DE69030123T2 - Inductive structures for semiconducting integrated circuits - Google Patents
Inductive structures for semiconducting integrated circuitsInfo
- Publication number
- DE69030123T2 DE69030123T2 DE69030123T DE69030123T DE69030123T2 DE 69030123 T2 DE69030123 T2 DE 69030123T2 DE 69030123 T DE69030123 T DE 69030123T DE 69030123 T DE69030123 T DE 69030123T DE 69030123 T2 DE69030123 T2 DE 69030123T2
- Authority
- DE
- Germany
- Prior art keywords
- insulating film
- electrically insulating
- electrical conductor
- transformer
- turns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/20—Inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
- H01F21/08—Variable inductances or transformers of the signal type continuously variable, e.g. variometers by varying the permeability of the core, e.g. by varying magnetic bias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H10W44/501—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0046—Printed inductances with a conductive path having a bridge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0086—Printed inductances on semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
Die Erfindung betrifft einen Transformator, der mit einer integrierten Halbleiterschaltung integrierbar ist, wie im Oberbegriff von Anspruch 1 beansprucht.The invention relates to a transformer which can be integrated with an integrated semiconductor circuit as claimed in the preamble of claim 1.
Als Transformatoren können mehrere Spiralwindungen verwendet werden, die induktiv gekoppelt sind. Ein Beispiel eines anderen bekannten Transformators, der zwei auf derselben Fläche angeordnete Spiralwindungen nutzt, ist in Draufsicht in Fig. 1 dargestellt. Hierbei ist eine elektrisch leitende Spirale 2 innerhalb einer elektrisch leitenden Spirale 12 angeordnet. Sowohl das Außenende 3 als auch das Innenende 4 der Spirale 2 benötigen Luftbrückenstrukturen 9, die sie gegen Spiralwindungen der Spirale 12 isolieren und diese überkreuzen, und die elektrischen Zugang zur Spirale 2 geben. Da die Spirale 12 außerhalb der Spirale 2 liegt, ist zum Außenende 13 der Spule 12 direkter Zugang verfügbar. Jedoch muss immer noch eine Luftbrückenstruktur 9 vorhanden sein, um für Zugang von außen zum Innenende 14 der Spirale 12 zu sorgen. Wegen des Vorhandenseins dreier Luftbrücken 9 leidet der Transformator von Fig. 1 unter Problemen durch parasitäre Kapazitäten. Außerdem ist die magnetische Kopplung zwischen den Spiralen 2 und 12 beschränkt, da in der Nachbarschaft dieser Windungen nur ein Material mit relativ niedriger Permeabilität, d.h. das Substrat 1, vorhanden ist.As transformers, multiple spiral turns can be used that are inductively coupled. An example of another known transformer that uses two spiral turns arranged on the same surface is shown in plan view in Fig. 1. Here, an electrically conductive spiral 2 is arranged inside an electrically conductive spiral 12. Both the outer end 3 and the inner end 4 of the spiral 2 require air bridge structures 9 that insulate them from and cross spiral turns of the spiral 12 and that provide electrical access to the spiral 2. Since the spiral 12 is outside the spiral 2, direct access is available to the outer end 13 of the coil 12. However, an air bridge structure 9 must still be present to provide access from the outside to the inner end 14 of the spiral 12. Due to the presence of three air bridges 9, the transformer of Fig. 1 suffers from parasitic capacitance problems. In addition, the magnetic coupling between the spirals 2 and 12 is limited since in the vicinity of these turns there is only one material with relatively low permeability, i.e. the substrate 1.
Eine andere bekannte Struktur eines Transformators ist in Explosionsansicht in Fig. 2 dargestellt. Diese Transformatorstruktur enthält ein elektrisch isolierendes Substrat 1, auf dem Isolierfilme 20, 30 und 40 aufeinanderfolgend angeordnet sind. Elektrisch leitende Spiralen 2 und 12 sind jeweils auf den Filmen 20 b zw. 40 angeordnet. Jeder der Filme enthält ein Durchgangsloch durch die jeweiligen Isolierfilme, durch die hindurch sich Leiter 26 bzw. 27 zu einer darunterliegenden Schicht, dem Film 30 im Fall der Spirale 2 und dem Substrat 1 im Fall der Spirale 12, erstrecken. Diese elektrischen, durch die Isolierfilme hindurchgehenden Leiter sorgen für elektrische Verbindung zu jeweiligen Zuleitungen 6 von den Innenenden 4 und 14 der Spiralen 2 und 12. Die zwei Spiralen 2 und 12 weisen denselben Sinn auf, d.h. dieselbe Wicklungsrichtung, und sie liegen übereinander, um die wechselseitige induktive Kopplung zu maximieren. Die Gegeninduktivität der zwei Spiralen wird durch die gegenseitige Geometrie und die Dicken der Isolierfilme kontrolliert. Jedoch ist die Gegeninduktivität zwischen den zwei Spiralen beschränkt, da die Permeabilität der benachbarten Materialien relativ klein ist.Another known structure of a transformer is shown in exploded view in Fig. 2. This transformer structure includes an electrically insulating substrate 1 on which insulating films 20, 30 and 40 are arranged in succession. Electrically conductive spirals 2 and 12 are arranged on the films 20 and 40, respectively. Each of the films includes a through-hole through the respective insulating films through which conductors 26 and 27 extend to an underlying layer, the film 30 in the case of the spiral 2 and the substrate 1 in the case of the spiral 12. These electrical conductors passing through the insulating films provide electrical connection to respective leads 6 from the inner ends 4 and 14 of the spirals 2 and 12. The two spirals 2 and 12 have the same sense, i.e. the same winding direction, and they lie one above the other to form the to maximize mutual inductive coupling. The mutual inductance of the two spirals is controlled by the mutual geometry and the thicknesses of the insulating films. However, the mutual inductance between the two spirals is limited because the permeability of the neighboring materials is relatively small.
In den Fig. 3(a)-3(c) ist eine andere bekannte Transformatorstruktur zur Verwendung in integrierten Halbleiterschaltungen in Schnitt- und Draufsichten dargestellt. Dieser Transformator, wie er dem Oberbegriff von Anspruch 1 entspricht, verwendet eine Lage eines Materials mit relativ hoher Permeabilität, um die induktive Kopplung zwischen den zwei Windungen zu verbessern. Bei dieser bekannten Struktur, wie sie in Patent Abstracts of Japan: Vol. 11, No. 161 [E-509], 23.05.87 sowie in der veröffentlichten Japanischen Patentanmeldung 61-294850 beschrieben ist, ist eine elektrisch leitende Spirale 2 auf einem Halbleitersubstrat 1 angeordnet. Eine zweite Windung 28 umfasst eine einzelne Schleife, die mittels einer elektrisch isolierenden Schicht 4 von der Spirale 2 beabstandet ist. In die Isolierschicht 29 zwischen der Spirale 2 und der Windung 28 ist eine ferromagnetische Lage 31 eingebettet. Da die ferroelektrische Lage 31 zwischen der Spirale 2 und der Windung 28 statt innerhalb der zentralen Öffnung derselben angeordnet ist, ist sie nicht wirksam hinsichtlich einer deutlichen Erhöhung der induktiven Kopplung zwischen diesen zwei Leitern. So ist es bei den bekannten Strukturen schwierig, große Gegeninduktivität und hohen Wirkungsgrad des Transformators zu erzielen.Another known transformer structure for use in semiconductor integrated circuits is shown in cross-sectional and plan views in Figs. 3(a)-3(c). This transformer, as in accordance with the preamble of claim 1, uses a layer of relatively high permeability material to improve the inductive coupling between the two turns. In this known structure, as described in Patent Abstracts of Japan: Vol. 11, No. 161 [E-509], 23.05.87 and in published Japanese Patent Application 61-294850, an electrically conductive spiral 2 is arranged on a semiconductor substrate 1. A second turn 28 comprises a single loop which is spaced from the spiral 2 by an electrically insulating layer 4. A ferromagnetic layer 31 is embedded in the insulating layer 29 between the spiral 2 and the winding 28. Since the ferroelectric layer 31 is arranged between the spiral 2 and the winding 28 rather than within the central opening of the same, it is not effective in significantly increasing the inductive coupling between these two conductors. Thus, with the known structures it is difficult to achieve high mutual inductance and high efficiency of the transformer.
Es ist eine Aufgabe der Erfindung, einen Transformator gemäß dem Oberbegriff von Anspruch 1 mit größerer Gegeninduktivität und höherem Wirkungsgrad zu versehen.It is an object of the invention to provide a transformer according to the preamble of claim 1 with greater mutual inductance and higher efficiency.
Ein erfindungsgemäßer Transformator ist dadurch gekennzeichnet, dass die erste und die zweite Windung sowie der elektrisch isolierende Film eine gemeinsame zentrale Öffnung aufweisen und ein magnetisches Material an der Oberfläche des Substrats in der gemeinsamen zentralen Öffnung angeordnet ist, das die induktive Kopplung zwischen der ersten und zweiten Windung erhöht.A transformer according to the invention is characterized in that the first and second windings and the electrically insulating film have a common central opening and a magnetic material is arranged on the surface of the substrate in the common central opening, which increases the inductive coupling between the first and second windings.
Das Vorhandenseins eines Ferrits innerhalb der Öffnung der Windungen verbessert die gegenseitige Kopplung der Windungen und das Transformatorfunktionsvermögen im Vergleich mit bekannten Transformatoren.The presence of a ferrite inside the opening of the windings improves the mutual coupling of the windings and the transformer functionality compared to known transformers.
Nachfolgend werden Ausführungsbeispiele der Erfindung in Verbindung mit jeweiligem Stand der Technik erörtert, um die durch die Erfindung erzielten Verbesserungen zu veranschaulichen. In den Zeichnungen ist folgendes dargestellt:In the following, embodiments of the invention are discussed in conjunction with the respective prior art in order to illustrate the improvements achieved by the invention. The following is shown in the drawings:
Fig. 1 ist eine Draufsicht auf einen bekannten Transformator, der zwei auf derselben Fläche angeordnete spiralförmige Induktoren verwendet;Fig. 1 is a plan view of a known transformer using two spiral inductors arranged on the same surface;
Fig. 2 ist eine perspektivische Ansicht eines bekannten Transformators, der zwei auf verschiedenen Flächen angeordnete spiralförmige Induktoren verwendet, wobei ein Isolierfilm dazwischenliegt;Fig. 2 is a perspective view of a known transformer using two spiral inductors arranged on different surfaces with an insulating film therebetween;
Fig. 3(a), 3(b) und 3(c) sind eine Schnittansicht bzw. zwei Draufsichten eines bekannten Transformators, der eine magnetische Lage zwischen Spulen verwendet;Figs. 3(a), 3(b) and 3(c) are a sectional view and two plan views, respectively, of a known transformer using a magnetic sheet between coils;
Fig. 4(a), 4(b) und 4(c) sind eine Draufsicht, eine Schnittansicht bzw. eine perspektivische Ansicht eines Transformators gemäß einem ersten Ausführungsbeispiel der Erfindung; undFig. 4(a), 4(b) and 4(c) are a plan view, a sectional view and a perspective view, respectively, of a transformer according to a first embodiment of the invention; and
Fig. 5(a), 5(b) und 5(c) sind eine Draufsicht, eine Schnittansicht bzw. eine perspektivische Ansicht eines Transformators gemäß einem zweiten Ausführungsbeispiel der Erfindung.Figs. 5(a), 5(b) and 5(c) are a plan view, a sectional view and a perspective view, respectively, of a transformer according to a second embodiment of the invention.
Die Fig. 4(a), 4(b) und 4(c) sind eine Draufsicht, eine Schnittansicht bzw. eine perspektivische Ansicht eines in eine integrierte Halbleiterschaltung integrierbaren Transformators gemäß einem ersten Ausführungsbeispiel der Erfindung. Bei dieser Struktur ist eine einzelne Windung 28 aus einem dünnen Metallfilm auf der Oberfläche eines Halbleitersubstrats wie eines solchen aus Galliumarsenid angeordnet. Die Windung 28 enthält ein Paar Zuleitungen 32. Ein elektrisch isolierender Film 33, wie ein solcher aus SiN oder SiON, ist auf der Windung 28 angeordnet. Eine andere einzelne Windung 34 ist auf dem Isolator 33 unmittelbar über der Windung 28, dieser gegenüberstehend, angeordnet. Die Windung 34 enthält Zuleitungen 35. Die Windungen 28 und 34 sowie der Isolierfilm 33 weisen gemeinsame zentrale Öffnungen auf, die im wesentlichen zueinander ausgerichtet sind, um für einen gemeinsamen Kern zu sorgen. Ein ferromagnetischer Körper 36, wie ein Ferrit, ist innerhalb dieser gemeinsamen, zentralen Öffnung angeordnet, um die Gegeninduktivität der Windungen 28 und 34 zu verbessern. Die magnetische Permeabilität des Körpers 36 ist deutlich größer als die des Substrats 1. Darüber hinaus gewährleistet die Anordnung dieses magnetischen Körpers innerhalb des gemeinsamen Kerns der zwei Windungen 28 und 34 gute magnetische Kopplung zwischen diesen Windungen. Im Ergebnis wird aufgrund dieses Ausführungsbeispiels der Erfindung eine relativ hohe Gegeninduktivität, d.h. ein Transformator mit hohem Wirkungsgrad, erhalten. Wie es in der Technik wohlbekannt ist, kann die Permeabilität von Ferritmaterialien ungefähr 25 Hundert betragen, was für sehr starke Kopplung zwischen den zwei Windungen 28 und 34 sorgt. Wie es in den Fig. 4(a) und 4(c) veranschaulicht ist, sind die Zuleitungen 32 und 35 der jeweiligen Windungen vorzugsweise in verschiedenen Richtungen ausgerichtet, um eine unerwünschte kapazitive Kopplung zwischen ihnen zu vermeiden.4(a), 4(b) and 4(c) are a plan view, a sectional view and a perspective view, respectively, of a transformer integrable into a semiconductor integrated circuit according to a first embodiment of the invention. In this structure, a single turn 28 of a thin metal film is disposed on the surface of a semiconductor substrate such as gallium arsenide. The turn 28 includes a pair of leads 32. An electrically insulating film 33 such as SiN or SiON is disposed on the turn 28. Another single turn 34 is disposed on the insulator 33 immediately above and opposite the turn 28. The turn 34 includes leads 35. The turns 28 and 34 and the insulating film 33 have common central openings which are substantially aligned with each other to provide a common core. A ferromagnetic body 36, such as a ferrite, is arranged within this common central opening to improve the mutual inductance of the windings 28 and 34. The magnetic permeability of the body 36 is significantly greater than that of the substrate 1. In addition Furthermore, the arrangement of this magnetic body within the common core of the two windings 28 and 34 ensures good magnetic coupling between these windings. As a result, a relatively high mutual inductance, i.e. a high efficiency transformer, is obtained due to this embodiment of the invention. As is well known in the art, the permeability of ferrite materials can be about 25 hundred, which provides very strong coupling between the two windings 28 and 34. As illustrated in Figs. 4(a) and 4(c), the leads 32 and 35 of the respective windings are preferably oriented in different directions to avoid undesirable capacitive coupling between them.
