DE69924225D1 - Akustische Oberflächenwellenanordnung - Google Patents
Akustische OberflächenwellenanordnungInfo
- Publication number
- DE69924225D1 DE69924225D1 DE69924225T DE69924225T DE69924225D1 DE 69924225 D1 DE69924225 D1 DE 69924225D1 DE 69924225 T DE69924225 T DE 69924225T DE 69924225 T DE69924225 T DE 69924225T DE 69924225 D1 DE69924225 D1 DE 69924225D1
- Authority
- DE
- Germany
- Prior art keywords
- surface wave
- acoustic surface
- wave arrangement
- arrangement
- acoustic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/058—Holders or supports for surface acoustic wave devices
- H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H2009/0019—Surface acoustic wave multichip
-
- H10W90/724—
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37725698 | 1998-12-29 | ||
| JP37725698 | 1998-12-29 | ||
| JP29474799 | 1999-10-18 | ||
| JP29474799 | 1999-10-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69924225D1 true DE69924225D1 (de) | 2005-04-21 |
| DE69924225T2 DE69924225T2 (de) | 2006-03-30 |
Family
ID=26559973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69924225T Expired - Lifetime DE69924225T2 (de) | 1998-12-29 | 1999-12-28 | Akustische Oberflächenwellenanordnung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6339365B1 (de) |
| EP (1) | EP1017169B1 (de) |
| KR (1) | KR100418550B1 (de) |
| DE (1) | DE69924225T2 (de) |
| SG (1) | SG108217A1 (de) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6287850B1 (en) * | 1995-06-07 | 2001-09-11 | Affymetrix, Inc. | Bioarray chip reaction apparatus and its manufacture |
| JP2001267881A (ja) * | 2000-03-17 | 2001-09-28 | Fujitsu Media Device Kk | 弾性表面波デバイス及びこれを用いた通信装置、並びにアンテナデュプレクサ |
| JP3729081B2 (ja) * | 2000-06-27 | 2005-12-21 | 株式会社村田製作所 | 弾性表面波装置 |
| JP4049239B2 (ja) * | 2000-08-30 | 2008-02-20 | Tdk株式会社 | 表面弾性波素子を含む高周波モジュール部品の製造方法 |
| US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US8623709B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount silicon condenser microphone packages |
| JP3747853B2 (ja) * | 2002-01-08 | 2006-02-22 | 株式会社村田製作所 | 弾性表面波装置を備えた分波器 |
| JP2003218150A (ja) * | 2002-01-23 | 2003-07-31 | Fujitsu Media Device Kk | モジュール部品 |
| US7312674B2 (en) * | 2002-08-06 | 2007-12-25 | The Charles Stark Draper Laboratory, Inc. | Resonator system with a plurality of individual mechanically coupled resonators and method of making same |
| US6975180B2 (en) * | 2002-08-08 | 2005-12-13 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave filter, and antenna duplexer and communication equipment using the same |
| JP3764731B2 (ja) * | 2002-10-18 | 2006-04-12 | 富士通メディアデバイス株式会社 | 多重モード弾性表面波フィルタ及び分波器 |
| JP4207836B2 (ja) * | 2003-07-25 | 2009-01-14 | 株式会社村田製作所 | 弾性表面波分波器 |
| US8222721B2 (en) * | 2003-09-15 | 2012-07-17 | Silicon Laboratories Inc. | Integrated circuit suitable for use in radio receivers |
| JP2005159896A (ja) * | 2003-11-27 | 2005-06-16 | Sanyo Electric Co Ltd | アンテナ共用器 |
| DE102004037819B4 (de) * | 2004-08-04 | 2021-12-16 | Snaptrack, Inc. | Elektroakustisches Bauelement mit geringen Verlusten |
| US7446629B2 (en) * | 2004-08-04 | 2008-11-04 | Matsushita Electric Industrial Co., Ltd. | Antenna duplexer, and RF module and communication apparatus using the same |
| JP4518870B2 (ja) * | 2004-08-24 | 2010-08-04 | 京セラ株式会社 | 弾性表面波装置および通信装置 |
| KR100691160B1 (ko) * | 2005-05-06 | 2007-03-09 | 삼성전기주식회사 | 적층형 표면탄성파 패키지 및 그 제조방법 |
