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DE69933825D1 - Chemisch verstärkte Positivresistzusammensetzung - Google Patents

Chemisch verstärkte Positivresistzusammensetzung

Info

Publication number
DE69933825D1
DE69933825D1 DE69933825T DE69933825T DE69933825D1 DE 69933825 D1 DE69933825 D1 DE 69933825D1 DE 69933825 T DE69933825 T DE 69933825T DE 69933825 T DE69933825 T DE 69933825T DE 69933825 D1 DE69933825 D1 DE 69933825D1
Authority
DE
Germany
Prior art keywords
resist composition
positive resist
chemically amplified
amplified positive
chemically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69933825T
Other languages
English (en)
Other versions
DE69933825T2 (de
Inventor
Hiroaki Fujishima
Yasunori Uetani
Kaoru Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Application granted granted Critical
Publication of DE69933825D1 publication Critical patent/DE69933825D1/de
Publication of DE69933825T2 publication Critical patent/DE69933825T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DE69933825T 1998-08-26 1999-08-25 Chemisch verstärkte Positivresistzusammensetzung Expired - Lifetime DE69933825T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24014398 1998-08-26
JP24014398 1998-08-26

Publications (2)

Publication Number Publication Date
DE69933825D1 true DE69933825D1 (de) 2006-12-14
DE69933825T2 DE69933825T2 (de) 2007-08-30

Family

ID=17055144

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69933825T Expired - Lifetime DE69933825T2 (de) 1998-08-26 1999-08-25 Chemisch verstärkte Positivresistzusammensetzung

Country Status (7)