Die Strukturen der Fig. 4(a)-4(c) werden leicht unter Verwendung herkömmlicher Techniken für Halbleiterbauteile aufgebaut, wie durch Strukturierung von Metall- und Isolierschichten durch Photolithographie, und sie können als Teil einer integrierten Schaltung auf einem Substrat ausgebildet werden, das miteinander verbundene aktive und passive Schaltungselemente aufweist. Der ferromagnetische Körper 36 kann gesondert hergestellt werden und in der gemeinsamen zentralen Öffnung der Windungen und des Isolierfilms 33 angeordnet werden. Alternativ kann das ferromagnetische Material in der gemeinsamen Öffnung der Windungen und der Isolierschicht durch Siebdruck oder eine andere Abscheidungstechnik abgeschieden werden, gefolgt von einem Aushärten und/oder anderen Schritten, die dazu erforderlich sind, für die gewünschten ferromagnetischen Eigenschaften zu sorgen. Vorzugsweise wird das ferromagnetische Material abgeschieden, nachdem die beiden Windungen 28 und 34 sowie der Isolierfilm 33 abgeschieden und strukturiert wurden.The structures of Figures 4(a)-4(c) are readily constructed using conventional semiconductor device techniques, such as patterning metal and insulating layers by photolithography, and can be formed as part of an integrated circuit on a substrate having interconnected active and passive circuit elements. The ferromagnetic body 36 can be separately manufactured and disposed in the common central opening of the turns and insulating film 33. Alternatively, the ferromagnetic material can be deposited in the common opening of the turns and insulating layer by screen printing or other deposition technique, followed by curing and/or other steps necessary to provide the desired ferromagnetic properties. Preferably, the ferromagnetic material is deposited after the two turns 28 and 34 and insulating film 33 have been deposited and patterned.
In den Fig. 5(a), 5(b) und 5(c) ist eine Erweiterung der in den Fig. 4(a)- 4(c) dargestellten Struktur in einer Draufsicht, einer Schnittansicht bzw. einer perspektivischen Ansicht dargestellt. Die Struktur der Fig. 5(a)-5(c) ist identisch mit der von 4(a)-4(c), mit der Ausnahme, dass auf der Windung 34 ein zweiter Isolierfilm 37 angeordnet ist und auf diesem Isolierfilm 37 eine dritte Windung 38 angeordnet ist. Diese dritte Windung 38 umfasst Zuleitungen 39. Die Zuleitungen jeder der drei Windungen sind in verschiedenen Richtungen ausgerichtet. Der magnetische Körper 36 erstreckt sich der Höhe nach so, dass er den gemeinsamen Kern der drei Windungen und der zwei dazwischenliegenden Isolierschichten auffüllt. Zusätzliche Windungen und Isolierfilme können zum Stapel hinzugefügt werden. Dieses Ausführungsbeispiel wird auf dieselbe Weise wie das Ausführungsbeispiel der Fig. 4(a)- 4(c) hergestellt, mit der Ausnahme, dass zum Abscheiden des zweiten Isolierfilms 37 und des die Windung 38 bildenden elektrischen Leiters zusätzliche Schritte erforderlich sind. Es wird dieselbe wünschenswerte, große, wechselseitige induktive Kopplung wie beim früheren Ausführungsbeispiel erhalten, mit der Ausnahme, dass die Kopplung zwischen drei Windungen statt zwischen zweien erfolgt. Bei diesen Strukturen ist die Richtung der gegenseitigen Kopplung im wesentlichen rechtwinklig zur Substratoberfläche.In Figs. 5(a), 5(b) and 5(c) an extension of the structure shown in Figs. 4(a)-4(c) is shown in a plan view, a sectional view and a perspective view, respectively. The structure of Figs. 5(a)-5(c) is identical to that of 4(a)-4(c) except that a second insulating film 37 is disposed on the winding 34 and a third winding 38 is disposed on this insulating film 37. This third winding 38 includes leads 39. The leads of each of the three windings are oriented in different directions. The magnetic body 36 extends in height to fill the common core of the three windings and the two intermediate insulating layers. Additional windings and insulating films can be added to the stack. This embodiment is manufactured in the same manner as the embodiment of Fig. 4(a)-4(c), except that for depositing the second insulating film 37 and the electrical conductor forming the turn 38. The same desirable, large, mutual inductive coupling is obtained as in the previous embodiment, except that the coupling is between three turns instead of two. In these structures, the direction of the mutual coupling is substantially perpendicular to the substrate surface.
Da es durch die Technologie für monilithisch-integrierte Schaltungen am einfachsten ist, Transformatoren mit einzelnen Windungen herzustellen, haben integrierbare Transformatoren von natur aus niedrige Induktivitäten und niedrige Gegeninduktivitäten zwischen Windungen. Bei der Erfindung sind die Gegeninduktivität und der Transformatorwirkungsgrad bei einzelnen Windungen deutlich erhöht, da das ferromagnetische Material sehr nahe an den Transformatorwindungen angeordnet ist.Since monolithic integrated circuit technology makes it easiest to manufacture single-turn transformers, integrated transformers inherently have low inductances and low mutual inductances between turns. In the invention, the mutual inductance and transformer efficiency for single turns are significantly increased because the ferromagnetic material is arranged very close to the transformer turns.
Claims (6)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1213839A JPH0377360A (en) | 1989-08-18 | 1989-08-18 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69030123D1 DE69030123D1 (en) | 1997-04-10 |
| DE69030123T2 true DE69030123T2 (en) | 1997-09-18 |
Family
ID=16645882
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69030123T Expired - Fee Related DE69030123T2 (en) | 1989-08-18 | 1990-08-17 | Inductive structures for semiconducting integrated circuits |
| DE69030011T Expired - Fee Related DE69030011T2 (en) | 1989-08-18 | 1990-08-17 | Inductive structures for semiconducting integrated circuits |
| DE69032792T Expired - Fee Related DE69032792T2 (en) | 1989-08-18 | 1990-08-17 | Integrable transformer with integrated semiconducting circuit and its manufacturing process |
| DE69026164T Expired - Fee Related DE69026164T2 (en) | 1989-08-18 | 1990-08-17 | Semiconductor integrated circuit |
| DE69030738T Expired - Fee Related DE69030738T2 (en) | 1989-08-18 | 1990-08-17 | Inductive structures for semiconducting integrated circuits |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69030011T Expired - Fee Related DE69030011T2 (en) | 1989-08-18 | 1990-08-17 | Inductive structures for semiconducting integrated circuits |
| DE69032792T Expired - Fee Related DE69032792T2 (en) | 1989-08-18 | 1990-08-17 | Integrable transformer with integrated semiconducting circuit and its manufacturing process |
| DE69026164T Expired - Fee Related DE69026164T2 (en) | 1989-08-18 | 1990-08-17 | Semiconductor integrated circuit |
| DE69030738T Expired - Fee Related DE69030738T2 (en) | 1989-08-18 | 1990-08-17 | Inductive structures for semiconducting integrated circuits |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5095357A (en) |
| EP (5) | EP0649152B1 (en) |
| JP (1) | JPH0377360A (en) |
