DE7006716U - PLATE OR FRAME WITH A VARIETY OF CLOSE-UP, NARROW CONTACT SURFACES. - Google Patents
PLATE OR FRAME WITH A VARIETY OF CLOSE-UP, NARROW CONTACT SURFACES.Info
- Publication number
- DE7006716U DE7006716U DE7006716U DE7006716U DE7006716U DE 7006716 U DE7006716 U DE 7006716U DE 7006716 U DE7006716 U DE 7006716U DE 7006716 U DE7006716 U DE 7006716U DE 7006716 U DE7006716 U DE 7006716U
- Authority
- DE
- Germany
- Prior art keywords
- contact surfaces
- grooves
- wires
- plate
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 230000015654 memory Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Description
Platte oder Rahmen mit einer Vielzahl von dicht nebeneinanderliegenden, schmalen KontaktflächenPlate or frame with a large number of closely spaced, narrow contact areas
Die Neuerung betrifft eine Platte oder einen Rahmen mit einer Vielzahl von dicht nebeneinanderliegenden, schmalen Kontaktflächen, an die einzelne Drähte angelötet werden sollen, insbesondere zum Kontaktieren der Flechtdrähte von Kernspeichern.The innovation relates to a plate or a frame with a large number of narrow, closely spaced Contact surfaces to which individual wires are to be soldered, especially for contacting the braided wires of core memories.
Üblicherweise geht man bei dor Herstellu.-'^ eines Speicherblockes von ebenen Geflechten aus Kernen und Drähten aus, die in Rahmen mit entsprechend vielen Kontaktanschlüssen eingesetzt werden. Die Kontaktflächen dieser Rahmen können z.B. mit Hilfe der Ätztechnik hergestellt v/erden. Auf diese Weise v/erden sehr viele gleichartige Kontaktflächen aufeinmal erzeugt. Es besteht jedoch die Schwierigkeit, die aus der Speichermatrix heraustretenden dünnen, lackisolierten Drähte in kleinen Abständen an die lainellenartig angeordneten Kontaktflächen anzulöten, v/obei gleichzeitig eine gute Positionierung erreicht werden soll.Usually one goes to the manufacture of a memory block from flat braids made of cores and wires, which are in frames with a corresponding number of contact connections can be used. The contact surfaces of these frames can be produced using etching technology, for example v / earth. In this way, a large number of similar contact surfaces are generated at once. It does exist, however the difficulty of the thin, enamel-insulated wires emerging from the memory matrix in small ones To solder the gaps to the lainellar arranged contact surfaces, v / obei a good positioning at the same time should be achieved.
Det feuerung liegt deshalb die Aufgabe zugrunde, eine Platte oder einen Rahmen mit einer Vielzahl von dicht nebeneinanderliegenden, schmalen Kontaktflächen anzu-Det firing is therefore based on the task of a Plate or frame with a large number of narrow contact surfaces lying close to one another.
VPA 9/140/0028 Bit/ZiVPA 9/140/0028 Bit / Zi
17.2.1970February 17, 1970
geben, die es erlauben, auf besonders einfache, schnelle und sichere Weise Drähte zu positionieren und anzulöten. that allow wires to be positioned and soldered in a particularly simple, fast and safe way.
Die Lösung dieser Aufgabe ist dadurch gekennzeichnet, daß die Kontaktflächen in Längsrichtung verlaufende Rillen aufweisen, deren Durchmesser denen der zu kontaktierenden Drähte angepaßt ist und daß die für den Lötvorgang benötigte Lotmenge sich in diesen Rillen befindet.The solution to this problem is characterized in that the contact surfaces have grooves running in the longitudinal direction have, the diameter of which is adapted to that of the wires to be contacted and that for the soldering process required amount of solder is in these grooves.
Damit ergeben sich die Vorteile, daß die zu lötenden Drähte genau positioniert zu den Kontaktflächen zu liegen kommen,, daß beim Lötvorgang kein zusätzliches Lotmaterial an die Lötstelle gebracht werden muß, daß die Drähte ausreichend von Lötzinn umschlossen werden und daß der Lötvorgang mit einem automatischen Lötverfahren, wie Bügellötung, Infrarot- oder Laserlötung vorgenommen werden kann.This has the advantage that the wires to be soldered come to lie exactly positioned to the contact surfaces, that no additional solder material during the soldering process must be brought to the soldering point that the wires are sufficiently enclosed by solder and that the soldering process be carried out with an automatic soldering process, such as bracket soldering, infrared or laser soldering can.
Die neuerungsgeraäßen Rillen werden vorzugsweise eingoätzt, eingeprägt oder eingeschnitten. Nach dem Einbringen der Rillen erhalten die Leiterbahnen eine galvanisch aufge-The renewal grooves are preferably etched in, embossed or incised. After introducing the Grooves, the conductor tracks are galvanically
{ brachte Oberfläche, z.B. eine Zinnschicht. { brought a surface, e.g. a layer of tin.
Anhand der Zeichnung soll die Neuerung näher erläutert werden. The innovation is to be explained in more detail using the drawing.
/Fig. 1 zeigt einen Schnitt durch eine Platte mit Kontaktflächen, entlang der in Pig. 2 eingezeichneten Trennlinien I - I./ Fig. 1 shows a section through a plate with contact surfaces, along the in Pig. 2 drawn dividing lines I - I.
Pig. 2 zeigt eine Draufsicht auf eine solche Platte.Pig. 2 shows a plan view of such a plate.
VPA 9/H0/0028 - 3 -VPA 9 / H0 / 0028 - 3 -
Auf einer Isolierstoffplatte 1 befinden sich aus einer Metallschicht herausgeätzte schmale Kontaktflächen 2, die an ihrer Oberseite mit Rillen cj versehen sind. Auf den Kontaktflächen 2 ist eine Zinnschicht 3 galvanisch abgeschieden, die als Lotmaterial dient und beim Anlöten von Drähten 4 diese völlig umhüllt und einschließt. Länge und Durchmesser der eingeschnittenen Rillen 5 entsprechen den Abmessungen dor anzulötenden Drähte-4.On an insulating plate 1 there are narrow contact surfaces 2 etched out of a metal layer, which are provided with grooves c j on their upper side. A tin layer 3 is electrodeposited on the contact surfaces 2, which serves as a solder material and, when wires 4 are soldered on, completely envelops and encloses them. The length and diameter of the incised grooves 5 correspond to the dimensions of the wires 4 to be soldered.
,· 10 Zum Abschluß sei erwähnt, daß sich die Neuerung nicht, · 10 In conclusion, it should be mentioned that the innovation is not
auf die als Beispiel geschilderte Befestigung von Kernspeicherdrähten
an Halterahmen beschränkt, sondern daß sie auch bei gedruckten Schaltungen, Baugruppen u.s.v/.
anwendbar ist.
15limited to the attachment of core storage wires to the holding frame described as an example, but that they are also used in printed circuits, assemblies, etc. is applicable.
15th
5 Schutzansprüche
2 Figuren5 claims for protection
2 figures
VPA 9/H0/0028 - 4 -VPA 9 / H0 / 0028 - 4 -
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE7006716U DE7006716U (en) | 1970-02-24 | 1970-02-24 | PLATE OR FRAME WITH A VARIETY OF CLOSE-UP, NARROW CONTACT SURFACES. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE7006716U DE7006716U (en) | 1970-02-24 | 1970-02-24 | PLATE OR FRAME WITH A VARIETY OF CLOSE-UP, NARROW CONTACT SURFACES. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE7006716U true DE7006716U (en) | 1970-07-30 |
Family
ID=6609701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE7006716U Expired DE7006716U (en) | 1970-02-24 | 1970-02-24 | PLATE OR FRAME WITH A VARIETY OF CLOSE-UP, NARROW CONTACT SURFACES. |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE7006716U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006002925A1 (en) * | 2004-06-30 | 2006-01-12 | Fci | Very high frequency electrical connector |
-
1970
- 1970-02-24 DE DE7006716U patent/DE7006716U/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006002925A1 (en) * | 2004-06-30 | 2006-01-12 | Fci | Very high frequency electrical connector |
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