Country Link
US (1) US6239231B1 (de)
EP (1) EP0982628B1 (de)
KR (1) KR100574574B1 (de)
CN (1) CN1190706C (de)
DE (1) DE69933825T2 (de)
SG (1) SG85129A1 (de)
TW (1) TW520463B (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
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KR100574574B1 (ko) * 1998-08-26 2006-04-28 스미또모 가가꾸 가부시키가이샤 화학 증폭형 포지티브 내식막 조성물
TWI263866B (en) 1999-01-18 2006-10-11 Sumitomo Chemical Co Chemical amplification type positive resist composition
US6479211B1 (en) * 1999-05-26 2002-11-12 Fuji Photo Film Co., Ltd. Positive photoresist composition for far ultraviolet exposure
KR100585067B1 (ko) * 1999-07-23 2006-05-30 삼성전자주식회사 백본이 환상 구조를 가지는 감광성 폴리머와 이를 포함하는 감광성 코폴리머
WO2001010916A1 (en) * 1999-08-05 2001-02-15 Daicel Chemical Industries, Ltd. Polymer for photoresists and resin compositions for photoresists
US6692888B1 (en) * 1999-10-07 2004-02-17 Shipley Company, L.L.C. Copolymers having nitrile and alicyclic leaving groups and photoresist compositions comprising same
KR100498440B1 (ko) * 1999-11-23 2005-07-01 삼성전자주식회사 백본이 환상 구조를 가지는 감광성 폴리머와 이를포함하는 레지스트 조성물
JP4529245B2 (ja) * 1999-12-03 2010-08-25 住友化学株式会社 化学増幅型ポジ型レジスト組成物
JP4453138B2 (ja) * 1999-12-22 2010-04-21 住友化学株式会社 化学増幅型ポジ型レジスト組成物
JP4061801B2 (ja) * 2000-01-24 2008-03-19 住友化学株式会社 化学増幅型ポジ型レジスト組成物
JP2001215704A (ja) * 2000-01-31 2001-08-10 Sumitomo Chem Co Ltd 化学増幅型ポジ型レジスト組成物
US6777157B1 (en) 2000-02-26 2004-08-17 Shipley Company, L.L.C. Copolymers and photoresist compositions comprising same
TW573225B (en) * 2000-02-28 2004-01-21 Sumitomo Chemical Co Chemically amplified positive resist composition
JP4329214B2 (ja) * 2000-03-28 2009-09-09 住友化学株式会社 化学増幅型ポジ型レジスト組成物
TW507116B (en) * 2000-04-04 2002-10-21 Sumitomo Chemical Co Chemically amplified positive resist composition
JP3972568B2 (ja) 2000-05-09 2007-09-05 住友化学株式会社 化学増幅型ポジ型レジスト組成物及びスルホニウム塩
JP4576737B2 (ja) * 2000-06-09 2010-11-10 Ｊｓｒ株式会社 感放射線性樹脂組成物
TWI286664B (en) 2000-06-23 2007-09-11 Sumitomo Chemical Co Chemical amplification type positive resist composition and sulfonium salt
JP2002097219A (ja) * 2000-09-21 2002-04-02 Sumitomo Chem Co Ltd 金属含量の低減されたポリ（メタ）アクリレート類の製造方法
JP3945741B2 (ja) 2000-12-04 2007-07-18 東京応化工業株式会社 ポジ型レジスト組成物
US6521781B2 (en) * 2000-12-15 2003-02-18 Mitsubishi Gas Chemical Company, Inc. Production of 2-hydrocarbyl-2-adamantyl acrylate compounds
JP2002196495A (ja) * 2000-12-22 2002-07-12 Sumitomo Chem Co Ltd 化学増幅型ポジ型レジスト組成物
EP1361207A4 (de) * 2001-01-26 2005-11-02 Tokuyama Corp Verfahren zur herstellung von alkyladamantylestern und zusammensetzungen
WO2002068527A2 (en) * 2001-02-23 2002-09-06 Arch Specialty Chemicals, Inc. NOVEL β-OXO COMPOUNDS AND THEIR USE IN PHOTORESIST
AU2002255598A1 (en) * 2001-02-25 2002-09-12 Shipley Company, L.L.C. Polymers and photoresist compositions
JP4524940B2 (ja) * 2001-03-15 2010-08-18 住友化学株式会社 化学増幅型ポジ型レジスト組成物
US6737215B2 (en) 2001-05-11 2004-05-18 Clariant Finance (Bvi) Ltd Photoresist composition for deep ultraviolet lithography
TW581941B (en) * 2001-06-21 2004-04-01 Fuji Photo Film Co Ltd Positive resist composition
US7192681B2 (en) * 2001-07-05 2007-03-20 Fuji Photo Film Co., Ltd. Positive photosensitive composition
CN100520579C (zh) * 2001-12-03 2009-07-29 东京应化工业株式会社 正型抗蚀剂组合物及使用其形成抗蚀图形的方法
JP3836359B2 (ja) 2001-12-03 2006-10-25 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
JP3895224B2 (ja) * 2001-12-03 2007-03-22 東京応化工業株式会社 ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法
WO2003082933A1 (en) * 2002-04-01 2003-10-09 Daicel Chemical Industries, Ltd. Process for the production of high-molecular compounds for photoresist
US7666569B2 (en) * 2002-12-26 2010-02-23 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition and method for forming resist pattern
JP4434762B2 (ja) * 2003-01-31 2010-03-17 東京応化工業株式会社 レジスト組成物
DE112004000333T5 (de) * 2003-02-26 2006-02-02 Tokyo Ohka Kogyo Co., Ltd., Kawasaki Silesquioxan-Harz, Positiv-Resist-Zusammensetzung, Resist-Laminat und Methode zur Bildung eines Resist-Musters
JP2004333548A (ja) * 2003-04-30 2004-11-25 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物およびレジストパターン形成方法
JP4772288B2 (ja) 2003-06-05 2011-09-14 東京応化工業株式会社 ホトレジスト組成物用樹脂、ホトレジスト組成物、およびレジストパターン形成方法
CN100582938C (zh) * 2003-07-01 2010-01-20 东京应化工业株式会社 正型抗蚀剂组合物及使用其形成抗蚀图案的方法
JP4327003B2 (ja) * 2003-07-01 2009-09-09 東京応化工業株式会社 ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法
JP2005031233A (ja) 2003-07-09 2005-02-03 Tokyo Ohka Kogyo Co Ltd レジスト組成物、積層体、及びレジストパターン形成方法
JP4398783B2 (ja) * 2003-09-03 2010-01-13 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
EP1666971A1 (de) * 2003-09-25 2006-06-07 Tokyo Ohka Kogyo Co., Ltd. Positiv-resistzusammensetzung und resistlaminat für einen elektronenstrahl mit geringer beschleunigung und verfahren zur musterbildung
CN1603957A (zh) * 2003-10-03 2005-04-06 住友化学工业株式会社 化学放大型正光刻胶组合物及其树脂
JP4188265B2 (ja) 2003-10-23 2008-11-26 東京応化工業株式会社 レジスト組成物およびレジストパターン形成方法
CN1645254B (zh) * 2004-01-21 2010-05-12 住友化学株式会社 化学放大型正光刻胶组合物
KR100827903B1 (ko) * 2004-05-20 2008-05-07 미츠비시 레이온 가부시키가이샤 (메트)아크릴산 에스테르, 중합체, 및 레지스트 조성물
US7304175B2 (en) * 2005-02-16 2007-12-04 Sumitomo Chemical Company, Limited Salt suitable for an acid generator and a chemically amplified resist composition containing the same
KR100732301B1 (ko) 2005-06-02 2007-06-25 주식회사 하이닉스반도체 포토레지스트 중합체, 포토레지스트 조성물 및 이를 이용한반도체 소자의 제조 방법
CN1940726B (zh) * 2005-09-29 2011-07-13 住友化学株式会社 制备化学放大正性光刻胶用树脂的方法
KR20070045980A (ko) * 2005-10-28 2007-05-02 스미또모 가가꾸 가부시키가이샤 산 발생제에 적합한 염 및 이를 함유하는 화학증폭형레지스트 조성물
CN101236357B (zh) * 2007-01-30 2012-07-04 住友化学株式会社 化学放大型抗蚀剂组合物
KR101606010B1 (ko) * 2008-04-21 2016-03-24 스미또모 가가꾸 가부시키가이샤 중합체 및 이를 포함하는 화학 증폭형 레지스트 조성물
TWI462938B (zh) * 2008-05-21 2014-12-01 Sumitomo Chemical Co 聚合物及含有該聚合物之化學放大型阻劑組成物
KR20100068083A (ko) * 2008-12-12 2010-06-22 제일모직주식회사 (메트)아크릴레이트 화합물, 감광성 폴리머, 및 레지스트 조성물
TW201030466A (en) * 2008-12-25 2010-08-16 Sumitomo Chemical Co Chemically amplified positive resist composition
TWI541226B (zh) 2010-11-15 2016-07-11 羅門哈斯電子材料有限公司 鹼反應性光酸產生劑及包含該光酸產生劑之光阻劑
KR101400131B1 (ko) * 2013-02-22 2014-05-27 금호석유화학주식회사 레지스트용 중합체 및 이를 포함하는 레지스트 조성물
EP2970538B1 (de) 2013-03-15 2021-10-20 DuPont Electronics, Inc. Schutzmittel für ein polymerisationsverfahren
CN108132584B (zh) * 2017-12-22 2020-12-08 江苏汉拓光学材料有限公司 一种包含聚对羟基苯乙烯类聚合物和丙烯酸酯共聚物的光刻胶组合物
CN114133483B (zh) * 2021-12-16 2022-11-22 四川华造宏材科技有限公司 含金刚烷结构的丙烯酸酯成膜树脂及光刻胶与制备方法
CN114276317A (zh) * 2021-12-27 2022-04-05 徐州博康信息化学品有限公司 一种含内酯结构的光刻胶树脂单体的制备方法
CN114560768B (zh) * 2022-03-09 2024-03-15 河北凯诺中星科技有限公司 一种193nm光刻胶用丙烯酸酯树脂单体的合成方法

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TW482946B (en) * 1997-01-29 2002-04-11 Sumitomo Chemical Co Chemical amplification type positive photoresist composition
JP3546679B2 (ja) * 1997-01-29 2004-07-28 住友化学工業株式会社 化学増幅型ポジ型レジスト組成物
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US6057083A (en) * 1997-11-04 2000-05-02 Shipley Company, L.L.C. Polymers and photoresist compositions
US6165674A (en) * 1998-01-15 2000-12-26 Shipley Company, L.L.C. Polymers and photoresist compositions for short wavelength imaging
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Also Published As

Publication number Publication date
EP0982628B1 (de) 2006-11-02
US6239231B1 (en) 2001-05-29
EP0982628A2 (de) 2000-03-01
SG85129A1 (en) 2001-12-19
CN1245910A (zh) 2000-03-01
CN1190706C (zh) 2005-02-23
EP0982628A3 (de) 2000-05-03
KR100574574B1 (ko) 2006-04-28
TW520463B (en) 2003-02-11
DE69933825T2 (de) 2007-08-30
KR20000017485A (ko) 2000-03-25

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