| DE (5) | DE69030123T2 (en) |
Families Citing this family (226)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2941484B2 (en) * | 1991-05-31 | 1999-08-25 | 株式会社東芝 | Plane transformer |
| CA2072277A1 (en) * | 1991-07-03 | 1993-01-04 | Nobuo Shiga | Inductance element |
| US5336921A (en) * | 1992-01-27 | 1994-08-09 | Motorola, Inc. | Vertical trench inductor |
| JP3141562B2 (en) * | 1992-05-27 | 2001-03-05 | 富士電機株式会社 | Thin film transformer device |
| EP0588503B1 (en) * | 1992-09-10 | 1998-10-07 | National Semiconductor Corporation | Integrated circuit magnetic memory element and method of making same |
| EP0600540B1 (en) * | 1992-11-30 | 1998-02-11 | Koninklijke Philips Electronics N.V. | Colour diplay tube including a convergence correction device |
| WO1994017558A1 (en) * | 1993-01-29 | 1994-08-04 | The Regents Of The University Of California | Monolithic passive component |
| TW275152B (en) * | 1993-11-01 | 1996-05-01 | Ikeda Takeshi | |
| US5497028A (en) * | 1993-11-10 | 1996-03-05 | Ikeda; Takeshi | LC element and semiconductor device having a signal transmission line and LC element manufacturing method |
| JP3463759B2 (en) * | 1993-12-29 | 2003-11-05 | ソニー株式会社 | Magnetic head and method of manufacturing the same |
| US5478773A (en) * | 1994-04-28 | 1995-12-26 | Motorola, Inc. | Method of making an electronic device having an integrated inductor |
| US5610433A (en) * | 1995-03-13 | 1997-03-11 | National Semiconductor Corporation | Multi-turn, multi-level IC inductor with crossovers |
| KR100231356B1 (en) * | 1994-09-12 | 1999-11-15 | 모리시타요이찌 | Multilayer Ceramic Chip Inductor and Manufacturing Method Thereof |
| US6911887B1 (en) | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
| US5446311A (en) * | 1994-09-16 | 1995-08-29 | International Business Machines Corporation | High-Q inductors in silicon technology without expensive metalization |
| US5647966A (en) * | 1994-10-04 | 1997-07-15 | Matsushita Electric Industrial Co., Ltd. | Method for producing a conductive pattern and method for producing a greensheet lamination body including the same |
| DE4437721A1 (en) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Contactless electronic module |
| US5635892A (en) * | 1994-12-06 | 1997-06-03 | Lucent Technologies Inc. | High Q integrated inductor |
| US5545916A (en) * | 1994-12-06 | 1996-08-13 | At&T Corp. | High Q integrated inductor |
| US6033764A (en) * | 1994-12-16 | 2000-03-07 | Zecal Corp. | Bumped substrate assembly |
| US5716713A (en) * | 1994-12-16 | 1998-02-10 | Ceramic Packaging, Inc. | Stacked planar transformer |
| JP3487461B2 (en) * | 1994-12-17 | 2004-01-19 | ソニー株式会社 | Transformers and amplifiers |
| EP0803981B1 (en) * | 1995-01-12 | 2002-04-10 | Takeshi Ikeda | Tuning circuit |
| WO1996021969A1 (en) * | 1995-01-12 | 1996-07-18 | Takeshi Ikeda | Tuning circuit |
| EP0725407A1 (en) * | 1995-02-03 | 1996-08-07 | International Business Machines Corporation | Three-dimensional integrated circuit inductor |
| US6496382B1 (en) | 1995-05-19 | 2002-12-17 | Kasten Chase Applied Research Limited | Radio frequency identification tag |
| CA2176625C (en) * | 1995-05-19 | 2008-07-15 | Donald Harold Fergusen | Radio frequency identification tag |
| DE19522043A1 (en) * | 1995-06-17 | 1996-12-19 | Bosch Gmbh Robert | Inductive component |
| DE19523521A1 (en) * | 1995-06-30 | 1997-01-02 | Licentia Gmbh | Electrical transponder coil and circuit assembly |
| US5742091A (en) * | 1995-07-12 | 1998-04-21 | National Semiconductor Corporation | Semiconductor device having a passive device formed over one or more deep trenches |
| US5656849A (en) * | 1995-09-22 | 1997-08-12 | International Business Machines Corporation | Two-level spiral inductor structure having a high inductance to area ratio |
| DE69519476T2 (en) * | 1995-12-07 | 2001-06-28 | Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania | Manufacturing process for a magnetic circuit in an integrated circuit |
| US5760456A (en) * | 1995-12-21 | 1998-06-02 | Grzegorek; Andrew Z. | Integrated circuit compatible planar inductors with increased Q |
| JP2765547B2 (en) * | 1995-12-27 | 1998-06-18 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
| JP2904086B2 (en) * | 1995-12-27 | 1999-06-14 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
| US5610569A (en) * | 1996-01-31 | 1997-03-11 | Hughes Electronics | Staggered horizontal inductor for use with multilayer substrate |
| SE510443C2 (en) * | 1996-05-31 | 1999-05-25 | Ericsson Telefon Ab L M | Inductors for integrated circuits |
| US6492705B1 (en) * | 1996-06-04 | 2002-12-10 | Intersil Corporation | Integrated circuit air bridge structures and methods of fabricating same |
| US5793272A (en) * | 1996-08-23 | 1998-08-11 | International Business Machines Corporation | Integrated circuit toroidal inductor |
| US5831331A (en) * | 1996-11-22 | 1998-11-03 | Philips Electronics North America Corporation | Self-shielding inductor for multi-layer semiconductor integrated circuits |
| EP0886874B1 (en) * | 1996-12-30 | 2003-04-09 | Koninklijke Philips Electronics N.V. | Device comprising an integrated coil |
| US5892425A (en) * | 1997-04-10 | 1999-04-06 | Virginia Tech Intellectual Properties, Inc. | Interwound center-tapped spiral inductor |
| KR100233237B1 (en) | 1997-09-10 | 1999-12-01 | 정선종 | Fine inductor having 3-dimensional coil structure and method for forming the same |
| DE19739962C2 (en) * | 1997-09-11 | 2000-05-18 | Siemens Ag | Planar, coupled coil arrangement |
| ES2259819T3 (en) | 1997-10-22 | 2006-10-16 | Bae Systems Bofors Ab | INTEGRATED ELECTRONIC CIRCUIT INCLUDING AN OSCILLATOR AND PASSIVE CIRCUIT ELEMENTS. |
| US20030042571A1 (en) * | 1997-10-23 | 2003-03-06 | Baoxing Chen | Chip-scale coils and isolators based thereon |
| EP0915513A1 (en) | 1997-10-23 | 1999-05-12 | STMicroelectronics S.r.l. | High quality factor, integrated inductor and production method thereof |
| US5929729A (en) * | 1997-10-24 | 1999-07-27 | Com Dev Limited | Printed lumped element stripline circuit ground-signal-ground structure |
| FR2771843B1 (en) * | 1997-11-28 | 2000-02-11 | Sgs Thomson Microelectronics | INTEGRATED CIRCUIT TRANSFORMER |
| KR100279753B1 (en) * | 1997-12-03 | 2001-03-02 | 정선종 | Inductor manufacturing method using semiconductor integrated circuit manufacturing process |
| US6169320B1 (en) * | 1998-01-22 | 2001-01-02 | Raytheon Company | Spiral-shaped inductor structure for monolithic microwave integrated circuits having air gaps in underlying pedestal |
| US5952893A (en) * | 1998-03-06 | 1999-09-14 | International Business Machines Corporation | Integrated circuit inductors for use with electronic oscillators |
| JPH11273949A (en) * | 1998-03-24 | 1999-10-08 | Tif:Kk | Inductor element |
| SE512699C2 (en) * | 1998-03-24 | 2000-05-02 | Ericsson Telefon Ab L M | An inductance device |
| US6008102A (en) * | 1998-04-09 | 1999-12-28 | Motorola, Inc. | Method of forming a three-dimensional integrated inductor |
| JPH11317621A (en) | 1998-05-07 | 1999-11-16 | Tif:Kk | LC oscillator |
| US6472285B1 (en) * | 1999-04-30 | 2002-10-29 | Winbond Electronics Corporation | Method for fabricating high-Q inductance device in monolithic technology |
| US6426267B2 (en) * | 1998-06-19 | 2002-07-30 | Winbond Electronics Corp. | Method for fabricating high-Q inductance device in monolithic technology |
| DE69840827D1 (en) * | 1998-06-30 | 2009-06-25 | Asulab Sa | Inductive sensor |
| EP0991123A1 (en) * | 1998-10-01 | 2000-04-05 | EM Microelectronic-Marin SA | Microstructure with a magnetic antenna or a magnetic detector |
| US6201287B1 (en) | 1998-10-26 | 2001-03-13 | Micron Technology, Inc. | Monolithic inductance-enhancing integrated circuits, complementary metal oxide semiconductor (CMOS) inductance-enhancing integrated circuits, inductor assemblies, and inductance-multiplying methods |
| US6249191B1 (en) | 1998-11-23 | 2001-06-19 | Micron Technology, Inc. | Monolithic integrated circuit oscillators, complementary metal oxide semiconductor (CMOS) voltage-controlled oscillators, integrated circuit oscillators, oscillator-forming methods, and oscillation methods |
| US7531417B2 (en) * | 1998-12-21 | 2009-05-12 | Megica Corporation | High performance system-on-chip passive device using post passivation process |
| US8178435B2 (en) * | 1998-12-21 | 2012-05-15 | Megica Corporation | High performance system-on-chip inductor using post passivation process |
| US6303423B1 (en) * | 1998-12-21 | 2001-10-16 | Megic Corporation | Method for forming high performance system-on-chip using post passivation process |
| US6566731B2 (en) * | 1999-02-26 | 2003-05-20 | Micron Technology, Inc. | Open pattern inductor |
| FR2790328B1 (en) | 1999-02-26 | 2001-04-20 | Memscap | INDUCTIVE COMPONENT, INTEGRATED TRANSFORMER, IN PARTICULAR INTENDED TO BE INCORPORATED IN A RADIOFREQUENCY CIRCUIT, AND INTEGRATED CIRCUIT ASSOCIATED WITH SUCH AN INDUCTIVE COMPONENT OR INTEGRATED TRANSFORMER |
| US6239664B1 (en) | 1999-03-05 | 2001-05-29 | Rf Monolithics, Inc. | Low phase noise, wide tuning range oscillator utilizing a one port saw resonator and method of operation |
| US6218729B1 (en) * | 1999-03-11 | 2001-04-17 | Atmel Corporation | Apparatus and method for an integrated circuit having high Q reactive components |
| US6037649A (en) * | 1999-04-01 | 2000-03-14 | Winbond Electronics Corp. | Three-dimension inductor structure in integrated circuit technology |
| US6180995B1 (en) * | 1999-05-06 | 2001-01-30 | Spectrian Corporation | Integrated passive devices with reduced parasitic substrate capacitance |
| EP1195780B1 (en) * | 1999-05-18 | 2008-08-06 | Niigata Seimitsu Co., Ltd. | Inductor element |
| US6380608B1 (en) | 1999-06-01 | 2002-04-30 | Alcatel Usa Sourcing L.P. | Multiple level spiral inductors used to form a filter in a printed circuit board |
| JP2001023821A (en) | 1999-07-07 | 2001-01-26 | Tif:Kk | Inductor element |
| WO2001004953A1 (en) * | 1999-07-08 | 2001-01-18 | Korea Advanced Institute Of Science And Technology | Method for manufacturing a semiconductor device having a metal layer floating over a substrate |
| US6240622B1 (en) * | 1999-07-09 | 2001-06-05 | Micron Technology, Inc. | Integrated circuit inductors |
| JP2001044754A (en) * | 1999-07-26 | 2001-02-16 | Niigata Seimitsu Kk | LC oscillator |
| JP2001052928A (en) * | 1999-08-17 | 2001-02-23 | Tif:Kk | Inductor element |
| US6501363B1 (en) * | 1999-11-03 | 2002-12-31 | Innosys, Inc. | Vertical transformer |
| US6476704B2 (en) | 1999-11-18 | 2002-11-05 | The Raytheon Company | MMIC airbridge balun transformer |
| US6870456B2 (en) * | 1999-11-23 | 2005-03-22 | Intel Corporation | Integrated transformer |
| US6452247B1 (en) | 1999-11-23 | 2002-09-17 | Intel Corporation | Inductor for integrated circuit |
| US6891461B2 (en) | 1999-11-23 | 2005-05-10 | Intel Corporation | Integrated transformer |
| US6815220B2 (en) * | 1999-11-23 | 2004-11-09 | Intel Corporation | Magnetic layer processing |
| US6856228B2 (en) * | 1999-11-23 | 2005-02-15 | Intel Corporation | Integrated inductor |
| DE10029630C2 (en) * | 2000-06-15 | 2002-04-18 | Bosch Gmbh Robert | Device for protecting electronic components against destruction by electrostatic discharge |
| US6917245B2 (en) | 2000-09-12 | 2005-07-12 | Silicon Laboratories, Inc. | Absolute power detector |
| US6549071B1 (en) | 2000-09-12 | 2003-04-15 | Silicon Laboratories, Inc. | Power amplifier circuitry and method using an inductance coupled to power amplifier switching devices |
| US6437653B1 (en) * | 2000-09-28 | 2002-08-20 | Sun Microsystems, Inc. | Method and apparatus for providing a variable inductor on a semiconductor chip |
| US6816012B2 (en) * | 2000-10-10 | 2004-11-09 | California Institute Of Technology | Distributed circular geometry power amplifier architecture |
| US6890829B2 (en) * | 2000-10-24 | 2005-05-10 | Intel Corporation | Fabrication of on-package and on-chip structure using build-up layer process |
| US6714113B1 (en) * | 2000-11-14 | 2004-03-30 | International Business Machines Corporation | Inductor for integrated circuits |
| US6458611B1 (en) | 2001-03-07 | 2002-10-01 | Intel Corporation | Integrated circuit device characterization |
| US6639298B2 (en) | 2001-06-28 | 2003-10-28 | Agere Systems Inc. | Multi-layer inductor formed in a semiconductor substrate |
| US6667536B2 (en) * | 2001-06-28 | 2003-12-23 | Agere Systems Inc. | Thin film multi-layer high Q transformer formed in a semiconductor substrate |
| US6759275B1 (en) * | 2001-09-04 | 2004-07-06 | Megic Corporation | Method for making high-performance RF integrated circuits |
| US20030112110A1 (en) * | 2001-09-19 | 2003-06-19 | Mark Pavier | Embedded inductor for semiconductor device circuit |
| FR2830126B1 (en) * | 2001-09-26 | 2004-10-01 | St Microelectronics Sa | MONOLITHIC CIRCUIT INDUCTANCE |
| US6635948B2 (en) * | 2001-12-05 | 2003-10-21 | Micron Technology, Inc. | Semiconductor device with electrically coupled spiral inductors |
| US6614093B2 (en) * | 2001-12-11 | 2003-09-02 | Lsi Logic Corporation | Integrated inductor in semiconductor manufacturing |
| JP3634305B2 (en) | 2001-12-14 | 2005-03-30 | 三菱電機株式会社 | Multilayer inductance element |
| DE10217387B4 (en) * | 2002-04-18 | 2018-04-12 | Snaptrack, Inc. | Electrical matching network with a transformation line |
| KR20050029232A (en) * | 2002-07-23 | 2005-03-24 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | Multi-tap coil |
| DE10262239B4 (en) | 2002-09-18 | 2011-04-28 | Infineon Technologies Ag | Digital signal transmission method |
| KR100466542B1 (en) * | 2002-11-13 | 2005-01-15 | 한국전자통신연구원 | Stacked Variable Inductor |
| US6894565B1 (en) | 2002-12-03 | 2005-05-17 | Silicon Laboratories, Inc. | Fast settling power amplifier regulator |
| US6894593B2 (en) * | 2003-02-12 | 2005-05-17 | Moog Inc. | Torque motor |
| US6897730B2 (en) | 2003-03-04 | 2005-05-24 | Silicon Laboratories Inc. | Method and apparatus for controlling the output power of a power amplifier |
| JP2004319763A (en) * | 2003-04-16 | 2004-11-11 | Shinko Electric Ind Co Ltd | Inductor element and electronic circuit device |
| US7075329B2 (en) * | 2003-04-30 | 2006-07-11 | Analog Devices, Inc. | Signal isolators using micro-transformers |
| US7852185B2 (en) * | 2003-05-05 | 2010-12-14 | Intel Corporation | On-die micro-transformer structures with magnetic materials |
| JP3983199B2 (en) | 2003-05-26 | 2007-09-26 | 沖電気工業株式会社 | Semiconductor device and manufacturing method thereof |
| TWI236763B (en) * | 2003-05-27 | 2005-07-21 | Megic Corp | High performance system-on-chip inductor using post passivation process |
| DE10329143B4 (en) * | 2003-06-27 | 2005-09-01 | Infineon Technologies Ag | Electronic module and method of making the same |
| JP2005236482A (en) * | 2004-02-18 | 2005-09-02 | Fujitsu Ltd | LC oscillator |
| DE102004022176B4 (en) | 2004-05-05 | 2009-07-23 | Atmel Germany Gmbh | Method for producing passive components on a substrate |
| CN1251255C (en) * | 2004-05-10 | 2006-04-12 | 阎跃军 | Adjustable inductor |
| US7737871B2 (en) * | 2004-06-03 | 2010-06-15 | Silicon Laboratories Inc. | MCU with integrated voltage isolator to provide a galvanic isolation between input and output |
| US7302247B2 (en) * | 2004-06-03 | 2007-11-27 | Silicon Laboratories Inc. | Spread spectrum isolator |
| US7376212B2 (en) * | 2004-06-03 | 2008-05-20 | Silicon Laboratories Inc. | RF isolator with differential input/output |
| US7447492B2 (en) * | 2004-06-03 | 2008-11-04 | Silicon Laboratories Inc. | On chip transformer isolator |
| US7577223B2 (en) * | 2004-06-03 | 2009-08-18 | Silicon Laboratories Inc. | Multiplexed RF isolator circuit |
| US8441325B2 (en) * | 2004-06-03 | 2013-05-14 | Silicon Laboratories Inc. | Isolator with complementary configurable memory |
| US7421028B2 (en) * | 2004-06-03 | 2008-09-02 | Silicon Laboratories Inc. | Transformer isolator for digital power supply |
| US7902627B2 (en) * | 2004-06-03 | 2011-03-08 | Silicon Laboratories Inc. | Capacitive isolation circuitry with improved common mode detector |
| US7460604B2 (en) * | 2004-06-03 | 2008-12-02 | Silicon Laboratories Inc. | RF isolator for isolating voltage sensing and gate drivers |
| US7821428B2 (en) | 2004-06-03 | 2010-10-26 | Silicon Laboratories Inc. | MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link |
| US7738568B2 (en) * | 2004-06-03 | 2010-06-15 | Silicon Laboratories Inc. | Multiplexed RF isolator |
| US8169108B2 (en) | 2004-06-03 | 2012-05-01 | Silicon Laboratories Inc. | Capacitive isolator |
| US8198951B2 (en) * | 2004-06-03 | 2012-06-12 | Silicon Laboratories Inc. | Capacitive isolation circuitry |
| KR100548388B1 (en) * | 2004-07-20 | 2006-02-02 | 삼성전자주식회사 | Low Loss Inductor Device and Manufacturing Method Thereof |
| US8008775B2 (en) | 2004-09-09 | 2011-08-30 | Megica Corporation | Post passivation interconnection structures |
| US7355282B2 (en) * | 2004-09-09 | 2008-04-08 | Megica Corporation | Post passivation interconnection process and structures |
| US20060077029A1 (en) * | 2004-10-07 | 2006-04-13 | Freescale Semiconductor, Inc. | Apparatus and method for constructions of stacked inductive components |
| US7533068B2 (en) | 2004-12-23 | 2009-05-12 | D-Wave Systems, Inc. | Analog processor comprising quantum devices |
| US7750434B2 (en) * | 2005-01-31 | 2010-07-06 | Sanyo Electric Co., Ltd. | Circuit substrate structure and circuit apparatus |
| US7262681B2 (en) | 2005-02-11 | 2007-08-28 | Semiconductor Components Industries, L.L.C. | Integrated semiconductor inductor and method therefor |
| JP4509826B2 (en) * | 2005-03-03 | 2010-07-21 | 日本電信電話株式会社 | Inductor |
| US8384189B2 (en) * | 2005-03-29 | 2013-02-26 | Megica Corporation | High performance system-on-chip using post passivation process |
| US7499124B2 (en) * | 2005-05-05 | 2009-03-03 | Industrial Technology Research Institute | Polymer dispersed liquid crystal device conditioned with a predetermined anchoring energy, a predetermined polymer concentration by weight percent and a predetermined cell gap to enhance phase separation and to make smaller and more uniform liquid crystal droplets |
| US7257882B2 (en) * | 2005-05-19 | 2007-08-21 | International Business Machines Corporation | Multilayer coil assembly and method of production |
| US8134548B2 (en) | 2005-06-30 | 2012-03-13 | Micron Technology, Inc. | DC-DC converter switching transistor current measurement technique |
| US7443362B2 (en) | 2005-07-19 | 2008-10-28 | 3M Innovative Properties Company | Solenoid antenna |
| TWI320219B (en) * | 2005-07-22 | 2010-02-01 | Method for forming a double embossing structure | |
| US7511356B2 (en) * | 2005-08-31 | 2009-03-31 | Micron Technology, Inc. | Voltage-controlled semiconductor inductor and method |
| TW200735138A (en) * | 2005-10-05 | 2007-09-16 | Koninkl Philips Electronics Nv | Multi-layer inductive element for integrated circuit |
| JP4712615B2 (en) * | 2006-06-01 | 2011-06-29 | アルプス電気株式会社 | Proximity contactless communication equipment |
| US7719305B2 (en) * | 2006-07-06 | 2010-05-18 | Analog Devices, Inc. | Signal isolator using micro-transformers |
| US7999383B2 (en) * | 2006-07-21 | 2011-08-16 | Bae Systems Information And Electronic Systems Integration Inc. | High speed, high density, low power die interconnect system |
| US7498908B2 (en) * | 2006-08-04 | 2009-03-03 | Advanced Energy Industries, Inc | High-power PIN diode switch |
| JP4722795B2 (en) * | 2006-08-31 | 2011-07-13 | 富士通株式会社 | Wiring board and electronic component module |
| JP4028884B1 (en) * | 2006-11-01 | 2007-12-26 | Tdk株式会社 | Coil parts |
| EP2084723A1 (en) | 2006-11-14 | 2009-08-05 | Nxp B.V. | Manufacturing of an electronic circuit having an inductance |
| US8749021B2 (en) * | 2006-12-26 | 2014-06-10 | Megit Acquisition Corp. | Voltage regulator integrated with semiconductor chip |
| CA2681138C (en) | 2007-04-05 | 2016-06-07 | D-Wave Systems Inc. | Physical realizations of a universal adiabatic quantum computer |
| DE102007019811B4 (en) * | 2007-04-26 | 2014-11-27 | Infineon Technologies Ag | Circuit, on-chip applied filter circuit and system |
| US8242872B2 (en) | 2007-05-18 | 2012-08-14 | Globalfoundries Singapore Pte. Ltd. | Transformer with effective high turn ratio |
| US7570144B2 (en) | 2007-05-18 | 2009-08-04 | Chartered Semiconductor Manufacturing, Ltd. | Integrated transformer and method of fabrication thereof |
| FR2916570A1 (en) | 2007-05-23 | 2008-11-28 | St Microelectronics Sa | INDUCTIVE PLANE STRUCTURE |
| US7652355B2 (en) | 2007-08-01 | 2010-01-26 | Chartered Semiconductor Manufacturing, Ltd. | Integrated circuit shield structure |
| US7956713B2 (en) * | 2007-09-25 | 2011-06-07 | Intel Corporation | Forming a helical inductor |
| US9269485B2 (en) * | 2007-11-29 | 2016-02-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of creating spiral inductor having high Q value |
| US20090140383A1 (en) * | 2007-11-29 | 2009-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of creating spiral inductor having high q value |
| TWI371766B (en) * | 2007-12-26 | 2012-09-01 | Via Tech Inc | Inductor structure |
| US8138876B2 (en) * | 2008-01-29 | 2012-03-20 | International Business Machines Corporation | On-chip integrated voltage-controlled variable inductor, methods of making and tuning such variable inductors, and design structures integrating such variable inductors |
| US7710215B2 (en) * | 2008-02-04 | 2010-05-04 | Infineon Technologies Austria Ag | Semiconductor configuration having an integrated coupler and method for manufacturing such a semiconductor configuration |
| US8575731B2 (en) * | 2008-06-17 | 2013-11-05 | Panasonic Corporation | Semiconductor device with a balun |
| JP5247367B2 (en) | 2008-11-13 | 2013-07-24 | ルネサスエレクトロニクス株式会社 | RF power amplifier |
| SE534510C2 (en) * | 2008-11-19 | 2011-09-13 | Silex Microsystems Ab | Functional encapsulation |
| EP2380415B1 (en) * | 2008-12-26 | 2019-07-31 | QUALCOMM Incorporated | Chip packages with power management integrated circuits and related techniques |
| WO2010076187A2 (en) | 2008-12-30 | 2010-07-08 | Stmicroelectronics S.R.L. | Integrated electronic device with transceiving antenna and magnetic interconnection |
| US8738105B2 (en) | 2010-01-15 | 2014-05-27 | D-Wave Systems Inc. | Systems and methods for superconducting integrated circuts |
| US8093982B2 (en) * | 2010-03-25 | 2012-01-10 | Qualcomm Incorporated | Three dimensional inductor and transformer design methodology of glass technology |
| JP2011217321A (en) * | 2010-04-02 | 2011-10-27 | Hitachi Ltd | Peaking circuit, method for adjusting peaking, differential amplifier installing peaking circuit, laser diode driving circuit installing peaking circuit, and data processing unit installing peaking circuit |
| CN102376693B (en) * | 2010-08-23 | 2016-05-11 | 香港科技大学 | Monolithic magnetic induction device |
| JP5357136B2 (en) * | 2010-12-22 | 2013-12-04 | 旭化成エレクトロニクス株式会社 | Transformer |
| US8451032B2 (en) | 2010-12-22 | 2013-05-28 | Silicon Laboratories Inc. | Capacitive isolator with schmitt trigger |
| TWM411643U (en) * | 2011-01-17 | 2011-09-11 | Yujing Technology Co Ltd | Ultra-high power transformer |
| US8558344B2 (en) | 2011-09-06 | 2013-10-15 | Analog Devices, Inc. | Small size and fully integrated power converter with magnetics on chip |
| US20130214890A1 (en) | 2012-02-20 | 2013-08-22 | Futurewei Technologies, Inc. | High Current, Low Equivalent Series Resistance Printed Circuit Board Coil for Power Transfer Application |
| US8803648B2 (en) | 2012-05-03 | 2014-08-12 | Qualcomm Mems Technologies, Inc. | Three-dimensional multilayer solenoid transformer |
| US9111933B2 (en) | 2012-05-17 | 2015-08-18 | International Business Machines Corporation | Stacked through-silicon via (TSV) transformer structure |
| US8742539B2 (en) | 2012-07-27 | 2014-06-03 | Infineon Technologies Austria Ag | Semiconductor component and method for producing a semiconductor component |
| US9431473B2 (en) * | 2012-11-21 | 2016-08-30 | Qualcomm Incorporated | Hybrid transformer structure on semiconductor devices |
| US20140152410A1 (en) | 2012-12-03 | 2014-06-05 | Arizona Board of Regents, a body corporate of the State of Arizona Acting for and on behalf of Arizo | Integrated tunable inductors |
| US8786393B1 (en) | 2013-02-05 | 2014-07-22 | Analog Devices, Inc. | Step up or step down micro-transformer with tight magnetic coupling |
| JP5743034B2 (en) * | 2013-02-19 | 2015-07-01 | 株式会社村田製作所 | Inductor bridge and electronics |
| US10002700B2 (en) | 2013-02-27 | 2018-06-19 | Qualcomm Incorporated | Vertical-coupling transformer with an air-gap structure |
| US9634645B2 (en) | 2013-03-14 | 2017-04-25 | Qualcomm Incorporated | Integration of a replica circuit and a transformer above a dielectric substrate |
| US9293997B2 (en) | 2013-03-14 | 2016-03-22 | Analog Devices Global | Isolated error amplifier for isolated power supplies |
| US9449753B2 (en) | 2013-08-30 | 2016-09-20 | Qualcomm Incorporated | Varying thickness inductor |
| JP6221736B2 (en) * | 2013-12-25 | 2017-11-01 | 三菱電機株式会社 | Semiconductor device |
| JP5825457B1 (en) * | 2014-02-14 | 2015-12-02 | 株式会社村田製作所 | ANTENNA DEVICE AND WIRELESS COMMUNICATION DEVICE |
| US10002107B2 (en) | 2014-03-12 | 2018-06-19 | D-Wave Systems Inc. | Systems and methods for removing unwanted interactions in quantum devices |
| US9906318B2 (en) | 2014-04-18 | 2018-02-27 | Qualcomm Incorporated | Frequency multiplexer |
| US10536309B2 (en) | 2014-09-15 | 2020-01-14 | Analog Devices, Inc. | Demodulation of on-off-key modulated signals in signal isolator systems |
| US10270630B2 (en) | 2014-09-15 | 2019-04-23 | Analog Devices, Inc. | Demodulation of on-off-key modulated signals in signal isolator systems |
| US9660848B2 (en) | 2014-09-15 | 2017-05-23 | Analog Devices Global | Methods and structures to generate on/off keyed carrier signals for signal isolators |
| US9998301B2 (en) | 2014-11-03 | 2018-06-12 | Analog Devices, Inc. | Signal isolator system with protection for common mode transients |
| FR3038121B1 (en) * | 2015-06-25 | 2017-08-18 | Thales Sa | IMPROVED TRANSFORMER FOR A CIRCUIT IN MMIC TECHNOLOGY |
| CN107924869B (en) * | 2015-07-16 | 2022-01-25 | 超极存储器股份有限公司 | Semiconductor device and method for manufacturing the same |
| US10720788B2 (en) | 2015-10-09 | 2020-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wireless charging devices having wireless charging coils and methods of manufacture thereof |
| US10636560B2 (en) * | 2016-03-11 | 2020-04-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Induction based current sensing |
| US10164614B2 (en) | 2016-03-31 | 2018-12-25 | Analog Devices Global Unlimited Company | Tank circuit and frequency hopping for isolators |
| WO2017188077A1 (en) * | 2016-04-25 | 2017-11-02 | 株式会社村田製作所 | Inductor component |
| EP3293888B1 (en) | 2016-09-13 | 2020-08-26 | Allegro MicroSystems, LLC | Signal isolator having bidirectional communication between die |
| DE102017102219B4 (en) | 2017-02-06 | 2025-12-31 | Sonova Consumer Hearing Gmbh | Planar dynamic converter |
| US20180323369A1 (en) | 2017-05-02 | 2018-11-08 | Micron Technology, Inc. | Inductors with through-substrate via cores |
| US10121739B1 (en) | 2017-05-02 | 2018-11-06 | Micron Technology, Inc. | Multi-die inductors with coupled through-substrate via cores |
| US10134671B1 (en) | 2017-05-02 | 2018-11-20 | Micron Technology, Inc. | 3D interconnect multi-die inductors with through-substrate via cores |
| US10872843B2 (en) * | 2017-05-02 | 2020-12-22 | Micron Technology, Inc. | Semiconductor devices with back-side coils for wireless signal and power coupling |
| CN107731793B (en) * | 2017-09-14 | 2019-12-17 | 建荣半导体(深圳)有限公司 | Figure 8 inductor structure and semiconductor structure integrated on a semiconductor chip |
| WO2019126396A1 (en) | 2017-12-20 | 2019-06-27 | D-Wave Systems Inc. | Systems and methods for coupling qubits in a quantum processor |
| FR3082046A1 (en) | 2018-05-30 | 2019-12-06 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | INTEGRATED CIRCUIT COMPRISING AN INDUCTANCE |
| US12266470B2 (en) * | 2018-10-30 | 2025-04-01 | Beihang University | MEMS solenoid transformer and manufacturing method thereof |
| US11115244B2 (en) | 2019-09-17 | 2021-09-07 | Allegro Microsystems, Llc | Signal isolator with three state data transmission |
| US11139552B1 (en) | 2020-05-05 | 2021-10-05 | Semiconductor Components Industries, Llc | Method of forming a semiconductor device |
| US12536459B2 (en) | 2020-06-30 | 2026-01-27 | D-Wave Systems Inc. | Systems and methods for coupling between qubits |
| WO2022115278A1 (en) | 2020-11-24 | 2022-06-02 | D-Wave Systems Inc. | Systems, articles, and methods for a tunable capacitor |
| KR20220169152A (en) | 2021-06-18 | 2022-12-27 | 삼성전자주식회사 | Semiconductor device |
| TWI839620B (en) | 2021-06-30 | 2024-04-21 | 立積電子股份有限公司 | Semiconductor device and method of forming the same |
| JP7720179B2 (en) * | 2021-07-07 | 2025-08-07 | 富士電機メーター株式会社 | Current sensors and watt-hour meters |
| JP7706281B2 (en) * | 2021-07-08 | 2025-07-11 | 富士電機メーター株式会社 | Current Sensors and Power Meters |
| US12027476B2 (en) * | 2022-01-13 | 2024-07-02 | Qualcomm Incorporated | Package comprising substrate with coupling element for integrated devices |
| KR20240012140A (en) * | 2022-07-20 | 2024-01-29 | 삼성전자주식회사 | Semiconductor apparatus having inductor structures |
| TWI830411B (en) | 2022-09-29 | 2024-01-21 | 立積電子股份有限公司 | Semiconductor device and method of forming the same |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3504276A (en) * | 1967-04-19 | 1970-03-31 | American Mach & Foundry | Printed circuit coils for use in magnetic flux leakage flow detection |
| US3881244A (en) * | 1972-06-02 | 1975-05-06 | Texas Instruments Inc | Method of making a solid state inductor |
| JPS5091289A (en) * | 1973-12-12 | 1975-07-21 | ||
| US4071378A (en) * | 1975-02-27 | 1978-01-31 | General Electric Company | Process of making a deep diode solid state transformer |
| US4080585A (en) * | 1977-04-11 | 1978-03-21 | Cubic Corporation | Flat coil transformer for electronic circuit boards |
| JPS5727461A (en) * | 1980-07-23 | 1982-02-13 | Mitsubishi Electric Corp | Magnetic recorder and reproducer |
| JPS59114807A (en) * | 1982-12-21 | 1984-07-03 | Matsushita Electric Ind Co Ltd | printed multilayer coil |
| JPS60136156A (en) * | 1983-12-26 | 1985-07-19 | Toshiba Corp | Laser-triggered xenon flash lamp |
| US4833513A (en) * | 1985-01-20 | 1989-05-23 | Tdk Corporation | MOS FET semiconductor device having a cell pattern arrangement for optimizing channel width |
| JPS61201509A (en) * | 1985-03-05 | 1986-09-06 | Tdk Corp | Lc type variable frequency filter |
| GB2173956B (en) * | 1985-03-29 | 1989-01-05 | Plessey Co Plc | Improvements relating to electric transformers |
| JPS61248545A (en) * | 1985-04-26 | 1986-11-05 | Fujitsu Ltd | Integrated circuit provided with inductor |
| JPS61265857A (en) * | 1985-05-20 | 1986-11-25 | Matsushita Electronics Corp | Semiconductor device |
| JPS61294850A (en) * | 1985-06-21 | 1986-12-25 | Nec Corp | Semiconductor integrated circuit device |
| AU6194486A (en) * | 1985-09-02 | 1987-03-24 | Hasler A.G. | Inductive, electrically-controllable component |
| JPS62244160A (en) * | 1986-04-17 | 1987-10-24 | Mitsubishi Electric Corp | Semiconductor device |
| US4785345A (en) * | 1986-05-08 | 1988-11-15 | American Telephone And Telegraph Co., At&T Bell Labs. | Integrated transformer structure with primary winding in substrate |
| JPS63140560A (en) * | 1986-12-02 | 1988-06-13 | Mitsubishi Electric Corp | Semiconductor monolithic bias power supply circuit |
| JPS63250165A (en) * | 1987-04-06 | 1988-10-18 | Mitsubishi Electric Corp | semiconductor equipment |
| JPS63299394A (en) * | 1987-05-29 | 1988-12-06 | Matsushita Electric Ind Co Ltd | printed wiring board |
| JPH0267752A (en) * | 1988-09-01 | 1990-03-07 | Nec Corp | Semiconductor device |
| JP3123441B2 (en) * | 1996-08-23 | 2001-01-09 | 鹿島建設株式会社 | Laboratory tank |
-
1989
- 1989-08-18 JP JP1213839A patent/JPH0377360A/en active Pending
-
1990
- 1990-08-14 US US07/567,170 patent/US5095357A/en not_active Expired - Fee Related
- 1990-08-17 EP EP95100214A patent/EP0649152B1/en not_active Expired - Lifetime
- 1990-08-17 DE DE69030123T patent/DE69030123T2/en not_active Expired - Fee Related
- 1990-08-17 DE DE69030011T patent/DE69030011T2/en not_active Expired - Fee Related
- 1990-08-17 EP EP94116851A patent/EP0643402B1/en not_active Expired - Lifetime
- 1990-08-17 DE DE69032792T patent/DE69032792T2/en not_active Expired - Fee Related
- 1990-08-17 EP EP94116852A patent/EP0643403B1/en not_active Expired - Lifetime
- 1990-08-17 DE DE69026164T patent/DE69026164T2/en not_active Expired - Fee Related
- 1990-08-17 EP EP90115799A patent/EP0413348B1/en not_active Expired - Lifetime
- 1990-08-17 DE DE69030738T patent/DE69030738T2/en not_active Expired - Fee Related
- 1990-08-17 EP EP94116854A patent/EP0643404B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69030011D1 (en) | 1997-04-03 |
| EP0649152A3 (en) | 1995-10-25 |
| DE69030738D1 (en) | 1997-06-19 |
| EP0643402A2 (en) | 1995-03-15 |
| JPH0377360A (en) | 1991-04-02 |
| DE69032792D1 (en) | 1999-01-07 |
| DE69030738T2 (en) | 1997-12-18 |
| EP0643403A2 (en) | 1995-03-15 |
| EP0413348A2 (en) | 1991-02-20 |
| EP0643404A2 (en) | 1995-03-15 |
| US5095357A (en) | 1992-03-10 |
| EP0643402A3 (en) | 1995-10-25 |
| DE69030123D1 (en) | 1997-04-10 |
| DE69026164T2 (en) | 1996-10-31 |
| DE69032792T2 (en) | 1999-07-01 |
| EP0643404A3 (en) | 1995-11-08 |
| EP0649152A2 (en) | 1995-04-19 |
| EP0643403A3 (en) | 1995-10-25 |
| EP0649152B1 (en) | 1998-11-25 |
| EP0643403B1 (en) | 1997-03-05 |
| EP0413348A3 (en) | 1993-03-24 |
| EP0413348B1 (en) | 1996-03-27 |
| EP0643404B1 (en) | 1997-05-14 |
| EP0643402B1 (en) | 1997-02-26 |
| DE69026164D1 (en) | 1996-05-02 |
| DE69030011T2 (en) | 1997-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69030123T2 (en) | Inductive structures for semiconducting integrated circuits | |
| DE69519476T2 (en) | Manufacturing process for a magnetic circuit in an integrated circuit | |
| DE69101788T2 (en) | HIGHLY SYMMETRICAL DC SQUID. | |
| DE69112186T2 (en) | Inductive arrangement with a toroidal core. | |
| DE69623425T2 (en) | Structure of a choke coil | |
| DE4317545A1 (en) | Thin film transformer | |
| EP0393387A2 (en) | Coil arrangement for an inductive detection apparatus | |
| EP1249025B1 (en) | Coil and coil system to be integrated in a microelectronic circuit, and a microelectronic circuit | |
| WO2014076067A1 (en) | Planar transformer | |
| DE102018113765B4 (en) | TRANSFORMER WITH A THROUGH CONTACT FOR A MAGNETIC CORE | |
| DE102010048302A1 (en) | inductance arrangement | |
| DE3144026A1 (en) | "TRANSFORMER" | |
| DE69029757T2 (en) | LC noise filter | |
| DE3687422T2 (en) | MAGNETIC HEAD WITH UPGRADE TRANSFORMER. | |
| DE102016123920A1 (en) | Inductive component for use in an integrated circuit, transformer and inductor formed as part of an integrated circuit | |
| EP1425765B1 (en) | Magnetic component | |
| DE102022106912A1 (en) | MAGNETIC SENSOR | |
| DE2917388C2 (en) | ||
| DE2053677B2 (en) | Y circulator | |
| BE1030569B1 (en) | Coreless planar transformer | |
| DE4421986A1 (en) | Radio interference filter for electronically-controlled device | |
| DE2815668A1 (en) | BROADBAND ISOLATOR | |
| DE2116608A1 (en) | Multiphase transducer arrangement | |
| DE2549670A1 (en) | Thin film transformer for integrated semiconductor hybrid circuit - has surrounding thin film of magnetic material of uniaxial anisotropy | |
| DE10212630A1 (en) | Coil on a semiconductor substrate and method for its production |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |