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DE69117944D1 - Lötmittelverabreichungssystem - Google Patents

Lötmittelverabreichungssystem

Info

Publication number
DE69117944D1
DE69117944D1 DE69117944T DE69117944T DE69117944D1 DE 69117944 D1 DE69117944 D1 DE 69117944D1 DE 69117944 T DE69117944 T DE 69117944T DE 69117944 T DE69117944 T DE 69117944T DE 69117944 D1 DE69117944 D1 DE 69117944D1
Authority
DE
Germany
Prior art keywords
solder
administration system
administration
solder administration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69117944T
Other languages
English (en)
Other versions
DE69117944T2 (de
Inventor
Thomas Mcgaffigan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metcal Inc
Whitaker LLC
Original Assignee
Metcal Inc
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metcal Inc, Whitaker LLC filed Critical Metcal Inc
Publication of DE69117944D1 publication Critical patent/DE69117944D1/de
Application granted granted Critical
Publication of DE69117944T2 publication Critical patent/DE69117944T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
DE69117944T 1990-03-27 1991-03-26 Lötmittelverabreichungssystem Expired - Fee Related DE69117944T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/499,711 US5040717A (en) 1990-03-27 1990-03-27 Solder delivery system
PCT/US1991/001899 WO1991014532A1 (en) 1990-03-27 1991-03-26 Solder delivery system

Publications (2)

Publication Number Publication Date
DE69117944D1 true DE69117944D1 (de) 1996-04-18
DE69117944T2 DE69117944T2 (de) 1996-08-22

Family

ID=23986384

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69117944T Expired - Fee Related DE69117944T2 (de) 1990-03-27 1991-03-26 Lötmittelverabreichungssystem

Country Status (7)

Country Link
US (1) US5040717A (de)
EP (1) EP0522026B1 (de)
JP (1) JPH05506961A (de)
AU (1) AU7545191A (de)
CA (1) CA2039192A1 (de)
DE (1) DE69117944T2 (de)
WO (1) WO1991014532A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
US5358169A (en) * 1994-01-14 1994-10-25 Caddock Electronics, Inc. Method of soldering leads to electrical components
US5695109A (en) * 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
US6454154B1 (en) * 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6593543B2 (en) * 2000-07-20 2003-07-15 David Benderly Gemstone marking system and method
US9108262B1 (en) * 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
USD874413S1 (en) * 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
JP7501425B2 (ja) * 2021-03-30 2024-06-18 株式会社オートネットワーク技術研究所 ヒューズ素子
US12526920B1 (en) 2024-01-12 2026-01-13 Topline Corporation Indium-niobium superconducting solder columns for cryogenic and quantum computer applications and methods for making same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1399769A (en) * 1917-11-24 1921-12-13 Westinghouse Electric & Mfg Co Soldering-strip
US3396894A (en) * 1965-05-11 1968-08-13 Raychem Corp Solder device
US3464617A (en) * 1965-06-09 1969-09-02 Rand Dev Corp Sweat solder form
NL6613526A (de) * 1966-09-26 1968-03-27
CA962021A (en) * 1970-05-21 1975-02-04 Robert W. Gore Porous products and process therefor
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
US3750265A (en) * 1972-04-05 1973-08-07 Jade Corp Method of preforming solder to a plurality of terminals
US3750252A (en) * 1972-05-01 1973-08-07 Du Pont Solder terminal strip
US4256945A (en) * 1979-08-31 1981-03-17 Iris Associates Alternating current electrically resistive heating element having intrinsic temperature control
US4354629A (en) * 1980-06-09 1982-10-19 Raychem Corporation Solder delivery system
US4396140A (en) * 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
JPS58191495A (ja) * 1982-04-30 1983-11-08 ソニー株式会社 凸部を有する基板にフラツクス及び半田を付ける方法
JPS59207690A (ja) * 1983-05-11 1984-11-24 株式会社東芝 集積回路素子の実装方法
JPS61172697A (ja) * 1985-01-28 1986-08-04 Victor Co Of Japan Ltd 半田集合体
JPS61167267U (de) * 1985-04-02 1986-10-17
US4684055A (en) * 1985-09-09 1987-08-04 Harris Corporation Method of selectively soldering the underside of a substrate having leads
DE3608101A1 (de) * 1986-03-12 1987-09-17 Metallgesellschaft Ag Lottraeger
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
JPH01166597A (ja) * 1987-12-23 1989-06-30 Fujitsu Ltd リフロー半田接合方法
US4807799A (en) * 1988-06-01 1989-02-28 Raychem Corporation Device for applying solder
JPH0230140A (ja) * 1988-07-20 1990-01-31 Fujitsu Ltd はんだボールシートの構造とはんだバンプの形成方法
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means

Also Published As

Publication number Publication date
US5040717A (en) 1991-08-20
EP0522026A4 (en) 1993-08-04
WO1991014532A1 (en) 1991-10-03
EP0522026B1 (de) 1996-03-13
DE69117944T2 (de) 1996-08-22
JPH05506961A (ja) 1993-10-07
CA2039192A1 (en) 1991-09-28
EP0522026A1 (de) 1993-01-13
AU7545191A (en) 1991-10-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee