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DE69224914D1 - ELECTRICITY GOLD COATING BATH - Google Patents

ELECTRICITY GOLD COATING BATH

Info

Publication number
DE69224914D1
DE69224914D1 DE69224914T DE69224914T DE69224914D1 DE 69224914 D1 DE69224914 D1 DE 69224914D1 DE 69224914 T DE69224914 T DE 69224914T DE 69224914 T DE69224914 T DE 69224914T DE 69224914 D1 DE69224914 D1 DE 69224914D1
Authority
DE
Germany
Prior art keywords
coating bath
gold coating
electricity gold
electricity
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69224914T
Other languages
German (de)
Other versions
DE69224914T2 (en
Inventor
Masaru Kato
Yutaka Yazama
Shigetaka Hoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Original Assignee
Kanto Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Chemical Co Inc filed Critical Kanto Chemical Co Inc
Application granted granted Critical
Publication of DE69224914D1 publication Critical patent/DE69224914D1/en
Publication of DE69224914T2 publication Critical patent/DE69224914T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE69224914T 1992-11-25 1992-11-25 ELECTRICITY GOLD COATING BATH Expired - Fee Related DE69224914T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1992/001538 WO1994012686A1 (en) 1992-11-25 1992-11-25 Electroless gold plating bath

Publications (2)

Publication Number Publication Date
DE69224914D1 true DE69224914D1 (en) 1998-04-30
DE69224914T2 DE69224914T2 (en) 1998-10-22

Family

ID=14042674

Family Applications (2)

Application Number Title Priority Date Filing Date
DE0630991T Pending DE630991T1 (en) 1992-11-25 1992-11-25 ELECTRICITY GOLD COATING BATH.
DE69224914T Expired - Fee Related DE69224914T2 (en) 1992-11-25 1992-11-25 ELECTRICITY GOLD COATING BATH

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE0630991T Pending DE630991T1 (en) 1992-11-25 1992-11-25 ELECTRICITY GOLD COATING BATH.

Country Status (4)

Country Link
US (1) US5470381A (en)
EP (1) EP0630991B1 (en)
DE (2) DE630991T1 (en)
WO (1) WO1994012686A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2927142B2 (en) * 1993-03-26 1999-07-28 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
US6194032B1 (en) 1997-10-03 2001-02-27 Massachusetts Institute Of Technology Selective substrate metallization
DE19745602C1 (en) 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Method and solution for the production of gold layers
DE19745601C2 (en) * 1997-10-08 2001-07-12 Fraunhofer Ges Forschung Solution and method for the electroless deposition of gold layers and use of the solution
US5935306A (en) * 1998-02-10 1999-08-10 Technic Inc. Electroless gold plating bath
JP3920462B2 (en) * 1998-07-13 2007-05-30 株式会社大和化成研究所 Aqueous solutions for obtaining noble metals by chemical reduction deposition
US6383269B1 (en) 1999-01-27 2002-05-07 Shipley Company, L.L.C. Electroless gold plating solution and process
JP3466521B2 (en) * 1999-10-04 2003-11-10 新光電気工業株式会社 Substitution type electroless gold plating solution and electroless gold plating method
EP1090825A3 (en) 1999-10-07 2002-04-10 Österreichische Bundesbahnen Twin-axle railway goods wagon
DE10018025A1 (en) 2000-04-04 2001-10-18 Atotech Deutschland Gmbh Production of solderable surface on circuit carriers in circuit board manufacture comprises preparing a dielectric substrate having copper structures, producing solderable surfaces, and forming functional surfaces in functional regions
JP3482402B2 (en) * 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 Replacement gold plating solution
JP4375702B2 (en) * 2001-10-25 2009-12-02 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Plating composition
US6911230B2 (en) * 2001-12-14 2005-06-28 Shipley Company, L.L.C. Plating method
JP3892730B2 (en) * 2002-01-30 2007-03-14 関東化学株式会社 Electroless gold plating solution
SG116489A1 (en) * 2003-04-21 2005-11-28 Shipley Co Llc Plating composition.
KR100953612B1 (en) * 2003-06-02 2010-04-20 삼성에스디아이 주식회사 Substrate for fixing biomaterial and manufacturing method thereof
US7419536B2 (en) * 2003-06-05 2008-09-02 Nikko Materials Co., Ltd. Electroless gold plating liquid
JP4603320B2 (en) * 2003-10-22 2010-12-22 関東化学株式会社 Electroless gold plating solution
US7300501B2 (en) * 2004-04-05 2007-11-27 Nikko Materials Co., Ltd. Electroless gold plating liquid
US7390354B2 (en) * 2004-07-09 2008-06-24 Nikko Materials Co., Ltd. Electroless gold plating solution
KR101194201B1 (en) * 2004-07-15 2012-10-25 세키스이가가쿠 고교가부시키가이샤 Conductive microparticle, process for producing the same and anisotropic conductive material
JP2006111960A (en) 2004-09-17 2006-04-27 Shinko Electric Ind Co Ltd Non-cyanide electroless gold plating solution and electroless gold plating method
WO2006051637A1 (en) * 2004-11-15 2006-05-18 Nippon Mining & Metals Co., Ltd. Electroless gold plating solution
US20070175358A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution
US20070175359A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution and method
GB0903642D0 (en) * 2009-02-27 2009-09-30 Bae Systems Plc Electroless metal deposition for micron scale structures
DE102009041264A1 (en) 2009-09-11 2011-03-24 IPHT Jena Institut für Photonische Technologien e.V. Method for producing optically active nano-structures that are utilized for e.g. surface enhanced Raman scattering spectroscopy, involves selecting characteristics by presetting position, size, shape and composition of nano-structures
JP4831710B1 (en) * 2010-07-20 2011-12-07 日本エレクトロプレイテイング・エンジニヤース株式会社 Electroless gold plating solution and electroless gold plating method
JP5610500B1 (en) * 2014-05-21 2014-10-22 小島化学薬品株式会社 Organic gold complex
KR101444687B1 (en) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 Electroless gold plating liquid

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700469A (en) * 1971-03-08 1972-10-24 Bell Telephone Labor Inc Electroless gold plating baths
US3697296A (en) * 1971-03-09 1972-10-10 Du Pont Electroless gold plating bath and process
US3977884A (en) * 1975-01-02 1976-08-31 Shipley Company, Inc. Metal plating solution
JPS5217333A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Plating solution
GB1547028A (en) * 1976-11-19 1979-06-06 Mine Safety Appliances Co Electroless gold plating baths
US4246195A (en) * 1978-10-06 1981-01-20 Halcon Research And Development Corporation Purification of carbonylation products
JPS56108869A (en) * 1980-01-31 1981-08-28 Asahi Glass Co Ltd Nickel coat forming method
JPS5819468A (en) * 1981-07-28 1983-02-04 Asahi Glass Co Ltd Method of forming nickel film
GB2114159B (en) * 1982-01-25 1986-02-12 Mine Safety Appliances Co Method and bath for the electroless plating of gold
JPS61253376A (en) * 1985-05-01 1986-11-11 Shinko Electric Ind Co Ltd Copper for copper alloy treating agent for gold plating
CN1003524B (en) * 1985-10-14 1989-03-08 株式会社日立制作所 Electroless Gold Plating Solution
JPS6299477A (en) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd Electroless gold plating solution
DE3614090C1 (en) * 1986-04-25 1987-04-30 Heraeus Gmbh W C Bath for the currentless deposition of gold layers
DE3640028C1 (en) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Acid bath for the electroless deposition of gold layers
JP2655329B2 (en) * 1988-01-28 1997-09-17 関東化学 株式会社 Electroless plating solution
JPH0270084A (en) * 1988-09-06 1990-03-08 C Uyemura & Co Ltd Gold plating bath and method
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US5258062A (en) * 1989-06-01 1993-11-02 Shinko Electric Industries Co., Ltd. Electroless gold plating solutions
US4985076A (en) * 1989-11-03 1991-01-15 General Electric Company Autocatalytic electroless gold plating composition
JPH04350172A (en) * 1991-05-28 1992-12-04 Kanto Chem Co Inc Electroless gold plating solution
US5232492A (en) * 1992-01-23 1993-08-03 Applied Electroless Concepts Inc. Electroless gold plating composition
DE69406701T2 (en) * 1993-03-26 1998-04-02 Uyemura & Co C Chemical gilding bath
JPH06299477A (en) * 1993-04-15 1994-10-25 Mitsubishi Baarinton Kk Production of carpet
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths

Also Published As

Publication number Publication date
DE630991T1 (en) 1995-07-13
DE69224914T2 (en) 1998-10-22
EP0630991B1 (en) 1998-03-25
EP0630991A4 (en) 1995-01-18
EP0630991A1 (en) 1994-12-28
US5470381A (en) 1995-11-28
WO1994012686A1 (en) 1994-06-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee