DE7540879U - ELECTRICAL CONNECTING DEVICE - Google Patents

Description

DlPL ING KLAUS BEhN DIPL PHVS ROBERT MUNZHUBER

PATENT LAWYERS

S MUNICHEN 32 WIOENMAYERSTR "SSE 6 TEL> 089i 22 25 30 39 5192

22nd December 1975

A 262 75 Be / De

CHOMERICS, INC., 77 Dragon Court, Woburn , Massachusetts,

USA.

Electrical connection device

The invention relates to a circuit board or a circuit board made of a new and improved homogeneous material, with a first circuit pattern element on one side being softer or a plurality of circuit pattern elements are arranged through the circuit board or the circuit board are in electrical contact therethrough with contacts or other isolated circuitry pattern with the surface the other side of the plate are in connection, the connection being made through the plate at the points at which electrically conductive elements on the opposite parts of the plate cross or lie on top of one another.

The plate or board according to the invention includes one

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Merck banking house. Finck & Co .. Munich. No. 25464 I Sankhaus H. Aufhäuser. Munich. No. 261300 Poslacheck: Munich 10804 DOO

Telegram address - potential synonym

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k β 1 i > β J t 4 «

Binder, e.g. made of plastic, in which electrically conductive particles are evenly distributed.

So far, one has to produce a contact of elements on one side of a circuit board to circuit elements on the other side of the board or solder lugs similar arrangements are used extending from one surface of the plate to the opposite surface to have.

The invention avoids such direct connections, in that the plate has a low volume resistance between one above the other, but on opposite sides Contacts arranged on the sides, e.g. of grids or other circuit patterns, which are on opposite surfaces adhesive contacts are applied by electrically conductive color samples or by galvanization.

At the same time, the plate according to the invention enables on the same side of the plate and in contact with this to attach isolated contacts, which also remain isolated from each other if they have a predetermined

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I i *

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Maintain isolation distance from each other.

According to the invention it is only necessary that the contacts touch the plate while compressing the volume of the plate or board between opposing ones Contacts, in order to bring electrically conductive parts into contact with one another, is not necessary in order to have an electrical To achieve conduction or a low volume resistance, for example, electrical contacts only need to both j Sides of the plates are applied so that an electrical Conduction from one side of the board to the other side occurs in locations where the circuit pattern is on opposite sides cross or lie one on top of the other |

The circuit board according to the invention can be referred to as an insulation board which has a low volume resistance in a volume between contacts lying one above the other on opposite surfaces, but which has a higher insulation resistance in all volumes at a distance greater than approximately the thickness of the plate is. Thus, electrical contacts, e.g., circuit pattern parts, are separated from one another on the same side of the Plate are arranged, electrically isolated from each other when their distance from each other (insulation distance) about the

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Thickness of the plate corresponds. This is also the case if another contact is on the opposite side the plate is opposed to a contact part of a circuit pattern on the other side and with this via a Low resistance part of the plate is electrically connected.

Due to the above-mentioned properties of the plate according to the invention, it is now possible to use an 'electrically conductive Establish connection between a plurality of superimposed contacts of a first circuit pattern and a second circuit pattern, which adhere to the plate and are in Surface contact with this. An electrical connection can also be established between different Elements of a circuit pattern and the contacts of an electrical device that are only in electrical surface contact with the opposite side of the board, the elements of the circuit pattern on the other Side of the plate but opposite.

The invention consists in its preferred embodiment from a plate or layer of a material consisting of a homogeneous mixture of a binder and electrical conductive particles, this plate at least

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on one side a circuit pattern in electrical contact with its surface. When attaching a first contact to the surface of the opposite one Side of the board in alignment with part of the circuit pattern on the other side of the board is the volume resistance between the volume of the plate between the part of the circuit pattern on one side of the plate and the first contact on the other side of the plate opposite to each other as low, e.g. lower than 1000 ohms, preferably less than 100 to 200 ohms and suitably less than one ohm as is necessary for an electrical connection of the circuit pattern part with the contact is required.

In addition, if a second contact, as mentioned above, is placed on the same material at a second point near the first contact, but not opposite the circuit pattern part, ie at a distance or a thickness greater than the thickness of the plate, e.g. Distance, which corresponds to five times the thickness of the plate, the resistance between the first-mentioned contact and the second-mentioned Xontakt remains high, namely higher than 10 ^ ohms, preferably greater than 10 'ohms, in most cases greater than 10 * ⁷ ohms, which means that the first and the

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second contacts are electrically isolated from one another, wherein
the second contact also from the circuit pattern part
is electrically isolated.

The thickness of the plate or layer of the aforesaid

Material is preferably between 0.025 and 2.5 ² lmn,

a thickness between 0.05 and 1 mm being preferred and

it is best to choose a thickness of 0.25 to 0.76 mm. j

If the material gets too thick, it becomes too expensive. If the j

\ On the other hand, if material becomes too thin, it is difficult to handle, i

since it does not have sufficient physical strength. |

The invention discloses the use of electrically conductive \

the powder or electrically conductive particles to produce i the above-mentioned electrical connection effect and j

1 the isolation between the circuit particles. ^!

The term "electrical" used in the specification
conductive powder "or" electrically conductive particles "
Metal powder and also coated or covered with metal
Particles such as glass or ceramic or other
conductive material or cores made of insulating material,
that is covered or coated with a layer of metal
is or from other electrically conductive particles, such as

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for example titanium carbide.

Precious metals, such as silver and gold, or other metals, such as copper and nickel, or any are best Combinations such as silver coated copper are used.

In terms of volume percent, the conductive powder or particles should be in the plate or material layer less than 20 volume percent to about 0.05 volume percent, preferably 9 to 18 volume percent. the The proportion should preferably be 0.05 to 11 percent by volume when metal-covered insulation cores are used. The term percent by volume means the volume of the plate, with only the binder and the electrically conductive Part of the powder; or the particles, e.g. the metal covering the glass or the metal itself.

If coated particles are used, the insulation core is to be assigned to the binder for the determination of the metal content in percent by volume. For example, if the Plate contains binders corresponding to 70 percent by volume and glass cores coated with silver are used, whereby the amount of silver in the plate 0.09 volume percent and

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the core is 29.91 volume percent of the entire plate, the amount of metal (silver) is apparently 0.09 Volume percentage of the entire plate, i.e. the sum of the binder, the glass cores and the silver.

While various irregularly shaped particles can be used, so will the practice of the invention it is preferred that the particles be substantially spherical in shape.

In addition, the particle size is in the form of its maximum dimension preferably between 0.005 to 2.3mm, depending on the plate thickness, and the particle size should be smaller than the thickness of the plate or the material layer, so that the particles do not extend above or below the surfaces of the plate or layer of material.

For example, with a plate thickness of 0.5 µm, the particles should have a size of about 0.25 ² l- (about 250 microns). It is also highly desirable in the practice of the invention that the particle size distribution be kept to a minimum, with a variation of $ 20 or less being preferred.

The binder materials suitable for practicing the invention include flexible insulating materials such as

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thermosetting resins, thermoplastic resins and elastomers. The term "plastic" used in the specification also includes elastomers such as rubber.

Examples of such materials are e.g. silicone rubber, ethylene-propylene polymer, Buna-N (nitrile rubber), polyurethane rubber, styrene-butadiene rubber, natural rubber, neoprene rubber, polyethylene, Polypropylene, vinyl chloride and acrylics, e.g., polyethylene methyl acrylate or Polyäthylmethylacryläureester.

For the implementation of the invention, the plate is preferably between 0.025 mm and 2.5 ^ mm thick, preferably lies the thickness between 0.05 and 1mm, e.g. 0.15mm.

In addition, the invention does not include the use of fillers, plasticizers, catalysts, accelerators, Pigments, smoothing agents, such as those commonly used in electrical conductive plastics or elastomers, such as silicon dioxide (sil-i ca (useful for the mechanical binding properties)

av'5,
as long as these materials are the desired ones

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Adversely affect properties of the connecting device.

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It should be noted that the electrical connection device according to the invention is not necessarily shown in
Must be plate shape so that it can take many other physical shapes, e.g. wedge-shaped, step-shaped

mig or other shapes as long as the device is in the open j works hard way, j

For example, the device can have guide ribs, projections ί

etc. contain the device in particular for a j

make special function suitable. In addition, the advance ι direction over their length or over another dimension

vary in thickness, if so desired, cf.

The circuit pattern according to the invention can have conductive]

Layers, electrically conductive color samples or metal samples I (eg lines) contain that are directly on the plate; stick to the surface or indirectly via an electrical
conductive adhesive bonded to the surface.

The electrically conductive paints or coatings can
include plastics filled with electrically conductive particles. The circuit patterns can be sprayed on, printed on

Way ι

or be applied in any other customary. j

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I I 1 J J 4 (

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The invention is based on the drawing below Exemplary embodiments explained in more detail. In the drawing indicates:

Fig. 1: a plan view of a plate according to the invention or layer, dxejkls coupling is used where-. circuit pattern on both sides of the other plate be liable,

FIG. 2: a section along the line 2-2 in FIG. 1, FIG. 5: a plan view of the coupling of an electrical one Device to a plate with multiple circuit patterns,

Fig. 4: a section along the line 4-4 in Fig. 5, 5: a view from below of the various switching elements load-bearing plate,

FIG. 6: a section along the line 6-6 in FIG. 5, FIG. 7: a plan view of the circuit board according to FIG keypad using the invention,

8: a view from below of the keys of the keypad, which carries an adhesive circuit pattern which forms contacts,
FIG. 9: a view from below of a plate which carries a so-holding pattern and which is used to produce a

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Godes is used
FIG. 10: a section along the line 9-9 in FIG. 6,

the key not being pressed in, Flg. 11: a view according to FIG. 10, but with the key

is depressed
12: a plan view of a digital clock in which the circuit board according to the invention is used,

Fig. 13: a section along the line 13-13 in Fig. 12, Fig. 1K: a view from below showing the circuit pattern elements carried by this plate.

indicates,
Figure 15 is a bottom plan view showing the components of the clock mounted on the board and connected to the circuit pattern elements

are,
Fig. L6: a plan view of the bottom of the watch case, which carries the components,

17: a section along the line 17-17 in FIGS Fig. 18: a view from below of the display for the clock.

Figures 1 and 2 show the plate or sheet according to the invention. the two circuit patterns applied are. A circuit pattern 21 on one side of the board

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contains five lines or paths of electrically conductive paint spaced apart from one another by a distance approximately equal to twice the plate thickness. A second circuit pattern 24 is on the opposite one Side of the board in the same way as the first circuit pattern.

As can be seen, parts of each circuit pattern lie on top of one another at * 'points a through e. So it arises there

a through path at points a through e between the circuit patterns 21 and 24, at the points on opposite sides The sides of the plate lie one above the other.

Incidentally, since each of the circuit pattern lines are spaced apart from each other by a distance greater than about the thickness of the plate, they are not closed very briefly, but are only connected to one another where they lie on top of one another.

An extended connection of the circuit pattern 21 is made through the connector 22 by pins? 3, and becomes a external connection of the circuit pattern 24 via the connector 25 brought about by pins 26.

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The arrangement according to the pig. 1 and 2 is thus a device for connection of an electrical assembly with another using a plate, welc \ e träg't on opposite sides circuit pattern. It

Current flows through each of the elements of the Schp.ltLngsmuster 21 through the volume of the plate into the elements of the circuit pattern 24, namely at the points where the elements of the circuit pattern 24 on opposite sides of the board over the elements or portions of the circuit pattern 21 couches (parts a to e).

In order to obtain a low volume resistance between the superimposed elements of the circuit pattern, no pressure has to be applied to the plate and spaced elements or diagonally superposed elements of each circuit pattern remain isolated from one another. Typically, the insulation resistance between the elements of each circuit pattern is greater than about ^3/4 ohms. The element 21a is isolated from the adjacent elements 21b to 21e as well as from the elements 24b to 24e, and the elements 21a and 24a are connected to one another at the point where they cross one another.

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The Pig. 3 through 6 disclose the use of the circuit board of the invention for connecting the contacts 31 of an electrical device J> 0 to electrically conductive circuit pattern elements 34 adhered to the board 33. The elements 3 ′ + are connected with pins 3C which are held in a holder 35. The assembly is held together by support 33 and an insulating plastic base 37 supports the circuit board.

Figures 7-11 show a keypad embodying the invention. The keypad is indicated at 39 and includes a frame 40 which has a top plate 41 or a top layer 4l made of flexible and elastic plastic, for example a.us Mylar, in which snap-on protrusions are provided, as described in US Pat. No. 3,868,771. The bottom of the top plate or layer 4l is provided with an electrically conductive plastic coating 42, which are connected to one another via circuit lines 43 are (see U.S. Patent 3,860,771) with a pen 48-1 of several pins 48-1 to 48-7 are connected. The pins 48-1 to 48-7 are in a holder 47 of the same Arranged in the manner shown in FIG.

The circuit board according to the invention is denoted by 44

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and has contact segments 45 * through the bottom Circuit pattern elements 46 are connected to one another or to pins 48-1 through 48-7. The circuit pattern elements and the segments can be sprayed or vapor-deposited and have, for example, a thickness of about 0.05 mm, and the elements can have a width of approximately 2 mm, the segments having a width of approximately 3.8 mm able to make a good bond with the indentable coating 42 to ensure when the pinger impresses the projection 4l-l, as shown in Fig. 11, wherein the Projection is pressed against the top of the underlying plate, which extends over the one on the other side of the Plate located segments 45 is located.

If the coating 42 makes surface contact between the top surface 44-1 of the panel, there is a low resistance between segments 45, and it can this conduction takes place between the common pin 48-1 and the outer pins 48-2 through 48-7, depending of which of the projections 4l-l is imprinted.

12 to 18 show a modification for use in a digital clock for the connection of coupled components, such as integrated circuit boards, batteries with

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■ '! I ^ aBi!

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ΐ a display such as a liquid crystal display.

In the drawing, the clock is labeled 50, and she : is connected to a band 52. The clock includes an upper

■ housing 51 »e.g. made of plastic, which is placed in a floor housing

¹ 55 engages, which is usually made of plastic,

With 55 iäb a liquid crystal display referred to, the

) several electrically conductive blocks 55-1 to 55-8 on both

, · Has the sides (see US Pat. No. 5,861,135).

! The bottom housing 53 carries two integrated circuit

] plates 57 and 58 (Fig. 17), which with the liquid crystal

! display blocks 55-1 through 55-8 are connected. The integrating

! th circuit dies comprise electrically conductive blocks

j 57-1 and 58-1 along the sides. The battery is at 59

j denotes and contains a housing contact element 59-1,

j which has a clamp, and an upper clamp 59-2.

^f The battery terminals ^ 59-1 and 59-2 are with the plates

58 and 59 connected by end blocks 57-2 and 58-2 (compare Fig. 16). The plates 57,58 and the battery 59 are contained in bores 53-1 and are preferably by resilient Biasing elements, for example springs 53-2, pushed upwards to ensure good contact with tolerance

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to ensure discrepancies in the plates or the battery. A resilient rubber block can be used in place of the spring will.

The display 55 and the integrated circuit dies (IC) 57 and 58 are through circuit elements 56-1 to 56-8 connected to each other, which are arranged on the bottom surface of the plate 56. The elements can, as described above,

be sprayed on or vaporized.

14 shows the integrated circuit chips (IC) 57 and 58 and the battery 59 on the surface of the bottom plate 56 with the blocks 57-1, 57-2, 58-1, 58-2, terminals 59-1 and 59-2, which make contact with circuit elements 56-1 through 56-8 (on both sides of the board) and circuit elements 56-2 to 56-3. That way it becomes a direct one Contact established; through the integrated circuits, and the battery 59 supplies power to the integrated circuits Circuits.

Contact is made to contact blocks 55-1 through 55-8 on either side of display 55 through plate 56, namely at the points where elements 56-1 to 56-8 and 55-1 to 55-8 are one above the other (Fig. 13). It is

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it goes without saying that elements 55-1 through 55-8 are align themselves with elements 56-1 through 56-8 of the circuit board 56.

In this way, a connection is made between the integrated circuits and the display by means of circuit pattern elements, that of the plate 56 in connection with its surface and of the blocks 55-1 to 55-8 in surface contact with the opposite side of the plate 56 as shown in FIG.

The following now follow examples showing representative compositions of the circuit board, vapor-deposition or spray-on compositions and show a circuit pattern grid on a circuit board.

Example I.

A circuit board or layer is made from: Dow Corning 440 Silicone Rubber - $ 79.83 by volume Cabosil MS 7 vapor-deposited

Silicic acid ⁰ (fumed silica) - 3> 55 volume- ^ Chemalloy UB quality 20/325 - 15.70 volume- #

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Nickel powder (sifted through a

Sieve with 0.1mm mesh size,

¹ J retained by a 0.06mm sieve

clear mesh size) from Chemalloy

, 1 Co. Bryn Mawr, Pa. Varox peroxide catalyst

($ 50 active) - 0.92 vol

The rubber is bonded together in a rubber roller mill at room temperature until a thin wall is created between the rollers. At this time the Varox is added to the silicone gum before it passes through the rollers to get the Varox into the gum. The silica is added in the same way and then the nickel is added. The gum with the added materials is cut periodically as it comes out of the rollers and it is fed back through the rollers until a homogeneous mixture is achieved. Fifteen runs have been determined to be sufficient.

The rollers are spaced apart to produce a plate about 0.64mm thick. The plate is then inserted into a printing form. At a pressure of 280 kg / cm (4000 psi) for 20 minutes at 16 ^ ⁰ C to cure and produce a plate of 0.5 mm. The plate will then

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subsequently to about 200 to 205 ° C for 3 hours
heated to complete curing.

The plate obtained in this way has a thickness of 0.5 mm.
Example II

The procedure of Example I was repeated except that nickel powder was passed through a sieve of 0.15mm and a sieve with a

If. clear mesh size of 0.044mm would be retained. the

The plate produced had a thickness of 0.5 mm.

Example III

The procedure of Example I was repeated except that the following ingredients were used to prepare a Manufacture 0.254mm thick plate under compression after plate formation to 0.38mm.

Dow Corning ViO Silicone Gum - - ^ 0.03 vol .- ^

Cabosil MS 7 vapor-deposited silica - 3.36 vol .- # Varox peroxide catalyst (50 # active) - 0.92
silver-plated copper powder according to
US-PS 3,202 HRH (7.66 vol.; »Silver)

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sifted through a sieve with a mesh size of 0.074 mm.

Example IV

The mixing process according to Example I was used, except that the rollers were heated between about 1 "52 ⁰ C and 150 ⁰ C. A plate with a thickness of 0.38 mm was produced in a printing forme at a pressure of 28 kg / cm ² (4OOpsi) during three Hinuten at 120 ⁰ C, followed by cooling to 54 ° C takes place after a disk formation of 0.5 mm with the following ingredients:

Alathon 14 low density polyethylene

(Dupont) - 47.98 Vol.-

Vistanex L 80 polyisobutylene from the company

Enjay Chemical Co.- 32.32

Chemalloy nickel according to Example I - 19.70

Example V

According to the procedure according to Example I, a 0.5 mm thick plate was produced with the following components:

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Dow Coming 44O silicone gum - 71.27 Cabosil MS 7 vapor-deposited pebbles

acid (fumed GJlica) - 3.17

Verox Peroxide Catalyst ($ 50 active) - 0.82 Vol.-J ^ Silver-plated glass powder No. 24295 from (Potters Brothers, Carlstadt,

N.J.) - 24.65 vol.-Ji glass

0.09 vol-Ji silver

Example VI

The production process according to Example I was carried out with the components specified there, except that the content of nickel was 18.74 Vol, #.

Example VII

The manufacturing process according to Example V was carried out with the components specified there, with the exception of that the content of glass was 14.69 vol. # and that of silver was 0.5.

Example VIII

Electrically conductive grid paint

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General Electric - Silicone RTV 6l5A 3.470 wt -.% General Electric - Silicone RTV 615B 0.3 ^ 0 wt .- ^ General Electric - Silicone RTV 815 to 12.850 percent -.% Handy & Harmon silver powder P-135 to 78.130 wt. - % Propylene glycol 5.210 wt%

100 fo

The ingredients were mixed with one another in the usual way to form a liquid, paste-like substance, which is now is suitable for the application of grids on the plates or layers according to Examples I to VII.

Example IX

Electrically conductive grid paint

A polymeric mixture is made up of 20 parts by weight of General Electric SR-585 adhesive, 80 parts by weight of silver-plated copper powder (granular) corresponding to Example I of US Pat. No. 3,220,488 (mean particle size 0.05 to 0.076 mm) and 30 parts of toluene.

Example X

Applied circuit pattern

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The electrically conductive paint according to Example VIII was applied to a plate according to Example II, namely conventionally using a mask and brush to remove the overlapping circuit patterns 21 and. 24 as shown in Figs.

The lines on elements 21a to 21e and 24a to 24e were approximately 2mm wide and were approximately 2mm thick about 0.05mm. The lines were spaced on the same Surface of about 1 mm.

Other circuit profiles and compositions for use in the circuit boards of the present invention may be used according to the examples of US Pat. No. 3,576,387

'■ be asked.

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Claims (19)

PROTECTION CLAIMS j 1. Electrical connection device, marked by a plate of plastic containing electrically conductive particles distributed between opposite one another Make the two surfaces has a low electrical volume resistance, and by several Elements (21a to 2Ie) made of electrically conductive material, which adhere to a first surface of the plate and with this surface of the plate are in electrical communication, the elements on the plate such Have a distance from each other that they are electrically isolated from each other. 2. Electrical connection device according to claim 1, characterized in that the plate made of a Kun.'ststoffitiaterial with a volume resistance of less than 7540879 05/06/76 1000 Ohm and that the distance between the elements (21a to 2Ie) is chosen so that the insulation resistance between the elements is more than 1000 ohms. 3. Electrical connection device according to claim 2, characterized in that the isolation distance of the elements (21a to 2Ie) is greater than the plate thickness. 4. Electrical connection device according to one of the claims l to 3, characterized in that at least an electrically conductive element (24) on the second surface opposite the first surface of the plate adheres and is in electrically conductive connection with this second surface that this element (24) on the second surface of one of the elements (21) on the first surface crosses, but a lateral isolation distance owned by the other elements on the first surface, those on opposite surfaces crossing elements are connected to one another through the plate. 5. Electrical connection device according to claim 2, characterized characterized in that the plate is made of a plastic material with a volume resistance of greater than 7540879 05/06/76 200 ohms. 6. Electrical connection device according to claim 2, characterized in that the plate consists of a synthetic - Fabric material with a volume resistance of less than 1 ohm. 7- ElBkXvi Getting Connected ^ device according to claim 2, characterized in that the plate consists of a plastic material having an insulation resistance of 10 ³ to 10 ohms or higher. 8. Electrical connection device according to one of the claims 1 to 7, characterized in that the connec- I application device is a keypad (39). j 9. Electrical connection device according to one of the following; Is claims 1 to 7, characterized in that the connects \-making device comprises a clock (50). 10. Electrical connection device according to one of claims 1 to 9i, characterized in that the plate consists of a plastic material that is 20 to 0.05 .- # Contains electrically conductive particles. - 29 - 7540879 05/06/76 11. Electrical connection device according to one of the claims 1 to 10, characterized in that the plate consists of a plastic material that is 9 to 18 vol .- $ Contains metal particles. 12. Electrical connection device according to one of claims 1 to 10, characterized in that the particles are insulation cores coated by a metal and the metal content is 0.05 to 0.11 vol .- #. 13. Electrical connection device according to one of the claims 1 to 12, characterized in that the particles have a maximum dimension of 0.005 to 2.5 mm. 14. Electrical connection device according to one of the claims 1 to 13, characterized in that the plate is between 0.025 and 2.54mm thick. 15. Electrical connection device according to one of the claims 1 to 14, characterized in that the plate is between 0.05 and 1 mm thick. 16. Electrical connection device according to one of claims 1 to 15, characterized in that the plate - 30 - 7540879 05/06/76 } 0.15 to 0.61mm thick. 17. Electrical connection device according to one of claims 1 to l6, characterized in that the plate consists of a plastic material that, without compression, creates a volume resistance between on opposite sides Surfaces facing contacts of less than 1000 ohms, while the insulation resistance between contacts located on opposite surfaces or on one surface adjacent contacts at a spacing of about five times the plate thickness is greater than 100 ohms. 18. Electrical connection device according to one of the claims i to 17, characterized in that the plate consists of a flexible plastic, 19. Electrical connection device according to one or more of claims 1 to 18, characterized in that that on a surface of the plate a circuit pattern (21) is provided which adheres to the surface and with this is in electrical connection. 7540879 05/06/76