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DE69219101D1 - Laserbearbeitungsvorrichtung und Verfahren zum Einstellen der Höhe des Kondensor - Google Patents

Laserbearbeitungsvorrichtung und Verfahren zum Einstellen der Höhe des Kondensor

Info

Publication number
DE69219101D1
DE69219101D1 DE69219101T DE69219101T DE69219101D1 DE 69219101 D1 DE69219101 D1 DE 69219101D1 DE 69219101 T DE69219101 T DE 69219101T DE 69219101 T DE69219101 T DE 69219101T DE 69219101 D1 DE69219101 D1 DE 69219101D1
Authority
DE
Germany
Prior art keywords
condenser
adjusting
height
processing device
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69219101T
Other languages
English (en)
Other versions
DE69219101T2 (de
Inventor
Tsutomu Sugiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4017359A external-priority patent/JPH05212568A/ja
Priority claimed from JP4055178A external-priority patent/JP2924423B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69219101D1 publication Critical patent/DE69219101D1/de
Application granted granted Critical
Publication of DE69219101T2 publication Critical patent/DE69219101T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B23K26/125—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases of mixed gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE69219101T 1992-02-03 1992-11-06 Laserbearbeitungsvorrichtung und Verfahren zum Einstellen der Höhe des Kondensor Expired - Lifetime DE69219101T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4017359A JPH05212568A (ja) 1992-02-03 1992-02-03 レーザ加工装置およびその集光レンズ高さ制御方法
JP4055178A JP2924423B2 (ja) 1992-03-13 1992-03-13 レーザ加工装置とその集光レンズ高さ制御方法

Publications (2)

Publication Number Publication Date
DE69219101D1 true DE69219101D1 (de) 1997-05-22
DE69219101T2 DE69219101T2 (de) 1997-07-24

Family

ID=26353860

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69219101T Expired - Lifetime DE69219101T2 (de) 1992-02-03 1992-11-06 Laserbearbeitungsvorrichtung und Verfahren zum Einstellen der Höhe des Kondensor

Country Status (3)

Country Link
US (1) US5334816A (de)
EP (1) EP0554523B1 (de)
DE (1) DE69219101T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1066086C (zh) * 1992-04-13 2001-05-23 株式会社日立制作所 用于气体绝缘电器的接地容器的激光焊接装置
JPH06254691A (ja) * 1993-03-08 1994-09-13 Mitsubishi Electric Corp レーザ加工機およびレーザ加工機の焦点設定方法
US5763855A (en) * 1994-06-06 1998-06-09 Amada Company, Limited Method and apparatus for supplying gaseous nitrogen to a laser beam machine
DE19516376C2 (de) * 1995-05-04 1998-12-03 Blz Gmbh Verfahren und Vorrichtung zur Kontrolle und Regelung der Brennfleckposition bei der Lasermaterialbearbeitung
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
US5744780A (en) * 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
US6057525A (en) * 1995-09-05 2000-05-02 United States Enrichment Corporation Method and apparatus for precision laser micromachining
IL118850A0 (en) * 1996-07-14 1996-10-31 Orziv Ltd Device and method for laser marking
ES2142268B1 (es) * 1998-02-19 2000-11-16 Univ Vigo Procesamiento de pizarra mediante laser.
TW457160B (en) * 1999-07-16 2001-10-01 Yamazaki Mazak Corp Three-dimensional linear working device
GB2365615A (en) * 2000-07-14 2002-02-20 Maurice Peter Davies Hand plate musical instrument
US6750421B2 (en) * 2002-02-19 2004-06-15 Gsi Lumonics Ltd. Method and system for laser welding
JP2005088053A (ja) * 2003-09-18 2005-04-07 Disco Abrasive Syst Ltd レーザー加工装置
JP4509578B2 (ja) * 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP3708104B2 (ja) * 2004-01-13 2005-10-19 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
US20050194367A1 (en) * 2004-03-02 2005-09-08 Fredrick William G.Jr. System and method for remote controlled actuation of laser processing head
KR100760001B1 (ko) * 2005-01-28 2007-09-27 한미반도체 주식회사 반도체 제조 공정용 흡착패드 가공장치 및 가공방법
EP1750891B1 (de) 2005-06-23 2007-10-24 Trumpf Werkzeugmaschinen GmbH + Co. KG Verfahren zur bestimmung der fokuslage eines laserstrahls
DE102005039094B4 (de) * 2005-08-08 2009-03-19 Carl Zeiss Industrielle Messtechnik Gmbh Verfahren und Vorrichtung zum Führen eines Maschinenteils entlang einer definierten Bewegungsbahn über einer Werkstücksoberfläche
WO2007028402A1 (de) * 2005-09-06 2007-03-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Strahlfangvorrichtung für eine bearbeitungsmaschine
CN101861228B (zh) 2007-11-14 2013-09-11 浜松光子学株式会社 激光加工装置以及激光加工方法
JP2010082647A (ja) * 2008-09-30 2010-04-15 Manii Kk アイレス針の穴加工装置および穴加工方法
CN101837517A (zh) * 2010-03-31 2010-09-22 龙岩理尚精密机械有限公司 自动调焦数控激光切割器
EP2390046A1 (de) * 2010-05-25 2011-11-30 Lasag Ag Anlage zur Laserbearbeitung mit optischen Fasern zum Eingravieren von Kerben als Bruchansätze
US9573215B2 (en) * 2012-02-10 2017-02-21 Illinois Tool Works Inc. Sound-based weld travel speed sensing system and method
DE102012202330B4 (de) * 2012-02-16 2017-08-17 Trumpf Laser Gmbh Laserbearbeitungsvorrichtung mit einem relativ zu einer Spannpratze beweglichen Laserbearbeitungskopf
US11090753B2 (en) 2013-06-21 2021-08-17 Illinois Tool Works Inc. System and method for determining weld travel speed
CN104002042B (zh) * 2014-05-28 2016-03-02 昆山联滔电子有限公司 激光焊接装置
US9863803B2 (en) 2015-03-10 2018-01-09 Technology Research Association For Future Additive Manufacturing Optical processing head having a plurality of optical fibers arranged to surround the light guide and 3D shaping apparatus
US10322470B2 (en) 2015-04-06 2019-06-18 The Boeing Company Deposition head for additive manufacturing
US11305377B2 (en) * 2019-12-23 2022-04-19 Precitec Gmbh & Co. Kg Add-on module for interposing between a control device and a laser machining head of a laser machining system
CN111702848B (zh) * 2020-06-30 2022-11-22 何世锋 一种橡胶制品的花纹制备装置
AT524285B1 (de) * 2020-10-05 2023-07-15 Trotec Laser Gmbh Schutztrichter für eine Laservorrichtung und Laservorrichtung hierfür
CN116765652B (zh) * 2023-08-23 2024-04-12 交通运输部天津水运工程科学研究所 光纤传感器激光焊接焦点追踪与能量分布监测方法及装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0129603A4 (de) * 1982-12-17 1985-06-10 Inoue Japax Res Zerspanungsvorrichtung mit laser.
JPS60191686A (ja) * 1984-03-09 1985-09-30 Shibuya Kogyo Co Ltd レ−ザ加工装置
JPS60255295A (ja) * 1984-05-30 1985-12-16 Mitsubishi Electric Corp 自動レ−ザ加工機
US4764655A (en) * 1987-08-31 1988-08-16 General Electric Company Real-time laser beam diameter determination in a laser-materials processing system
GB8813315D0 (en) * 1988-06-06 1988-07-13 Serrano J P Beam delivery system
JPH03258479A (ja) * 1990-03-06 1991-11-18 Mitsubishi Electric Corp レーザ加工装置
US5045668A (en) * 1990-04-12 1991-09-03 Armco Inc. Apparatus and method for automatically aligning a welding device for butt welding workpieces

Also Published As

Publication number Publication date
EP0554523B1 (de) 1997-04-16
EP0554523A1 (de) 1993-08-11
US5334816A (en) 1994-08-02
DE69219101T2 (de) 1997-07-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: JUNG, SCHIRDEWAHN, GRUENBERG, SCHNEIDER PATENTANWAELTE

8328 Change in the person/name/address of the agent

Representative=s name: ADVOTEC. PATENT- UND RECHTSANWAELTE, 80538 MUENCHE

8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)
R071 Expiry of right

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