| US8258674B2 (en) * | 2008-11-03 | 2012-09-04 | Viorel Olariu | Surface acoustic wave sensor and system |
| JP5240793B2 (ja) * | 2009-03-09 | 2013-07-17 | 日本電波工業株式会社 | デュプレクサ |
| JP5029704B2 (ja) * | 2010-01-20 | 2012-09-19 | 株式会社村田製作所 | 弾性波デュプレクサ |
| JP5333403B2 (ja) | 2010-10-12 | 2013-11-06 | 株式会社村田製作所 | 弾性表面波フィルタ装置 |
| JP2012182604A (ja) * | 2011-03-01 | 2012-09-20 | Panasonic Corp | 弾性波フィルタ部品 |
| EP2774390A4 (de) | 2011-11-04 | 2015-07-22 | Knowles Electronics Llc | Eingebettetes dielektrikum als barriere bei einer akustischen vorrichtung und herstellungsverfahren |
| US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| KR101616639B1 (ko) * | 2014-11-11 | 2016-04-28 | 삼성전기주식회사 | 표면 탄성파 소자 및 그 실장 장치, 이를 이용한 측정 센서 |
| US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
| TWI677951B (zh) * | 2018-11-09 | 2019-11-21 | 恆勁科技股份有限公司 | 表面聲波濾波器封裝結構及其製作方法 |
| US12025516B2 (en) * | 2019-09-23 | 2024-07-02 | Sensanna Incorporated | Strain sensors with enhanced temperature compensation |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1089544A (en) * | 1976-11-09 | 1980-11-11 | Sadao Takahashi | Elastic surface wave device |
| CA1281810C (en) * | 1984-02-20 | 1991-03-19 | Stephen P. Rogerson | Mounting of saw devices |
| JPS61285814A (ja) | 1985-06-12 | 1986-12-16 | Toyo Commun Equip Co Ltd | 縦型2重モ−ドsawフイルタ |
| JPS62173814A (ja) * | 1986-01-28 | 1987-07-30 | Alps Electric Co Ltd | 弾性表面波素子搭載ユニツト |
| JP2555072B2 (ja) | 1987-05-11 | 1996-11-20 | 株式会社日立製作所 | 固体電子装置 |
| US5202652A (en) * | 1989-10-13 | 1993-04-13 | Hitachi, Ltd. | Surface acoustic wave filter device formed on a plurality of piezoelectric substrates |
| JP3386806B2 (ja) | 1989-10-13 | 2003-03-17 | 株式会社日立製作所 | 通信装置 |
| JP2673993B2 (ja) * | 1990-07-02 | 1997-11-05 | 日本無線株式会社 | 表面弾性波装置 |
| JPH04170811A (ja) * | 1990-11-05 | 1992-06-18 | Fujitsu Ltd | 弾性表面波デバイス |
| JPH0590873A (ja) | 1991-09-28 | 1993-04-09 | Murata Mfg Co Ltd | 弾性表面波装置 |
| US5459368A (en) * | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
| KR0171921B1 (ko) * | 1993-09-13 | 1999-03-30 | 모리시타 요이찌 | 전자부품과 그 제조방법 |
| JPH07283682A (ja) | 1994-04-13 | 1995-10-27 | Murata Mfg Co Ltd | 弾性表面波共振子フィルタ |
| JP3198252B2 (ja) | 1995-05-31 | 2001-08-13 | 富士通株式会社 | 分波器及びその製造方法 |
| JPH09232904A (ja) * | 1996-02-28 | 1997-09-05 | Oki Electric Ind Co Ltd | Sawフィルタ用セラミックパッケージ |
| EP0794616B1 (de) * | 1996-03-08 | 2003-01-29 | Matsushita Electric Industrial Co., Ltd. | Elektronisches Bauteil und Herstellungsverfahren |
| JPH1040435A (ja) | 1996-07-25 | 1998-02-13 | Toshiba Corp | 硬貨識別装置 |
| JP3735418B2 (ja) * | 1996-08-28 | 2006-01-18 | 日本無線株式会社 | 弾性表面波デバイスおよびこれを使用する通信装置 |
| JP3196693B2 (ja) * | 1997-08-05 | 2001-08-06 | 日本電気株式会社 | 表面弾性波装置およびその製造方法 |
-
1999
- 1999-12-28 EP EP99125997A patent/EP1017169B1/de not_active Expired - Lifetime
- 1999-12-28 US US09/472,813 patent/US6339365B1/en not_active Expired - Lifetime
- 1999-12-28 DE DE69924225T patent/DE69924225T2/de not_active Expired - Lifetime
- 1999-12-28 KR KR10-1999-0063164A patent/KR100418550B1/ko not_active Expired - Lifetime
- 1999-12-28 SG SG9906654A patent/SG108217A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE69924225T2 (de) | 2006-03-30 |
| KR100418550B1 (ko) | 2004-02-11 |
| SG108217A1 (en) | 2005-01-28 |
| EP1017169B1 (de) | 2005-03-16 |
| US6339365B1 (en) | 2002-01-15 |
| EP1017169A2 (de) | 2000-07-05 |
| EP1017169A3 (de) | 2002-05-08 |
| KR20000052590A (ko) | 2000-08-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |