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DE69302244D1 - Halbleiter-Schutzkomponente - Google Patents

Halbleiter-Schutzkomponente

Info

Publication number
DE69302244D1
DE69302244D1 DE69302244T DE69302244T DE69302244D1 DE 69302244 D1 DE69302244 D1 DE 69302244D1 DE 69302244 T DE69302244 T DE 69302244T DE 69302244 T DE69302244 T DE 69302244T DE 69302244 D1 DE69302244 D1 DE 69302244D1
Authority
DE
Germany
Prior art keywords
protection component
semiconductor protection
semiconductor
component
protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69302244T
Other languages
English (en)
Other versions
DE69302244T2 (de
Inventor
Keith Michael Hutchings
Andrew Leonard Goodyear
Paul Arthur Gough
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Application granted granted Critical
Publication of DE69302244D1 publication Critical patent/DE69302244D1/de
Publication of DE69302244T2 publication Critical patent/DE69302244T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/141VDMOS having built-in components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/665Vertical DMOS [VDMOS] FETs having edge termination structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
DE69302244T 1992-08-11 1993-08-09 Halbleiter-Schutzkomponente Expired - Fee Related DE69302244T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929216953A GB9216953D0 (en) 1992-08-11 1992-08-11 A semiconductor component

Publications (2)

Publication Number Publication Date
DE69302244D1 true DE69302244D1 (de) 1996-05-23
DE69302244T2 DE69302244T2 (de) 1996-11-07

Family

ID=10720114

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69302244T Expired - Fee Related DE69302244T2 (de) 1992-08-11 1993-08-09 Halbleiter-Schutzkomponente

Country Status (5)

Country Link
US (1) US5352915A (de)
EP (1) EP0583037B1 (de)
JP (1) JPH06163889A (de)
DE (1) DE69302244T2 (de)
GB (1) GB9216953D0 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2705173B1 (fr) * 1993-05-10 1995-07-28 Sgs Thomson Microelectronics Composant limiteur de courant serie.
GB9313651D0 (en) * 1993-07-01 1993-08-18 Philips Electronics Uk Ltd A semiconductor device
US6001678A (en) * 1995-03-14 1999-12-14 Mitsubishi Denki Kabushiki Kaisha Insulated gate semiconductor device
JP3303601B2 (ja) * 1995-05-19 2002-07-22 日産自動車株式会社 溝型半導体装置
US5648670A (en) * 1995-06-07 1997-07-15 Sgs-Thomson Microelectronics, Inc. Trench MOS-gated device with a minimum number of masks
JP3168147B2 (ja) * 1995-09-14 2001-05-21 株式会社日立製作所 半導体装置とそれを用いた3相インバータ
US5883402A (en) * 1995-11-06 1999-03-16 Kabushiki Kaisha Toshiba Semiconductor device and protection method
US5818084A (en) * 1996-05-15 1998-10-06 Siliconix Incorporated Pseudo-Schottky diode
JP3397057B2 (ja) * 1996-11-01 2003-04-14 日産自動車株式会社 半導体装置
US5910873A (en) * 1997-02-19 1999-06-08 National Semiconductor Corporation Field oxide transistor based feedback circuit for electrical overstress protection
US5846862A (en) 1997-05-20 1998-12-08 Advanced Micro Devices Semiconductor device having a vertical active region and method of manufacture thereof
JP3502531B2 (ja) * 1997-08-28 2004-03-02 株式会社ルネサステクノロジ 半導体装置の製造方法
US6583001B1 (en) * 2001-05-18 2003-06-24 Sun Microsystems, Inc. Method for introducing an equivalent RC circuit in a MOS device using resistive paths
US6586817B1 (en) * 2001-05-18 2003-07-01 Sun Microsystems, Inc. Device including a resistive path to introduce an equivalent RC circuit
US20050274985A1 (en) * 2004-05-26 2005-12-15 Adlerstein Michael G RF decoupled field plate for FETs
US7667264B2 (en) * 2004-09-27 2010-02-23 Alpha And Omega Semiconductor Limited Shallow source MOSFET
US7977768B2 (en) 2008-04-01 2011-07-12 Infineon Technologies Ag Semiconductor devices and methods of manufacture thereof
JP5282823B2 (ja) * 2009-09-14 2013-09-04 トヨタ自動車株式会社 ダイオード領域とigbt領域を有する半導体基板を備える半導体装置
US8129778B2 (en) * 2009-12-02 2012-03-06 Fairchild Semiconductor Corporation Semiconductor devices and methods for making the same
US11875958B2 (en) 2018-10-18 2024-01-16 Uchiya Thermostat Co., Ltd. Method of connecting electric element

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2131603B (en) * 1982-12-03 1985-12-18 Philips Electronic Associated Semiconductor devices
GB2134705B (en) * 1983-01-28 1985-12-24 Philips Electronic Associated Semiconductor devices
GB2167229B (en) * 1984-11-21 1988-07-20 Philips Electronic Associated Semiconductor devices
US4767722A (en) * 1986-03-24 1988-08-30 Siliconix Incorporated Method for making planar vertical channel DMOS structures
US5072266A (en) * 1988-12-27 1991-12-10 Siliconix Incorporated Trench DMOS power transistor with field-shaping body profile and three-dimensional geometry

Also Published As

Publication number Publication date
US5352915A (en) 1994-10-04
EP0583037B1 (de) 1996-04-17
DE69302244T2 (de) 1996-11-07
JPH06163889A (ja) 1994-06-10
GB9216953D0 (en) 1992-09-23
EP0583037A1 (de) 1994-02-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee