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DE69030123T2 - Inductive structures for semiconducting integrated circuits - Google Patents

Inductive structures for semiconducting integrated circuits

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Publication number
DE69030123T2
DE69030123T2 DE69030123T DE69030123T DE69030123T2 DE 69030123 T2 DE69030123 T2 DE 69030123T2 DE 69030123 T DE69030123 T DE 69030123T DE 69030123 T DE69030123 T DE 69030123T DE 69030123 T2 DE69030123 T2 DE 69030123T2
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Germany
Prior art keywords
insulating film
electrically insulating
electrical conductor
transformer
turns
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Expired - Fee Related
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DE69030123T
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German (de)
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DE69030123D1 (en
Inventor
Naoto Andoh
Akira Inoue
Kazuhito Nakahara
Yasuharu Nakajima
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of DE69030123D1 publication Critical patent/DE69030123D1/en
Application granted granted Critical
Publication of DE69030123T2 publication Critical patent/DE69030123T2/en
Anticipated expiration legal-status Critical
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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/20Inductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00Variable inductances or transformers of the signal type
    • H01F21/02Variable inductances or transformers of the signal type continuously variable, e.g. variometers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00Variable inductances or transformers of the signal type
    • H01F21/02Variable inductances or transformers of the signal type continuously variable, e.g. variometers
    • H01F21/08Variable inductances or transformers of the signal type continuously variable, e.g. variometers by varying the permeability of the core, e.g. by varying magnetic bias
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H10W44/501
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F2017/004Printed inductances with the coil helically wound around an axis without a core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F2017/0046Printed inductances with a conductive path having a bridge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F2017/0086Printed inductances on semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)

Description

Die Erfindung betrifft einen Transformator, der mit einer integrierten Halbleiterschaltung integrierbar ist, wie im Oberbegriff von Anspruch 1 beansprucht.The invention relates to a transformer which can be integrated with an integrated semiconductor circuit as claimed in the preamble of claim 1.

Als Transformatoren können mehrere Spiralwindungen verwendet werden, die induktiv gekoppelt sind. Ein Beispiel eines anderen bekannten Transformators, der zwei auf derselben Fläche angeordnete Spiralwindungen nutzt, ist in Draufsicht in Fig. 1 dargestellt. Hierbei ist eine elektrisch leitende Spirale 2 innerhalb einer elektrisch leitenden Spirale 12 angeordnet. Sowohl das Außenende 3 als auch das Innenende 4 der Spirale 2 benötigen Luftbrückenstrukturen 9, die sie gegen Spiralwindungen der Spirale 12 isolieren und diese überkreuzen, und die elektrischen Zugang zur Spirale 2 geben. Da die Spirale 12 außerhalb der Spirale 2 liegt, ist zum Außenende 13 der Spule 12 direkter Zugang verfügbar. Jedoch muss immer noch eine Luftbrückenstruktur 9 vorhanden sein, um für Zugang von außen zum Innenende 14 der Spirale 12 zu sorgen. Wegen des Vorhandenseins dreier Luftbrücken 9 leidet der Transformator von Fig. 1 unter Problemen durch parasitäre Kapazitäten. Außerdem ist die magnetische Kopplung zwischen den Spiralen 2 und 12 beschränkt, da in der Nachbarschaft dieser Windungen nur ein Material mit relativ niedriger Permeabilität, d.h. das Substrat 1, vorhanden ist.As transformers, multiple spiral turns can be used that are inductively coupled. An example of another known transformer that uses two spiral turns arranged on the same surface is shown in plan view in Fig. 1. Here, an electrically conductive spiral 2 is arranged inside an electrically conductive spiral 12. Both the outer end 3 and the inner end 4 of the spiral 2 require air bridge structures 9 that insulate them from and cross spiral turns of the spiral 12 and that provide electrical access to the spiral 2. Since the spiral 12 is outside the spiral 2, direct access is available to the outer end 13 of the coil 12. However, an air bridge structure 9 must still be present to provide access from the outside to the inner end 14 of the spiral 12. Due to the presence of three air bridges 9, the transformer of Fig. 1 suffers from parasitic capacitance problems. In addition, the magnetic coupling between the spirals 2 and 12 is limited since in the vicinity of these turns there is only one material with relatively low permeability, i.e. the substrate 1.

Eine andere bekannte Struktur eines Transformators ist in Explosionsansicht in Fig. 2 dargestellt. Diese Transformatorstruktur enthält ein elektrisch isolierendes Substrat 1, auf dem Isolierfilme 20, 30 und 40 aufeinanderfolgend angeordnet sind. Elektrisch leitende Spiralen 2 und 12 sind jeweils auf den Filmen 20 b zw. 40 angeordnet. Jeder der Filme enthält ein Durchgangsloch durch die jeweiligen Isolierfilme, durch die hindurch sich Leiter 26 bzw. 27 zu einer darunterliegenden Schicht, dem Film 30 im Fall der Spirale 2 und dem Substrat 1 im Fall der Spirale 12, erstrecken. Diese elektrischen, durch die Isolierfilme hindurchgehenden Leiter sorgen für elektrische Verbindung zu jeweiligen Zuleitungen 6 von den Innenenden 4 und 14 der Spiralen 2 und 12. Die zwei Spiralen 2 und 12 weisen denselben Sinn auf, d.h. dieselbe Wicklungsrichtung, und sie liegen übereinander, um die wechselseitige induktive Kopplung zu maximieren. Die Gegeninduktivität der zwei Spiralen wird durch die gegenseitige Geometrie und die Dicken der Isolierfilme kontrolliert. Jedoch ist die Gegeninduktivität zwischen den zwei Spiralen beschränkt, da die Permeabilität der benachbarten Materialien relativ klein ist.Another known structure of a transformer is shown in exploded view in Fig. 2. This transformer structure includes an electrically insulating substrate 1 on which insulating films 20, 30 and 40 are arranged in succession. Electrically conductive spirals 2 and 12 are arranged on the films 20 and 40, respectively. Each of the films includes a through-hole through the respective insulating films through which conductors 26 and 27 extend to an underlying layer, the film 30 in the case of the spiral 2 and the substrate 1 in the case of the spiral 12. These electrical conductors passing through the insulating films provide electrical connection to respective leads 6 from the inner ends 4 and 14 of the spirals 2 and 12. The two spirals 2 and 12 have the same sense, i.e. the same winding direction, and they lie one above the other to form the to maximize mutual inductive coupling. The mutual inductance of the two spirals is controlled by the mutual geometry and the thicknesses of the insulating films. However, the mutual inductance between the two spirals is limited because the permeability of the neighboring materials is relatively small.

In den Fig. 3(a)-3(c) ist eine andere bekannte Transformatorstruktur zur Verwendung in integrierten Halbleiterschaltungen in Schnitt- und Draufsichten dargestellt. Dieser Transformator, wie er dem Oberbegriff von Anspruch 1 entspricht, verwendet eine Lage eines Materials mit relativ hoher Permeabilität, um die induktive Kopplung zwischen den zwei Windungen zu verbessern. Bei dieser bekannten Struktur, wie sie in Patent Abstracts of Japan: Vol. 11, No. 161 [E-509], 23.05.87 sowie in der veröffentlichten Japanischen Patentanmeldung 61-294850 beschrieben ist, ist eine elektrisch leitende Spirale 2 auf einem Halbleitersubstrat 1 angeordnet. Eine zweite Windung 28 umfasst eine einzelne Schleife, die mittels einer elektrisch isolierenden Schicht 4 von der Spirale 2 beabstandet ist. In die Isolierschicht 29 zwischen der Spirale 2 und der Windung 28 ist eine ferromagnetische Lage 31 eingebettet. Da die ferroelektrische Lage 31 zwischen der Spirale 2 und der Windung 28 statt innerhalb der zentralen Öffnung derselben angeordnet ist, ist sie nicht wirksam hinsichtlich einer deutlichen Erhöhung der induktiven Kopplung zwischen diesen zwei Leitern. So ist es bei den bekannten Strukturen schwierig, große Gegeninduktivität und hohen Wirkungsgrad des Transformators zu erzielen.Another known transformer structure for use in semiconductor integrated circuits is shown in cross-sectional and plan views in Figs. 3(a)-3(c). This transformer, as in accordance with the preamble of claim 1, uses a layer of relatively high permeability material to improve the inductive coupling between the two turns. In this known structure, as described in Patent Abstracts of Japan: Vol. 11, No. 161 [E-509], 23.05.87 and in published Japanese Patent Application 61-294850, an electrically conductive spiral 2 is arranged on a semiconductor substrate 1. A second turn 28 comprises a single loop which is spaced from the spiral 2 by an electrically insulating layer 4. A ferromagnetic layer 31 is embedded in the insulating layer 29 between the spiral 2 and the winding 28. Since the ferroelectric layer 31 is arranged between the spiral 2 and the winding 28 rather than within the central opening of the same, it is not effective in significantly increasing the inductive coupling between these two conductors. Thus, with the known structures it is difficult to achieve high mutual inductance and high efficiency of the transformer.

Es ist eine Aufgabe der Erfindung, einen Transformator gemäß dem Oberbegriff von Anspruch 1 mit größerer Gegeninduktivität und höherem Wirkungsgrad zu versehen.It is an object of the invention to provide a transformer according to the preamble of claim 1 with greater mutual inductance and higher efficiency.

Ein erfindungsgemäßer Transformator ist dadurch gekennzeichnet, dass die erste und die zweite Windung sowie der elektrisch isolierende Film eine gemeinsame zentrale Öffnung aufweisen und ein magnetisches Material an der Oberfläche des Substrats in der gemeinsamen zentralen Öffnung angeordnet ist, das die induktive Kopplung zwischen der ersten und zweiten Windung erhöht.A transformer according to the invention is characterized in that the first and second windings and the electrically insulating film have a common central opening and a magnetic material is arranged on the surface of the substrate in the common central opening, which increases the inductive coupling between the first and second windings.

Das Vorhandenseins eines Ferrits innerhalb der Öffnung der Windungen verbessert die gegenseitige Kopplung der Windungen und das Transformatorfunktionsvermögen im Vergleich mit bekannten Transformatoren.The presence of a ferrite inside the opening of the windings improves the mutual coupling of the windings and the transformer functionality compared to known transformers.

Nachfolgend werden Ausführungsbeispiele der Erfindung in Verbindung mit jeweiligem Stand der Technik erörtert, um die durch die Erfindung erzielten Verbesserungen zu veranschaulichen. In den Zeichnungen ist folgendes dargestellt:In the following, embodiments of the invention are discussed in conjunction with the respective prior art in order to illustrate the improvements achieved by the invention. The following is shown in the drawings:

Fig. 1 ist eine Draufsicht auf einen bekannten Transformator, der zwei auf derselben Fläche angeordnete spiralförmige Induktoren verwendet;Fig. 1 is a plan view of a known transformer using two spiral inductors arranged on the same surface;

Fig. 2 ist eine perspektivische Ansicht eines bekannten Transformators, der zwei auf verschiedenen Flächen angeordnete spiralförmige Induktoren verwendet, wobei ein Isolierfilm dazwischenliegt;Fig. 2 is a perspective view of a known transformer using two spiral inductors arranged on different surfaces with an insulating film therebetween;

Fig. 3(a), 3(b) und 3(c) sind eine Schnittansicht bzw. zwei Draufsichten eines bekannten Transformators, der eine magnetische Lage zwischen Spulen verwendet;Figs. 3(a), 3(b) and 3(c) are a sectional view and two plan views, respectively, of a known transformer using a magnetic sheet between coils;

Fig. 4(a), 4(b) und 4(c) sind eine Draufsicht, eine Schnittansicht bzw. eine perspektivische Ansicht eines Transformators gemäß einem ersten Ausführungsbeispiel der Erfindung; undFig. 4(a), 4(b) and 4(c) are a plan view, a sectional view and a perspective view, respectively, of a transformer according to a first embodiment of the invention; and

Fig. 5(a), 5(b) und 5(c) sind eine Draufsicht, eine Schnittansicht bzw. eine perspektivische Ansicht eines Transformators gemäß einem zweiten Ausführungsbeispiel der Erfindung.Figs. 5(a), 5(b) and 5(c) are a plan view, a sectional view and a perspective view, respectively, of a transformer according to a second embodiment of the invention.

Die Fig. 4(a), 4(b) und 4(c) sind eine Draufsicht, eine Schnittansicht bzw. eine perspektivische Ansicht eines in eine integrierte Halbleiterschaltung integrierbaren Transformators gemäß einem ersten Ausführungsbeispiel der Erfindung. Bei dieser Struktur ist eine einzelne Windung 28 aus einem dünnen Metallfilm auf der Oberfläche eines Halbleitersubstrats wie eines solchen aus Galliumarsenid angeordnet. Die Windung 28 enthält ein Paar Zuleitungen 32. Ein elektrisch isolierender Film 33, wie ein solcher aus SiN oder SiON, ist auf der Windung 28 angeordnet. Eine andere einzelne Windung 34 ist auf dem Isolator 33 unmittelbar über der Windung 28, dieser gegenüberstehend, angeordnet. Die Windung 34 enthält Zuleitungen 35. Die Windungen 28 und 34 sowie der Isolierfilm 33 weisen gemeinsame zentrale Öffnungen auf, die im wesentlichen zueinander ausgerichtet sind, um für einen gemeinsamen Kern zu sorgen. Ein ferromagnetischer Körper 36, wie ein Ferrit, ist innerhalb dieser gemeinsamen, zentralen Öffnung angeordnet, um die Gegeninduktivität der Windungen 28 und 34 zu verbessern. Die magnetische Permeabilität des Körpers 36 ist deutlich größer als die des Substrats 1. Darüber hinaus gewährleistet die Anordnung dieses magnetischen Körpers innerhalb des gemeinsamen Kerns der zwei Windungen 28 und 34 gute magnetische Kopplung zwischen diesen Windungen. Im Ergebnis wird aufgrund dieses Ausführungsbeispiels der Erfindung eine relativ hohe Gegeninduktivität, d.h. ein Transformator mit hohem Wirkungsgrad, erhalten. Wie es in der Technik wohlbekannt ist, kann die Permeabilität von Ferritmaterialien ungefähr 25 Hundert betragen, was für sehr starke Kopplung zwischen den zwei Windungen 28 und 34 sorgt. Wie es in den Fig. 4(a) und 4(c) veranschaulicht ist, sind die Zuleitungen 32 und 35 der jeweiligen Windungen vorzugsweise in verschiedenen Richtungen ausgerichtet, um eine unerwünschte kapazitive Kopplung zwischen ihnen zu vermeiden.4(a), 4(b) and 4(c) are a plan view, a sectional view and a perspective view, respectively, of a transformer integrable into a semiconductor integrated circuit according to a first embodiment of the invention. In this structure, a single turn 28 of a thin metal film is disposed on the surface of a semiconductor substrate such as gallium arsenide. The turn 28 includes a pair of leads 32. An electrically insulating film 33 such as SiN or SiON is disposed on the turn 28. Another single turn 34 is disposed on the insulator 33 immediately above and opposite the turn 28. The turn 34 includes leads 35. The turns 28 and 34 and the insulating film 33 have common central openings which are substantially aligned with each other to provide a common core. A ferromagnetic body 36, such as a ferrite, is arranged within this common central opening to improve the mutual inductance of the windings 28 and 34. The magnetic permeability of the body 36 is significantly greater than that of the substrate 1. In addition Furthermore, the arrangement of this magnetic body within the common core of the two windings 28 and 34 ensures good magnetic coupling between these windings. As a result, a relatively high mutual inductance, i.e. a high efficiency transformer, is obtained due to this embodiment of the invention. As is well known in the art, the permeability of ferrite materials can be about 25 hundred, which provides very strong coupling between the two windings 28 and 34. As illustrated in Figs. 4(a) and 4(c), the leads 32 and 35 of the respective windings are preferably oriented in different directions to avoid undesirable capacitive coupling between them.

Die Strukturen der Fig. 4(a)-4(c) werden leicht unter Verwendung herkömmlicher Techniken für Halbleiterbauteile aufgebaut, wie durch Strukturierung von Metall- und Isolierschichten durch Photolithographie, und sie können als Teil einer integrierten Schaltung auf einem Substrat ausgebildet werden, das miteinander verbundene aktive und passive Schaltungselemente aufweist. Der ferromagnetische Körper 36 kann gesondert hergestellt werden und in der gemeinsamen zentralen Öffnung der Windungen und des Isolierfilms 33 angeordnet werden. Alternativ kann das ferromagnetische Material in der gemeinsamen Öffnung der Windungen und der Isolierschicht durch Siebdruck oder eine andere Abscheidungstechnik abgeschieden werden, gefolgt von einem Aushärten und/oder anderen Schritten, die dazu erforderlich sind, für die gewünschten ferromagnetischen Eigenschaften zu sorgen. Vorzugsweise wird das ferromagnetische Material abgeschieden, nachdem die beiden Windungen 28 und 34 sowie der Isolierfilm 33 abgeschieden und strukturiert wurden.The structures of Figures 4(a)-4(c) are readily constructed using conventional semiconductor device techniques, such as patterning metal and insulating layers by photolithography, and can be formed as part of an integrated circuit on a substrate having interconnected active and passive circuit elements. The ferromagnetic body 36 can be separately manufactured and disposed in the common central opening of the turns and insulating film 33. Alternatively, the ferromagnetic material can be deposited in the common opening of the turns and insulating layer by screen printing or other deposition technique, followed by curing and/or other steps necessary to provide the desired ferromagnetic properties. Preferably, the ferromagnetic material is deposited after the two turns 28 and 34 and insulating film 33 have been deposited and patterned.

In den Fig. 5(a), 5(b) und 5(c) ist eine Erweiterung der in den Fig. 4(a)- 4(c) dargestellten Struktur in einer Draufsicht, einer Schnittansicht bzw. einer perspektivischen Ansicht dargestellt. Die Struktur der Fig. 5(a)-5(c) ist identisch mit der von 4(a)-4(c), mit der Ausnahme, dass auf der Windung 34 ein zweiter Isolierfilm 37 angeordnet ist und auf diesem Isolierfilm 37 eine dritte Windung 38 angeordnet ist. Diese dritte Windung 38 umfasst Zuleitungen 39. Die Zuleitungen jeder der drei Windungen sind in verschiedenen Richtungen ausgerichtet. Der magnetische Körper 36 erstreckt sich der Höhe nach so, dass er den gemeinsamen Kern der drei Windungen und der zwei dazwischenliegenden Isolierschichten auffüllt. Zusätzliche Windungen und Isolierfilme können zum Stapel hinzugefügt werden. Dieses Ausführungsbeispiel wird auf dieselbe Weise wie das Ausführungsbeispiel der Fig. 4(a)- 4(c) hergestellt, mit der Ausnahme, dass zum Abscheiden des zweiten Isolierfilms 37 und des die Windung 38 bildenden elektrischen Leiters zusätzliche Schritte erforderlich sind. Es wird dieselbe wünschenswerte, große, wechselseitige induktive Kopplung wie beim früheren Ausführungsbeispiel erhalten, mit der Ausnahme, dass die Kopplung zwischen drei Windungen statt zwischen zweien erfolgt. Bei diesen Strukturen ist die Richtung der gegenseitigen Kopplung im wesentlichen rechtwinklig zur Substratoberfläche.In Figs. 5(a), 5(b) and 5(c) an extension of the structure shown in Figs. 4(a)-4(c) is shown in a plan view, a sectional view and a perspective view, respectively. The structure of Figs. 5(a)-5(c) is identical to that of 4(a)-4(c) except that a second insulating film 37 is disposed on the winding 34 and a third winding 38 is disposed on this insulating film 37. This third winding 38 includes leads 39. The leads of each of the three windings are oriented in different directions. The magnetic body 36 extends in height to fill the common core of the three windings and the two intermediate insulating layers. Additional windings and insulating films can be added to the stack. This embodiment is manufactured in the same manner as the embodiment of Fig. 4(a)-4(c), except that for depositing the second insulating film 37 and the electrical conductor forming the turn 38. The same desirable, large, mutual inductive coupling is obtained as in the previous embodiment, except that the coupling is between three turns instead of two. In these structures, the direction of the mutual coupling is substantially perpendicular to the substrate surface.

Da es durch die Technologie für monilithisch-integrierte Schaltungen am einfachsten ist, Transformatoren mit einzelnen Windungen herzustellen, haben integrierbare Transformatoren von natur aus niedrige Induktivitäten und niedrige Gegeninduktivitäten zwischen Windungen. Bei der Erfindung sind die Gegeninduktivität und der Transformatorwirkungsgrad bei einzelnen Windungen deutlich erhöht, da das ferromagnetische Material sehr nahe an den Transformatorwindungen angeordnet ist.Since monolithic integrated circuit technology makes it easiest to manufacture single-turn transformers, integrated transformers inherently have low inductances and low mutual inductances between turns. In the invention, the mutual inductance and transformer efficiency for single turns are significantly increased because the ferromagnetic material is arranged very close to the transformer turns.

Claims (6)

1. Transformator, der in einer integrierten Halbleiterschaltung integrierbar ist, mit:1. Transformer that can be integrated into a semiconductor integrated circuit, with: - einem Halbleitersubstrat (1) mit einer ersten Fläche;- a semiconductor substrate (1) having a first surface; - einem ersten elektrischen Leiter (28), der auf der ersten Fläche des Substrats (1) angeordnet ist und eine erste Windung mit einem ersten Paar Zuleitungen (32) aufweist;- a first electrical conductor (28) arranged on the first surface of the substrate (1) and having a first turn with a first pair of leads (32); - einem ersten elektrisch isolierenden Film (33), der auf dem ersten elektrischen Leiter (28) angeordnet ist; und- a first electrically insulating film (33) arranged on the first electrical conductor (28); and - einem zweiten elektrischen Leiter (34), der auf dem elektrisch isolierenden Film (33) angeordnet ist und eine zweite Windung mit einem zweiten Paar Zuleitungen (35) aufweist;- a second electrical conductor (34) arranged on the electrically insulating film (33) and having a second turn with a second pair of leads (35); dadurch gekennzeichnet, dasscharacterized in that - die erste und die zweite Windung und der elektrisch isolierende Film eine gemeinsame, zentrale Öffnung aufweisen; und- the first and second turns and the electrically insulating film have a common central opening; and - ein magnetisches Material (36) auf der Oberfläche des Substrats (1) in der gemeinsamen, zentralen Öffnung angeordnet ist, was die induktive Kopplung zwischen der ersten und zweiten Windung erhöht.- a magnetic material (36) is arranged on the surface of the substrate (1) in the common central opening, which increases the inductive coupling between the first and second windings. 2. Transformator nach Anspruch 1, dadurch gekennzeichnet, dass das magnetische Material (36) aus einem Ferritkörper besteht.2. Transformer according to claim 1, characterized in that the magnetic material (36) consists of a ferrite body. 3. Transformator nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, dass der elektrisch isolierende Film (33) aus der aus SiN und SiON bestehenden Gruppe ausgewählt ist.3. Transformer according to one of claims 1 or 2, characterized in that the electrically insulating film (33) is selected from the group consisting of SiN and SiON. 4. Transformator nach Anspruch 1, dadurch gekennzeichnet, dass die Paar der Zuleitungen (32, 35) der ersten und der zweiten Windung in verschiedenen Richtungen ausgerichtet sind, um die Kopplung zwischen diesen jeweiligen Zuleitungspaaren zu minimieren.4. Transformer according to claim 1, characterized in that the pairs of leads (32, 35) of the first and second turns are oriented in different directions to minimize the coupling between these respective lead pairs. 5. Transformator nach Anspruch 1, dadurch gekennzeichnet, dass das Substrat (1) aus der aus Galliumarsenid und Indiumphosphid bestehenden Gruppe ausgewählt ist.5. Transformer according to claim 1, characterized in that the substrate (1) is selected from the group consisting of gallium arsenide and indium phosphide. 6. Transformator nach Anspruch 1, ferner gekennzeichnet durch einen zweiten elektrisch isolierenden Film (37), der auf dem zweiten elektrischen Leiter (34) angeordnet ist, und einen dritten elektrischen Leiter (38), der auf dem zweiten elektrisch isolierenden Film (37) so angeordnet ist, dass er dem zweiten elektrischen Leiter (34) gegenübersteht, mit einer dritten Windung und einem dritten Paar Zuleitungen (39), wobei der zweite elektrisch isolierende Film (37) und der dritte elektrische Leiter (38) jeweilige zentrale Öffnungen aufweisen, die mit der gemeinsamen, zentralen Öffnung der ersten und zweiten Windung ausgerichtet sind.6. A transformer according to claim 1, further characterized by a second electrically insulating film (37) disposed on the second electrical conductor (34) and a third electrical conductor (38) disposed on the second electrically insulating film (37) such that it faces the second electrical conductor (34), with a third turn and a third pair of leads (39), the second electrically insulating film (37) and the third electrical conductor (38) having respective central openings aligned with the common central opening of the first and second turns.
DE69030123T 1989-08-18 1990-08-17 Inductive structures for semiconducting integrated circuits Expired - Fee Related DE69030123T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1213839A JPH0377360A (en) 1989-08-18 1989-08-18 Semiconductor device

Publications (2)

Publication Number Publication Date
DE69030123D1 DE69030123D1 (en) 1997-04-10
DE69030123T2 true DE69030123T2 (en) 1997-09-18

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DE69032792T Expired - Fee Related DE69032792T2 (en) 1989-08-18 1990-08-17 Integrable transformer with integrated semiconducting circuit and its manufacturing process
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Families Citing this family (226)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2941484B2 (en) * 1991-05-31 1999-08-25 株式会社東芝 Plane transformer
CA2072277A1 (en) * 1991-07-03 1993-01-04 Nobuo Shiga Inductance element
US5336921A (en) * 1992-01-27 1994-08-09 Motorola, Inc. Vertical trench inductor
JP3141562B2 (en) * 1992-05-27 2001-03-05 富士電機株式会社 Thin film transformer device
EP0588503B1 (en) * 1992-09-10 1998-10-07 National Semiconductor Corporation Integrated circuit magnetic memory element and method of making same
EP0600540B1 (en) * 1992-11-30 1998-02-11 Koninklijke Philips Electronics N.V. Colour diplay tube including a convergence correction device
WO1994017558A1 (en) * 1993-01-29 1994-08-04 The Regents Of The University Of California Monolithic passive component
TW275152B (en) * 1993-11-01 1996-05-01 Ikeda Takeshi
US5497028A (en) * 1993-11-10 1996-03-05 Ikeda; Takeshi LC element and semiconductor device having a signal transmission line and LC element manufacturing method
JP3463759B2 (en) * 1993-12-29 2003-11-05 ソニー株式会社 Magnetic head and method of manufacturing the same
US5478773A (en) * 1994-04-28 1995-12-26 Motorola, Inc. Method of making an electronic device having an integrated inductor
US5610433A (en) * 1995-03-13 1997-03-11 National Semiconductor Corporation Multi-turn, multi-level IC inductor with crossovers
KR100231356B1 (en) * 1994-09-12 1999-11-15 모리시타요이찌 Multilayer Ceramic Chip Inductor and Manufacturing Method Thereof
US6911887B1 (en) 1994-09-12 2005-06-28 Matsushita Electric Industrial Co., Ltd. Inductor and method for producing the same
US5446311A (en) * 1994-09-16 1995-08-29 International Business Machines Corporation High-Q inductors in silicon technology without expensive metalization
US5647966A (en) * 1994-10-04 1997-07-15 Matsushita Electric Industrial Co., Ltd. Method for producing a conductive pattern and method for producing a greensheet lamination body including the same
DE4437721A1 (en) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Contactless electronic module
US5635892A (en) * 1994-12-06 1997-06-03 Lucent Technologies Inc. High Q integrated inductor
US5545916A (en) * 1994-12-06 1996-08-13 At&T Corp. High Q integrated inductor
US6033764A (en) * 1994-12-16 2000-03-07 Zecal Corp. Bumped substrate assembly
US5716713A (en) * 1994-12-16 1998-02-10 Ceramic Packaging, Inc. Stacked planar transformer
JP3487461B2 (en) * 1994-12-17 2004-01-19 ソニー株式会社 Transformers and amplifiers
EP0803981B1 (en) * 1995-01-12 2002-04-10 Takeshi Ikeda Tuning circuit
WO1996021969A1 (en) * 1995-01-12 1996-07-18 Takeshi Ikeda Tuning circuit
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor
US6496382B1 (en) 1995-05-19 2002-12-17 Kasten Chase Applied Research Limited Radio frequency identification tag
CA2176625C (en) * 1995-05-19 2008-07-15 Donald Harold Fergusen Radio frequency identification tag
DE19522043A1 (en) * 1995-06-17 1996-12-19 Bosch Gmbh Robert Inductive component
DE19523521A1 (en) * 1995-06-30 1997-01-02 Licentia Gmbh Electrical transponder coil and circuit assembly
US5742091A (en) * 1995-07-12 1998-04-21 National Semiconductor Corporation Semiconductor device having a passive device formed over one or more deep trenches
US5656849A (en) * 1995-09-22 1997-08-12 International Business Machines Corporation Two-level spiral inductor structure having a high inductance to area ratio
DE69519476T2 (en) * 1995-12-07 2001-06-28 Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Manufacturing process for a magnetic circuit in an integrated circuit
US5760456A (en) * 1995-12-21 1998-06-02 Grzegorek; Andrew Z. Integrated circuit compatible planar inductors with increased Q
JP2765547B2 (en) * 1995-12-27 1998-06-18 日本電気株式会社 Semiconductor device and manufacturing method thereof
JP2904086B2 (en) * 1995-12-27 1999-06-14 日本電気株式会社 Semiconductor device and manufacturing method thereof
US5610569A (en) * 1996-01-31 1997-03-11 Hughes Electronics Staggered horizontal inductor for use with multilayer substrate
SE510443C2 (en) * 1996-05-31 1999-05-25 Ericsson Telefon Ab L M Inductors for integrated circuits
US6492705B1 (en) * 1996-06-04 2002-12-10 Intersil Corporation Integrated circuit air bridge structures and methods of fabricating same
US5793272A (en) * 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
US5831331A (en) * 1996-11-22 1998-11-03 Philips Electronics North America Corporation Self-shielding inductor for multi-layer semiconductor integrated circuits
EP0886874B1 (en) * 1996-12-30 2003-04-09 Koninklijke Philips Electronics N.V. Device comprising an integrated coil
US5892425A (en) * 1997-04-10 1999-04-06 Virginia Tech Intellectual Properties, Inc. Interwound center-tapped spiral inductor
KR100233237B1 (en) 1997-09-10 1999-12-01 정선종 Fine inductor having 3-dimensional coil structure and method for forming the same
DE19739962C2 (en) * 1997-09-11 2000-05-18 Siemens Ag Planar, coupled coil arrangement
ES2259819T3 (en) 1997-10-22 2006-10-16 Bae Systems Bofors Ab INTEGRATED ELECTRONIC CIRCUIT INCLUDING AN OSCILLATOR AND PASSIVE CIRCUIT ELEMENTS.
US20030042571A1 (en) * 1997-10-23 2003-03-06 Baoxing Chen Chip-scale coils and isolators based thereon
EP0915513A1 (en) 1997-10-23 1999-05-12 STMicroelectronics S.r.l. High quality factor, integrated inductor and production method thereof
US5929729A (en) * 1997-10-24 1999-07-27 Com Dev Limited Printed lumped element stripline circuit ground-signal-ground structure
FR2771843B1 (en) * 1997-11-28 2000-02-11 Sgs Thomson Microelectronics INTEGRATED CIRCUIT TRANSFORMER
KR100279753B1 (en) * 1997-12-03 2001-03-02 정선종 Inductor manufacturing method using semiconductor integrated circuit manufacturing process
US6169320B1 (en) * 1998-01-22 2001-01-02 Raytheon Company Spiral-shaped inductor structure for monolithic microwave integrated circuits having air gaps in underlying pedestal
US5952893A (en) * 1998-03-06 1999-09-14 International Business Machines Corporation Integrated circuit inductors for use with electronic oscillators
JPH11273949A (en) * 1998-03-24 1999-10-08 Tif:Kk Inductor element
SE512699C2 (en) * 1998-03-24 2000-05-02 Ericsson Telefon Ab L M An inductance device
US6008102A (en) * 1998-04-09 1999-12-28 Motorola, Inc. Method of forming a three-dimensional integrated inductor
JPH11317621A (en) 1998-05-07 1999-11-16 Tif:Kk LC oscillator
US6472285B1 (en) * 1999-04-30 2002-10-29 Winbond Electronics Corporation Method for fabricating high-Q inductance device in monolithic technology
US6426267B2 (en) * 1998-06-19 2002-07-30 Winbond Electronics Corp. Method for fabricating high-Q inductance device in monolithic technology
DE69840827D1 (en) * 1998-06-30 2009-06-25 Asulab Sa Inductive sensor
EP0991123A1 (en) * 1998-10-01 2000-04-05 EM Microelectronic-Marin SA Microstructure with a magnetic antenna or a magnetic detector
US6201287B1 (en) 1998-10-26 2001-03-13 Micron Technology, Inc. Monolithic inductance-enhancing integrated circuits, complementary metal oxide semiconductor (CMOS) inductance-enhancing integrated circuits, inductor assemblies, and inductance-multiplying methods
US6249191B1 (en) 1998-11-23 2001-06-19 Micron Technology, Inc. Monolithic integrated circuit oscillators, complementary metal oxide semiconductor (CMOS) voltage-controlled oscillators, integrated circuit oscillators, oscillator-forming methods, and oscillation methods
US7531417B2 (en) * 1998-12-21 2009-05-12 Megica Corporation High performance system-on-chip passive device using post passivation process
US8178435B2 (en) * 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US6566731B2 (en) * 1999-02-26 2003-05-20 Micron Technology, Inc. Open pattern inductor
FR2790328B1 (en) 1999-02-26 2001-04-20 Memscap INDUCTIVE COMPONENT, INTEGRATED TRANSFORMER, IN PARTICULAR INTENDED TO BE INCORPORATED IN A RADIOFREQUENCY CIRCUIT, AND INTEGRATED CIRCUIT ASSOCIATED WITH SUCH AN INDUCTIVE COMPONENT OR INTEGRATED TRANSFORMER
US6239664B1 (en) 1999-03-05 2001-05-29 Rf Monolithics, Inc. Low phase noise, wide tuning range oscillator utilizing a one port saw resonator and method of operation
US6218729B1 (en) * 1999-03-11 2001-04-17 Atmel Corporation Apparatus and method for an integrated circuit having high Q reactive components
US6037649A (en) * 1999-04-01 2000-03-14 Winbond Electronics Corp. Three-dimension inductor structure in integrated circuit technology
US6180995B1 (en) * 1999-05-06 2001-01-30 Spectrian Corporation Integrated passive devices with reduced parasitic substrate capacitance
EP1195780B1 (en) * 1999-05-18 2008-08-06 Niigata Seimitsu Co., Ltd. Inductor element
US6380608B1 (en) 1999-06-01 2002-04-30 Alcatel Usa Sourcing L.P. Multiple level spiral inductors used to form a filter in a printed circuit board
JP2001023821A (en) 1999-07-07 2001-01-26 Tif:Kk Inductor element
WO2001004953A1 (en) * 1999-07-08 2001-01-18 Korea Advanced Institute Of Science And Technology Method for manufacturing a semiconductor device having a metal layer floating over a substrate
US6240622B1 (en) * 1999-07-09 2001-06-05 Micron Technology, Inc. Integrated circuit inductors
JP2001044754A (en) * 1999-07-26 2001-02-16 Niigata Seimitsu Kk LC oscillator
JP2001052928A (en) * 1999-08-17 2001-02-23 Tif:Kk Inductor element
US6501363B1 (en) * 1999-11-03 2002-12-31 Innosys, Inc. Vertical transformer
US6476704B2 (en) 1999-11-18 2002-11-05 The Raytheon Company MMIC airbridge balun transformer
US6870456B2 (en) * 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6891461B2 (en) 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
US6815220B2 (en) * 1999-11-23 2004-11-09 Intel Corporation Magnetic layer processing
US6856228B2 (en) * 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
DE10029630C2 (en) * 2000-06-15 2002-04-18 Bosch Gmbh Robert Device for protecting electronic components against destruction by electrostatic discharge
US6917245B2 (en) 2000-09-12 2005-07-12 Silicon Laboratories, Inc. Absolute power detector
US6549071B1 (en) 2000-09-12 2003-04-15 Silicon Laboratories, Inc. Power amplifier circuitry and method using an inductance coupled to power amplifier switching devices
US6437653B1 (en) * 2000-09-28 2002-08-20 Sun Microsystems, Inc. Method and apparatus for providing a variable inductor on a semiconductor chip
US6816012B2 (en) * 2000-10-10 2004-11-09 California Institute Of Technology Distributed circular geometry power amplifier architecture
US6890829B2 (en) * 2000-10-24 2005-05-10 Intel Corporation Fabrication of on-package and on-chip structure using build-up layer process
US6714113B1 (en) * 2000-11-14 2004-03-30 International Business Machines Corporation Inductor for integrated circuits
US6458611B1 (en) 2001-03-07 2002-10-01 Intel Corporation Integrated circuit device characterization
US6639298B2 (en) 2001-06-28 2003-10-28 Agere Systems Inc. Multi-layer inductor formed in a semiconductor substrate
US6667536B2 (en) * 2001-06-28 2003-12-23 Agere Systems Inc. Thin film multi-layer high Q transformer formed in a semiconductor substrate
US6759275B1 (en) * 2001-09-04 2004-07-06 Megic Corporation Method for making high-performance RF integrated circuits
US20030112110A1 (en) * 2001-09-19 2003-06-19 Mark Pavier Embedded inductor for semiconductor device circuit
FR2830126B1 (en) * 2001-09-26 2004-10-01 St Microelectronics Sa MONOLITHIC CIRCUIT INDUCTANCE
US6635948B2 (en) * 2001-12-05 2003-10-21 Micron Technology, Inc. Semiconductor device with electrically coupled spiral inductors
US6614093B2 (en) * 2001-12-11 2003-09-02 Lsi Logic Corporation Integrated inductor in semiconductor manufacturing
JP3634305B2 (en) 2001-12-14 2005-03-30 三菱電機株式会社 Multilayer inductance element
DE10217387B4 (en) * 2002-04-18 2018-04-12 Snaptrack, Inc. Electrical matching network with a transformation line
KR20050029232A (en) * 2002-07-23 2005-03-24 코닌클리즈케 필립스 일렉트로닉스 엔.브이. Multi-tap coil
DE10262239B4 (en) 2002-09-18 2011-04-28 Infineon Technologies Ag Digital signal transmission method
KR100466542B1 (en) * 2002-11-13 2005-01-15 한국전자통신연구원 Stacked Variable Inductor
US6894565B1 (en) 2002-12-03 2005-05-17 Silicon Laboratories, Inc. Fast settling power amplifier regulator
US6894593B2 (en) * 2003-02-12 2005-05-17 Moog Inc. Torque motor
US6897730B2 (en) 2003-03-04 2005-05-24 Silicon Laboratories Inc. Method and apparatus for controlling the output power of a power amplifier
JP2004319763A (en) * 2003-04-16 2004-11-11 Shinko Electric Ind Co Ltd Inductor element and electronic circuit device
US7075329B2 (en) * 2003-04-30 2006-07-11 Analog Devices, Inc. Signal isolators using micro-transformers
US7852185B2 (en) * 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
JP3983199B2 (en) 2003-05-26 2007-09-26 沖電気工業株式会社 Semiconductor device and manufacturing method thereof
TWI236763B (en) * 2003-05-27 2005-07-21 Megic Corp High performance system-on-chip inductor using post passivation process
DE10329143B4 (en) * 2003-06-27 2005-09-01 Infineon Technologies Ag Electronic module and method of making the same
JP2005236482A (en) * 2004-02-18 2005-09-02 Fujitsu Ltd LC oscillator
DE102004022176B4 (en) 2004-05-05 2009-07-23 Atmel Germany Gmbh Method for producing passive components on a substrate
CN1251255C (en) * 2004-05-10 2006-04-12 阎跃军 Adjustable inductor
US7737871B2 (en) * 2004-06-03 2010-06-15 Silicon Laboratories Inc. MCU with integrated voltage isolator to provide a galvanic isolation between input and output
US7302247B2 (en) * 2004-06-03 2007-11-27 Silicon Laboratories Inc. Spread spectrum isolator
US7376212B2 (en) * 2004-06-03 2008-05-20 Silicon Laboratories Inc. RF isolator with differential input/output
US7447492B2 (en) * 2004-06-03 2008-11-04 Silicon Laboratories Inc. On chip transformer isolator
US7577223B2 (en) * 2004-06-03 2009-08-18 Silicon Laboratories Inc. Multiplexed RF isolator circuit
US8441325B2 (en) * 2004-06-03 2013-05-14 Silicon Laboratories Inc. Isolator with complementary configurable memory
US7421028B2 (en) * 2004-06-03 2008-09-02 Silicon Laboratories Inc. Transformer isolator for digital power supply
US7902627B2 (en) * 2004-06-03 2011-03-08 Silicon Laboratories Inc. Capacitive isolation circuitry with improved common mode detector
US7460604B2 (en) * 2004-06-03 2008-12-02 Silicon Laboratories Inc. RF isolator for isolating voltage sensing and gate drivers
US7821428B2 (en) 2004-06-03 2010-10-26 Silicon Laboratories Inc. MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link
US7738568B2 (en) * 2004-06-03 2010-06-15 Silicon Laboratories Inc. Multiplexed RF isolator
US8169108B2 (en) 2004-06-03 2012-05-01 Silicon Laboratories Inc. Capacitive isolator
US8198951B2 (en) * 2004-06-03 2012-06-12 Silicon Laboratories Inc. Capacitive isolation circuitry
KR100548388B1 (en) * 2004-07-20 2006-02-02 삼성전자주식회사 Low Loss Inductor Device and Manufacturing Method Thereof
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
US7355282B2 (en) * 2004-09-09 2008-04-08 Megica Corporation Post passivation interconnection process and structures
US20060077029A1 (en) * 2004-10-07 2006-04-13 Freescale Semiconductor, Inc. Apparatus and method for constructions of stacked inductive components
US7533068B2 (en) 2004-12-23 2009-05-12 D-Wave Systems, Inc. Analog processor comprising quantum devices
US7750434B2 (en) * 2005-01-31 2010-07-06 Sanyo Electric Co., Ltd. Circuit substrate structure and circuit apparatus
US7262681B2 (en) 2005-02-11 2007-08-28 Semiconductor Components Industries, L.L.C. Integrated semiconductor inductor and method therefor
JP4509826B2 (en) * 2005-03-03 2010-07-21 日本電信電話株式会社 Inductor
US8384189B2 (en) * 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
US7499124B2 (en) * 2005-05-05 2009-03-03 Industrial Technology Research Institute Polymer dispersed liquid crystal device conditioned with a predetermined anchoring energy, a predetermined polymer concentration by weight percent and a predetermined cell gap to enhance phase separation and to make smaller and more uniform liquid crystal droplets
US7257882B2 (en) * 2005-05-19 2007-08-21 International Business Machines Corporation Multilayer coil assembly and method of production
US8134548B2 (en) 2005-06-30 2012-03-13 Micron Technology, Inc. DC-DC converter switching transistor current measurement technique
US7443362B2 (en) 2005-07-19 2008-10-28 3M Innovative Properties Company Solenoid antenna
TWI320219B (en) * 2005-07-22 2010-02-01 Method for forming a double embossing structure
US7511356B2 (en) * 2005-08-31 2009-03-31 Micron Technology, Inc. Voltage-controlled semiconductor inductor and method
TW200735138A (en) * 2005-10-05 2007-09-16 Koninkl Philips Electronics Nv Multi-layer inductive element for integrated circuit
JP4712615B2 (en) * 2006-06-01 2011-06-29 アルプス電気株式会社 Proximity contactless communication equipment
US7719305B2 (en) * 2006-07-06 2010-05-18 Analog Devices, Inc. Signal isolator using micro-transformers
US7999383B2 (en) * 2006-07-21 2011-08-16 Bae Systems Information And Electronic Systems Integration Inc. High speed, high density, low power die interconnect system
US7498908B2 (en) * 2006-08-04 2009-03-03 Advanced Energy Industries, Inc High-power PIN diode switch
JP4722795B2 (en) * 2006-08-31 2011-07-13 富士通株式会社 Wiring board and electronic component module
JP4028884B1 (en) * 2006-11-01 2007-12-26 Tdk株式会社 Coil parts
EP2084723A1 (en) 2006-11-14 2009-08-05 Nxp B.V. Manufacturing of an electronic circuit having an inductance
US8749021B2 (en) * 2006-12-26 2014-06-10 Megit Acquisition Corp. Voltage regulator integrated with semiconductor chip
CA2681138C (en) 2007-04-05 2016-06-07 D-Wave Systems Inc. Physical realizations of a universal adiabatic quantum computer
DE102007019811B4 (en) * 2007-04-26 2014-11-27 Infineon Technologies Ag Circuit, on-chip applied filter circuit and system
US8242872B2 (en) 2007-05-18 2012-08-14 Globalfoundries Singapore Pte. Ltd. Transformer with effective high turn ratio
US7570144B2 (en) 2007-05-18 2009-08-04 Chartered Semiconductor Manufacturing, Ltd. Integrated transformer and method of fabrication thereof
FR2916570A1 (en) 2007-05-23 2008-11-28 St Microelectronics Sa INDUCTIVE PLANE STRUCTURE
US7652355B2 (en) 2007-08-01 2010-01-26 Chartered Semiconductor Manufacturing, Ltd. Integrated circuit shield structure
US7956713B2 (en) * 2007-09-25 2011-06-07 Intel Corporation Forming a helical inductor
US9269485B2 (en) * 2007-11-29 2016-02-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method of creating spiral inductor having high Q value
US20090140383A1 (en) * 2007-11-29 2009-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Method of creating spiral inductor having high q value
TWI371766B (en) * 2007-12-26 2012-09-01 Via Tech Inc Inductor structure
US8138876B2 (en) * 2008-01-29 2012-03-20 International Business Machines Corporation On-chip integrated voltage-controlled variable inductor, methods of making and tuning such variable inductors, and design structures integrating such variable inductors
US7710215B2 (en) * 2008-02-04 2010-05-04 Infineon Technologies Austria Ag Semiconductor configuration having an integrated coupler and method for manufacturing such a semiconductor configuration
US8575731B2 (en) * 2008-06-17 2013-11-05 Panasonic Corporation Semiconductor device with a balun
JP5247367B2 (en) 2008-11-13 2013-07-24 ルネサスエレクトロニクス株式会社 RF power amplifier
SE534510C2 (en) * 2008-11-19 2011-09-13 Silex Microsystems Ab Functional encapsulation
EP2380415B1 (en) * 2008-12-26 2019-07-31 QUALCOMM Incorporated Chip packages with power management integrated circuits and related techniques
WO2010076187A2 (en) 2008-12-30 2010-07-08 Stmicroelectronics S.R.L. Integrated electronic device with transceiving antenna and magnetic interconnection
US8738105B2 (en) 2010-01-15 2014-05-27 D-Wave Systems Inc. Systems and methods for superconducting integrated circuts
US8093982B2 (en) * 2010-03-25 2012-01-10 Qualcomm Incorporated Three dimensional inductor and transformer design methodology of glass technology
JP2011217321A (en) * 2010-04-02 2011-10-27 Hitachi Ltd Peaking circuit, method for adjusting peaking, differential amplifier installing peaking circuit, laser diode driving circuit installing peaking circuit, and data processing unit installing peaking circuit
CN102376693B (en) * 2010-08-23 2016-05-11 香港科技大学 Monolithic magnetic induction device
JP5357136B2 (en) * 2010-12-22 2013-12-04 旭化成エレクトロニクス株式会社 Transformer
US8451032B2 (en) 2010-12-22 2013-05-28 Silicon Laboratories Inc. Capacitive isolator with schmitt trigger
TWM411643U (en) * 2011-01-17 2011-09-11 Yujing Technology Co Ltd Ultra-high power transformer
US8558344B2 (en) 2011-09-06 2013-10-15 Analog Devices, Inc. Small size and fully integrated power converter with magnetics on chip
US20130214890A1 (en) 2012-02-20 2013-08-22 Futurewei Technologies, Inc. High Current, Low Equivalent Series Resistance Printed Circuit Board Coil for Power Transfer Application
US8803648B2 (en) 2012-05-03 2014-08-12 Qualcomm Mems Technologies, Inc. Three-dimensional multilayer solenoid transformer
US9111933B2 (en) 2012-05-17 2015-08-18 International Business Machines Corporation Stacked through-silicon via (TSV) transformer structure
US8742539B2 (en) 2012-07-27 2014-06-03 Infineon Technologies Austria Ag Semiconductor component and method for producing a semiconductor component
US9431473B2 (en) * 2012-11-21 2016-08-30 Qualcomm Incorporated Hybrid transformer structure on semiconductor devices
US20140152410A1 (en) 2012-12-03 2014-06-05 Arizona Board of Regents, a body corporate of the State of Arizona Acting for and on behalf of Arizo Integrated tunable inductors
US8786393B1 (en) 2013-02-05 2014-07-22 Analog Devices, Inc. Step up or step down micro-transformer with tight magnetic coupling
JP5743034B2 (en) * 2013-02-19 2015-07-01 株式会社村田製作所 Inductor bridge and electronics
US10002700B2 (en) 2013-02-27 2018-06-19 Qualcomm Incorporated Vertical-coupling transformer with an air-gap structure
US9634645B2 (en) 2013-03-14 2017-04-25 Qualcomm Incorporated Integration of a replica circuit and a transformer above a dielectric substrate
US9293997B2 (en) 2013-03-14 2016-03-22 Analog Devices Global Isolated error amplifier for isolated power supplies
US9449753B2 (en) 2013-08-30 2016-09-20 Qualcomm Incorporated Varying thickness inductor
JP6221736B2 (en) * 2013-12-25 2017-11-01 三菱電機株式会社 Semiconductor device
JP5825457B1 (en) * 2014-02-14 2015-12-02 株式会社村田製作所 ANTENNA DEVICE AND WIRELESS COMMUNICATION DEVICE
US10002107B2 (en) 2014-03-12 2018-06-19 D-Wave Systems Inc. Systems and methods for removing unwanted interactions in quantum devices
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
US10536309B2 (en) 2014-09-15 2020-01-14 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US10270630B2 (en) 2014-09-15 2019-04-23 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US9660848B2 (en) 2014-09-15 2017-05-23 Analog Devices Global Methods and structures to generate on/off keyed carrier signals for signal isolators
US9998301B2 (en) 2014-11-03 2018-06-12 Analog Devices, Inc. Signal isolator system with protection for common mode transients
FR3038121B1 (en) * 2015-06-25 2017-08-18 Thales Sa IMPROVED TRANSFORMER FOR A CIRCUIT IN MMIC TECHNOLOGY
CN107924869B (en) * 2015-07-16 2022-01-25 超极存储器股份有限公司 Semiconductor device and method for manufacturing the same
US10720788B2 (en) 2015-10-09 2020-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Wireless charging devices having wireless charging coils and methods of manufacture thereof
US10636560B2 (en) * 2016-03-11 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Induction based current sensing
US10164614B2 (en) 2016-03-31 2018-12-25 Analog Devices Global Unlimited Company Tank circuit and frequency hopping for isolators
WO2017188077A1 (en) * 2016-04-25 2017-11-02 株式会社村田製作所 Inductor component
EP3293888B1 (en) 2016-09-13 2020-08-26 Allegro MicroSystems, LLC Signal isolator having bidirectional communication between die
DE102017102219B4 (en) 2017-02-06 2025-12-31 Sonova Consumer Hearing Gmbh Planar dynamic converter
US20180323369A1 (en) 2017-05-02 2018-11-08 Micron Technology, Inc. Inductors with through-substrate via cores
US10121739B1 (en) 2017-05-02 2018-11-06 Micron Technology, Inc. Multi-die inductors with coupled through-substrate via cores
US10134671B1 (en) 2017-05-02 2018-11-20 Micron Technology, Inc. 3D interconnect multi-die inductors with through-substrate via cores
US10872843B2 (en) * 2017-05-02 2020-12-22 Micron Technology, Inc. Semiconductor devices with back-side coils for wireless signal and power coupling
CN107731793B (en) * 2017-09-14 2019-12-17 建荣半导体(深圳)有限公司 Figure 8 inductor structure and semiconductor structure integrated on a semiconductor chip
WO2019126396A1 (en) 2017-12-20 2019-06-27 D-Wave Systems Inc. Systems and methods for coupling qubits in a quantum processor
FR3082046A1 (en) 2018-05-30 2019-12-06 Commissariat A L'energie Atomique Et Aux Energies Alternatives INTEGRATED CIRCUIT COMPRISING AN INDUCTANCE
US12266470B2 (en) * 2018-10-30 2025-04-01 Beihang University MEMS solenoid transformer and manufacturing method thereof
US11115244B2 (en) 2019-09-17 2021-09-07 Allegro Microsystems, Llc Signal isolator with three state data transmission
US11139552B1 (en) 2020-05-05 2021-10-05 Semiconductor Components Industries, Llc Method of forming a semiconductor device
US12536459B2 (en) 2020-06-30 2026-01-27 D-Wave Systems Inc. Systems and methods for coupling between qubits
WO2022115278A1 (en) 2020-11-24 2022-06-02 D-Wave Systems Inc. Systems, articles, and methods for a tunable capacitor
KR20220169152A (en) 2021-06-18 2022-12-27 삼성전자주식회사 Semiconductor device
TWI839620B (en) 2021-06-30 2024-04-21 立積電子股份有限公司 Semiconductor device and method of forming the same
JP7720179B2 (en) * 2021-07-07 2025-08-07 富士電機メーター株式会社 Current sensors and watt-hour meters
JP7706281B2 (en) * 2021-07-08 2025-07-11 富士電機メーター株式会社 Current Sensors and Power Meters
US12027476B2 (en) * 2022-01-13 2024-07-02 Qualcomm Incorporated Package comprising substrate with coupling element for integrated devices
KR20240012140A (en) * 2022-07-20 2024-01-29 삼성전자주식회사 Semiconductor apparatus having inductor structures
TWI830411B (en) 2022-09-29 2024-01-21 立積電子股份有限公司 Semiconductor device and method of forming the same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3504276A (en) * 1967-04-19 1970-03-31 American Mach & Foundry Printed circuit coils for use in magnetic flux leakage flow detection
US3881244A (en) * 1972-06-02 1975-05-06 Texas Instruments Inc Method of making a solid state inductor
JPS5091289A (en) * 1973-12-12 1975-07-21
US4071378A (en) * 1975-02-27 1978-01-31 General Electric Company Process of making a deep diode solid state transformer
US4080585A (en) * 1977-04-11 1978-03-21 Cubic Corporation Flat coil transformer for electronic circuit boards
JPS5727461A (en) * 1980-07-23 1982-02-13 Mitsubishi Electric Corp Magnetic recorder and reproducer
JPS59114807A (en) * 1982-12-21 1984-07-03 Matsushita Electric Ind Co Ltd printed multilayer coil
JPS60136156A (en) * 1983-12-26 1985-07-19 Toshiba Corp Laser-triggered xenon flash lamp
US4833513A (en) * 1985-01-20 1989-05-23 Tdk Corporation MOS FET semiconductor device having a cell pattern arrangement for optimizing channel width
JPS61201509A (en) * 1985-03-05 1986-09-06 Tdk Corp Lc type variable frequency filter
GB2173956B (en) * 1985-03-29 1989-01-05 Plessey Co Plc Improvements relating to electric transformers
JPS61248545A (en) * 1985-04-26 1986-11-05 Fujitsu Ltd Integrated circuit provided with inductor
JPS61265857A (en) * 1985-05-20 1986-11-25 Matsushita Electronics Corp Semiconductor device
JPS61294850A (en) * 1985-06-21 1986-12-25 Nec Corp Semiconductor integrated circuit device
AU6194486A (en) * 1985-09-02 1987-03-24 Hasler A.G. Inductive, electrically-controllable component
JPS62244160A (en) * 1986-04-17 1987-10-24 Mitsubishi Electric Corp Semiconductor device
US4785345A (en) * 1986-05-08 1988-11-15 American Telephone And Telegraph Co., At&T Bell Labs. Integrated transformer structure with primary winding in substrate
JPS63140560A (en) * 1986-12-02 1988-06-13 Mitsubishi Electric Corp Semiconductor monolithic bias power supply circuit
JPS63250165A (en) * 1987-04-06 1988-10-18 Mitsubishi Electric Corp semiconductor equipment
JPS63299394A (en) * 1987-05-29 1988-12-06 Matsushita Electric Ind Co Ltd printed wiring board
JPH0267752A (en) * 1988-09-01 1990-03-07 Nec Corp Semiconductor device
JP3123441B2 (en) * 1996-08-23 2001-01-09 鹿島建設株式会社 Laboratory tank

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JPH0377360A (en) 1991-04-02
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US5095357A (en) 1992-03-10
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DE69030123D1 (en) 1997-04-10
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EP0643404A3 (en) 1995-11-08
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EP0649152B1 (en) 1998-11-25
EP0643403B1 (en) 1997-03-05
EP0413348A3 (en) 1993-03-24
EP0413348B1 (en) 1996-03-27
EP0643404B1 (en) 1997-05-14
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DE69026164D1 (en) 1996-05-02
DE69030011T2 (en) 1997-09-04

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