985-04-26 | 1986-10-31 | Sgs Microelettronica Spa | Apparatus and method for establishing a thermal link between a semiconductor package and the cooling plate and an electrical link between the conductors of the package, and a printed circuit board. |
| DE3703088A1 (en) * | 1987-02-03 | 1988-08-11 | Vdo Schindling | Housing for accommodating at least one printed circuit board |
| DE4218224A1 (en) * | 1992-06-03 | 1993-12-09 | Asea Brown Boveri | Slip-free spring clip - esp. used for fastening semiconductor device to heat sink |
| DE102010035170A1 (en) * | 2010-08-23 | 2012-02-23 | Marquardt Verwaltungs-Gmbh | Electrical switch for rechargeable battery of network electric power tool, has free-wheeling diode having component housing with flat surface which is in direct thermal and/or electrical contact with heat sink |
-
1981
- 1981-10-19 DE DE19818130512 patent/DE8130512U1/en not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3236262A1 (en) * | 1982-09-30 | 1984-04-05 | Siemens AG, 1000 Berlin und 8000 München | Arrangement for cooling electrical assembly magazines |
| EP0124715A1 (en) * | 1983-05-09 | 1984-11-14 | International Business Machines Corporation | Clip-fastening of a solid state device to a heatsink |
| DE3331207A1 (en) * | 1983-08-30 | 1985-03-07 | Robert Bosch Gmbh, 7000 Stuttgart | Assembly for electronic controllers |
| FR2581250A1 (en) * | 1985-04-26 | 1986-10-31 | Sgs Microelettronica Spa | Apparatus and method for establishing a thermal link between a semiconductor package and the cooling plate and an electrical link between the conductors of the package, and a printed circuit board. |
| DE3703088A1 (en) * | 1987-02-03 | 1988-08-11 | Vdo Schindling | Housing for accommodating at least one printed circuit board |
| DE4218224A1 (en) * | 1992-06-03 | 1993-12-09 | Asea Brown Boveri | Slip-free spring clip - esp. used for fastening semiconductor device to heat sink |
| DE102010035170A1 (en) * | 2010-08-23 | 2012-02-23 | Marquardt Verwaltungs-Gmbh | Electrical switch for rechargeable battery of network electric power tool, has free-wheeling diode having component housing with flat surface which is in direct thermal and/or electrical contact with heat sink |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69400254T2 (en) | Low force spring mount for a heat sink for an electronic component | |
| EP0873673B1 (en) | Control device consisting of at least two housing sections | |
| DE4428170A1 (en) | Arrangement of spring clip and heat sink | |
| DE9016732U1 (en) | Electrical device, in particular switching and control devices for motor vehicles | |
| DE3331207C2 (en) | ||
| DE10148623B4 (en) | Device and arrangement for fastening a profile part to a mounting rail | |
| DE8130512U1 (en) | CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES | |
| DE9213671U1 (en) | Housing for an electronic circuit arrangement | |
| EP0141262B1 (en) | Device for attaching a cooling member to the cooling face of an integrated component | |
| DE3440334C2 (en) | ||
| DE2829119C2 (en) | Potential-free cooler for a converter device that can be installed in a control cabinet | |
| DE8516915U1 (en) | Heat sink for cooling a semiconductor component | |
| EP0652694A1 (en) | Control apparatus particularly for vehicle | |
| DE102006061215A1 (en) | Power electronics with heat sink | |
| DE19603368C2 (en) | High frequency sealed box housing for electronic measuring devices | |
| DE8812158U1 (en) | Cooling device for transistors | |
| DE3603714A1 (en) | Heat sink for thermally dissipating electric assemblies | |
| DE3505085A1 (en) | Power semiconductor module having a plastic housing | |
| DE2625456A1 (en) | Vehicle generator voltage control device - has at least two SC components in case with resiliently supported lid | |
| DE7911538U1 (en) | Housing for accommodating assembled printed circuit boards, in particular for controlling industrial processes | |
| DE9206934U1 (en) | Device for attaching components to heat sinks | |
| DE8432343U1 (en) | DEVICE FOR ATTACHING A SEMICONDUCTOR COMPONENT TO A HEAT SINK | |
| EP1744611A2 (en) | Cooling device particularly for elelectronic controller | |
| DE202016100007U1 (en) | cooling module | |
| DE2216162A1 (en) | HEAT SINK FOR A SEMI-CONDUCTOR DEVICE |