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DE69913231D1 - Verbindung zwischen zwei Leiterplatten - Google Patents

Verbindung zwischen zwei Leiterplatten

Info

Publication number
DE69913231D1
DE69913231D1 DE69913231T DE69913231T DE69913231D1 DE 69913231 D1 DE69913231 D1 DE 69913231D1 DE 69913231 T DE69913231 T DE 69913231T DE 69913231 T DE69913231 T DE 69913231T DE 69913231 D1 DE69913231 D1 DE 69913231D1
Authority
DE
Germany
Prior art keywords
connection
circuit boards
boards
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69913231T
Other languages
English (en)
Other versions
DE69913231T2 (de
Inventor
David R Crotzer
Stephen D Delprete
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Installation Products International LLC
Original Assignee
Thomas and Betts International LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas and Betts International LLC filed Critical Thomas and Betts International LLC
Application granted granted Critical
Publication of DE69913231D1 publication Critical patent/DE69913231D1/de
Publication of DE69913231T2 publication Critical patent/DE69913231T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10378Interposers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
DE69913231T 1998-04-08 1999-04-08 Verbindung zwischen zwei Leiterplatten Expired - Lifetime DE69913231T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/056,972 US6056557A (en) 1998-04-08 1998-04-08 Board to board interconnect
US56972 1998-04-08

Publications (2)

Publication Number Publication Date
DE69913231D1 true DE69913231D1 (de) 2004-01-15
DE69913231T2 DE69913231T2 (de) 2004-09-09

Family

ID=22007715

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69913231T Expired - Lifetime DE69913231T2 (de) 1998-04-08 1999-04-08 Verbindung zwischen zwei Leiterplatten

Country Status (5)

Country Link
US (1) US6056557A (de)
EP (1) EP0949714B1 (de)
JP (1) JP2000003742A (de)
CA (1) CA2268294C (de)
DE (1) DE69913231T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6348659B1 (en) * 1999-01-07 2002-02-19 Thomas & Betts International, Inc. Resilient electrical interconnects having non-uniform cross-section
IL128997A (en) * 1999-03-15 2002-12-01 Aprion Digital Ltd Install electrical connection
EP1061608A3 (de) * 1999-05-10 2002-10-02 Hirose Electric Co., Ltd. Elektrische Zwischenverbinder für zwei Leiterplatten
US6413102B2 (en) * 1999-12-22 2002-07-02 Micron Technology, Inc. Center bond flip chip semiconductor carrier and a method of making and using it
US6471525B1 (en) * 2000-08-24 2002-10-29 High Connection Density, Inc. Shielded carrier for land grid array connectors and a process for fabricating same
WO2002045474A2 (en) 2000-12-05 2002-06-13 Aprion Digital Ltd. Board integrated resilient contact elements array and method of fabrication
US6796810B2 (en) 2002-12-10 2004-09-28 Tyco Electronics Corporation Conductive elastomeric contact system
US6790057B2 (en) 2002-12-10 2004-09-14 Tyco Electronics Corporation Conductive elastomeric contact system with anti-overstress columns
DE10324047B4 (de) * 2003-05-27 2013-02-28 Continental Automotive Gmbh Elektronikeinheit sowie Verfahren zur Herstellung einer Elektronikeinheit
US20050082160A1 (en) * 2003-10-15 2005-04-21 Sharper Image Corporation Electro-kinetic air transporter and conditioner devices with a mesh collector electrode
TWI343156B (en) * 2003-10-16 2011-06-01 Tyco Electronics Corp Conductive elastomeric contact system with anti-overstress columns
US7059867B1 (en) * 2005-03-30 2006-06-13 Artesyn Technologies, Inc. High density multi-lead surface mount interconnect and devices including same
US7070420B1 (en) * 2005-08-08 2006-07-04 Wakefield Steven B Electrical interconnect system utilizing nonconductive elastomeric elements and continuous conductive elements
US7549870B2 (en) * 2007-01-03 2009-06-23 Tyco Electronics Corporation Electrical interconnect device utilizing contact caps
US7572131B2 (en) * 2007-03-13 2009-08-11 Tyco Electronics Corporation Electrical interconnect system utilizing non-conductive elastomeric elements
US7726976B2 (en) * 2007-11-09 2010-06-01 Tyco Electronics Corporation Shielded electrical interconnect
CN101982903A (zh) * 2010-09-15 2011-03-02 华为技术有限公司 电路板连接器及通信设备
WO2013089687A1 (en) * 2011-12-13 2013-06-20 Empire Technology Development Llc Elastomer adhesions
US10141690B2 (en) 2014-08-04 2018-11-27 Vaios Nikolaos Bozikis Electrical plug and socket securement system
US10135190B2 (en) 2014-08-04 2018-11-20 Vaios Nikolaos Bozikis Electrical plug and socket securement system
US9876298B2 (en) 2014-08-04 2018-01-23 Te Connectivity Corporation Flexible connector and methods of manufacture
US10104772B2 (en) 2014-08-19 2018-10-16 International Business Machines Incorporated Metallized particle interconnect with solder components
US10320122B2 (en) 2017-02-25 2019-06-11 Vaios Nikolaos Bozikis Double side adjustable electrical cord securement device
WO2021212434A1 (zh) * 2020-04-23 2021-10-28 宏启胜精密电子(秦皇岛)有限公司 板对板连接结构及其制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61145888A (ja) * 1984-12-20 1986-07-03 松下電器産業株式会社 印刷配線基板接続装置
US5098305A (en) * 1987-05-21 1992-03-24 Cray Research, Inc. Memory metal electrical connector
JPH02139987A (ja) * 1988-11-18 1990-05-29 Fujitsu Ltd 複数のプリント基板に対する共通配線機構
DE69225495T2 (de) * 1991-12-31 1998-10-08 Tessera Inc Verfahren zur konstruktion von mehrschichtigen schaltungen, strukturen mit personalisierungsmerkmalen und darin verwendete komponenten
JP2534003B2 (ja) * 1992-03-17 1996-09-11 信越化学工業株式会社 積層ゴム成形体
US5417577A (en) * 1992-09-23 1995-05-23 At&T Corp. Interconnection method and apparatus
JPH0778645A (ja) * 1993-09-09 1995-03-20 Japan Aviation Electron Ind Ltd 電気接続用コネクタ
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
WO1997013295A1 (en) * 1995-10-06 1997-04-10 The Whitaker Corporation Connector and manufacturing method therefor
JP2987101B2 (ja) * 1996-04-15 1999-12-06 株式会社ニッシン 半導体装置の接続方法並びに半導体装置の接続器

Also Published As

Publication number Publication date
CA2268294C (en) 2002-06-11
EP0949714A3 (de) 2000-11-02
CA2268294A1 (en) 1999-10-08
DE69913231T2 (de) 2004-09-09
US6056557A (en) 2000-05-02
JP2000003742A (ja) 2000-01-07
EP0949714A2 (de) 1999-10-13
EP0949714B1 (de) 2003-12-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition