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DE8130512U1 - CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES - Google Patents

CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES

Info

Publication number
DE8130512U1
DE8130512U1 DE19818130512 DE8130512U DE8130512U1 DE 8130512 U1 DE8130512 U1 DE 8130512U1 DE 19818130512 DE19818130512 DE 19818130512 DE 8130512 U DE8130512 U DE 8130512U DE 8130512 U1 DE8130512 U1 DE 8130512U1
Authority
DE
Germany
Prior art keywords
clip
transistors
diodes
coolers
fastening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19818130512
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gardena Praezisionstechnik 7907 Niederstotzingen De GmbH
Original Assignee
Gardena Praezisionstechnik 7907 Niederstotzingen De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gardena Praezisionstechnik 7907 Niederstotzingen De GmbH filed Critical Gardena Praezisionstechnik 7907 Niederstotzingen De GmbH
Priority to DE19818130512 priority Critical patent/DE8130512U1/en
Publication of DE8130512U1 publication Critical patent/DE8130512U1/en
Expired legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

Clip zur Befestigung vonClip for attaching Kühlblechen an Transistoren und DiodenHeat sinks on transistors and diodes

Die !feuerung betrifft eiz» Clip zur Befestigung von Kußlblechen an Transistoren und D'.oden mit mindestens einer ebenen, zur Wär- The fire concerns a clip for attaching kiss plates to transistors and D'.oden with at least one flat, for heating

% % meabfuhr geeigneten Fläche. Speziell für Halbleiterbauelementesuitable area for drainage. Especially for semiconductor components ;■ im' TO-220-Gehäuse oder ähnlichen Gehäusen.; ■ in the 'TO-220 housing or similar housing.

ρ In der Elektronik werden mit zunehmender Miniaturisierung der Bauelemente, insbesondere der Halbleiterbauelemente der Leistungselektronik Mittel benötigt, um die nach wie vor entstehen- de Verlustwärme der Bauelemente an die Umwelt abzugeben. In der Re^sI geschieht das durch geeignete Kühlkörper. ρ In electronics, with increasing miniaturization of the components, in particular the semiconductor components of power electronics, means are required in order to dissipate the heat loss that the components still generate into the environment. In the Re ^ sI this happens through suitable heat sinks.

( ) Um die auf einer Leiterkarte bereits eingelöteten Bauelemente rasch mit einer Kühlfläche zu verbinden, werden Clips oder cliptare Kühlkörper verwendet.( ) Clips or clip-on heat sinks are used to quickly connect the components already soldered on a circuit board to a cooling surface.

Es sind Clips bekannt, die es gestatten, das Bauelement z.B. einen Transistor im TO-220-Gehäuse an seiner Kühllasche, die in der Regel auch ein Loch zum Anschrauben aufweist, an eine geeignete Gehäusewand anzuclippen.Clips are known which allow the component, e.g. a transistor in the TO-220 housing, to be attached to its cooling tab, which is shown in usually also has a screw hole to clip onto a suitable housing wall.

Nachteilig ist bei diesen Clips, daß man Löcher zum Einrasten der Clips benötigt, die ziemlich genau dort sitzen müssen, wo sich auch das zu kühlende Bauelement befindet, was bei eingelöteten Bauelementen oft schwer ist. Außerdem lassen sich diese Clips nur schwer handhaben.The disadvantage of these clips is that you need holes for the clips to snap into place, which must be located pretty much exactly where is also the component to be cooled, which is soldered Components is often heavy. In addition, these clips are difficult to handle.

Der Neuerung liegt deshalb äie Aufgabe zugrunde, einen Clip zu schaffen, der ohne Kraftanstrengung zu montieren bzw. zu demontieren ists und an die Genauigkeit der Höhenlage des Bauelementes nur geringe Anforderungen stellt und das an ein Gehäuseoder Chassisblech anclipbar ist.The innovation is therefore based on the task of creating a clip that can be mounted or dismantled without exertion s and makes only minor demands on the accuracy of the height of the component and which can be clipped onto a housing or chassis plate.

Die Aufgabe wird neuerungsgemäß ' dadurch gelöst, daß ein Federjt blech verwendet wird, das nur mit seinem federnden Ende auf das Bauelement drückt und es dadurch gegen die Kühlfläche preßt. Haben das zu kühlende Bauelement und das zur Wärmeableitung benutzte Blech wenigstens eine gemeinsame Kante und stehen unmittelbar zusammen, d.h. das Bauelement am Rande der Platine, wird das Federblech in der Art einer Klammer zusammengebogen. Sind keine gemeinsamen Kanten vorhanden, bleibt die Feder ausgestreckt The object is achieved according to the invention in that a spring sheet is used which only presses with its resilient end on the component and thereby presses it against the cooling surface. If the component to be cooled and the sheet metal used for heat dissipation have at least one common edge and are directly together, ie the component at the edge of the board, the spring steel sheet is bent together like a clip. If there are no common edges, the feather will remain extended

** lllltft*!'lllltft *! '

und kann entweder mit dem'kiihlblefch' läsbär'öder unlösbar verbunden werden. In beiden Fällen kann das gleiche Stanzteil ver wendet werden.and can either be inextricably linked with the 'kiihlblefch' läsbär'öder will. The same stamped part can be used in both cases.

Der Vorteil der Neuerung liegt in der vielseitigen Verwendbarkeit eines einfach formbaren Federelementes.The advantage of the innovation lies in the versatility of an easily malleable spring element.

An einem Ausführungsbeispiel soll die Neuerung kurz erläutert werden. The innovation will be briefly explained using an exemplary embodiment.

Die zugehörigen Zeichnungen zeigenThe accompanying drawings show

Fig. 1 Clips auf Kühlblech aufgepunktet Fig. 2 Clip als Klammer verwendet
Fig. 3 Gleichrichter angeclipt.
Fig. 1 clips punctured on cooling plate Fig. 2 clip used as a clamp
Fig. 3 clip on rectifier.

In Fig. 1 sind die Clips auf einem Kühlblech 1 auf gepunktet. Sind die Potentiale der leitenden Rückwände der Transistoren 3 unterschiedlich, müssen herkömmliche Isolationsbuchsen und Isolationsscheiben verwendet werden.In Fig. 1, the clips on a cooling plate 1 are dotted. Are the potentials of the conductive back walls of the transistors 3 different, conventional isolation bushings and isolation washers must be used.

In Fig. 2 ist das Clip 2 als Klammer zugebogen und dadurch verwendbar, wenn die zur Kühlung benutzte Gehäusewand und der Tran sistor 3 mindestens eine gemeinsame Kante haben.In Fig. 2 the clip 2 is bent closed as a clip and can therefore be used, if the housing wall used for cooling and the Tran sistor 3 have at least one common edge.

Ίι" ί Ίι "ί ·· <<

Il ItIIIl ItII

Verwendete BezeichnungenTerms used

1 - Kühlkörperblech1 - heat sink sheet

2 - Clip, gestrechkt2 - clip, stretched

3 - Transistor3 - transistor

4 - Gehäusewand4 - housing wall

5 - Klammerclip5 - clip clip

6 - Platine6 - circuit board

7 - Gleichrichter7 - rectifier

Claims (1)

SchutzanspruchClaim to protection 1. Clip zur Befestigung von Kühlkörpern an Transistoren und Dioden mit mindestens einer ebenen Fläche dadurch gekennzeichnet, daß ein aus einem im wesentlichen reohteckförmigen Federstahl gebogenes Federelement dadurch eine dreiseitige Umklammerung ergibt, daß es mit dem einen angephasten Ende auf der ebenen Fläche des zu kühlenden Bauelementes aufliegt, während das anders Ende durch geeignete Biegung oder durch Verbindung mit dem Kühlkörper das gegenüberliegende Gegenlager bildet.1. Clip for attaching heat sinks to transistors and diodes with at least one flat surface, characterized in that a spring element bent from a substantially reohteck-shaped spring steel results in a three-sided clasping that it has a chamfered end on the flat surface of the component to be cooled rests, while the other end forms the opposite counter bearing by suitable bending or by connection to the heat sink.
DE19818130512 1981-10-19 1981-10-19 CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES Expired DE8130512U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19818130512 DE8130512U1 (en) 1981-10-19 1981-10-19 CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19818130512 DE8130512U1 (en) 1981-10-19 1981-10-19 CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES

Publications (1)

Publication Number Publication Date
DE8130512U1 true DE8130512U1 (en) 1982-06-16

Family

ID=6732228

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19818130512 Expired DE8130512U1 (en) 1981-10-19 1981-10-19 CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES

Country Status (1)

Country Link
DE (1) DE8130512U1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3236262A1 (en) * 1982-09-30 1984-04-05 Siemens AG, 1000 Berlin und 8000 München Arrangement for cooling electrical assembly magazines
EP0124715A1 (en) * 1983-05-09 1984-11-14 International Business Machines Corporation Clip-fastening of a solid state device to a heatsink
DE3331207A1 (en) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Assembly for electronic controllers
FR2581250A1 (en) * 1985-04-26 1986-10-31 Sgs Microelettronica Spa Apparatus and method for establishing a thermal link between a semiconductor package and the cooling plate and an electrical link between the conductors of the package, and a printed circuit board.
DE3703088A1 (en) * 1987-02-03 1988-08-11 Vdo Schindling Housing for accommodating at least one printed circuit board
DE4218224A1 (en) * 1992-06-03 1993-12-09 Asea Brown Boveri Slip-free spring clip - esp. used for fastening semiconductor device to heat sink
DE102010035170A1 (en) * 2010-08-23 2012-02-23 Marquardt Verwaltungs-Gmbh Electrical switch for rechargeable battery of network electric power tool, has free-wheeling diode having component housing with flat surface which is in direct thermal and/or electrical contact with heat sink

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3236262A1 (en) * 1982-09-30 1984-04-05 Siemens AG, 1000 Berlin und 8000 München Arrangement for cooling electrical assembly magazines
EP0124715A1 (en) * 1983-05-09 1984-11-14 International Business Machines Corporation Clip-fastening of a solid state device to a heatsink
DE3331207A1 (en) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Assembly for electronic controllers
FR2581250A1 (en) * 1985-04-26 1986-10-31 Sgs Microelettronica Spa Apparatus and method for establishing a thermal link between a semiconductor package and the cooling plate and an electrical link between the conductors of the package, and a printed circuit board.
DE3703088A1 (en) * 1987-02-03 1988-08-11 Vdo Schindling Housing for accommodating at least one printed circuit board
DE4218224A1 (en) * 1992-06-03 1993-12-09 Asea Brown Boveri Slip-free spring clip - esp. used for fastening semiconductor device to heat sink
DE102010035170A1 (en) * 2010-08-23 2012-02-23 Marquardt Verwaltungs-Gmbh Electrical switch for rechargeable battery of network electric power tool, has free-wheeling diode having component housing with flat surface which is in direct thermal and/or electrical contact with heat sink

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