DE69913231D1 - Verbindung zwischen zwei Leiterplatten - Google Patents
Verbindung zwischen zwei LeiterplattenInfo
- Publication number
- DE69913231D1 DE69913231D1 DE69913231T DE69913231T DE69913231D1 DE 69913231 D1 DE69913231 D1 DE 69913231D1 DE 69913231 T DE69913231 T DE 69913231T DE 69913231 T DE69913231 T DE 69913231T DE 69913231 D1 DE69913231 D1 DE 69913231D1
- Authority
- DE
- Germany
- Prior art keywords
- connection
- circuit boards
- boards
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/056,972 US6056557A (en) | 1998-04-08 | 1998-04-08 | Board to board interconnect |
| US56972 | 1998-04-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69913231D1 true DE69913231D1 (de) | 2004-01-15 |
| DE69913231T2 DE69913231T2 (de) | 2004-09-09 |
Family
ID=22007715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69913231T Expired - Lifetime DE69913231T2 (de) | 1998-04-08 | 1999-04-08 | Verbindung zwischen zwei Leiterplatten |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6056557A (de) |
| EP (1) | EP0949714B1 (de) |
| JP (1) | JP2000003742A (de) |
| CA (1) | CA2268294C (de) |
| DE (1) | DE69913231T2 (de) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6348659B1 (en) * | 1999-01-07 | 2002-02-19 | Thomas & Betts International, Inc. | Resilient electrical interconnects having non-uniform cross-section |
| IL128997A (en) * | 1999-03-15 | 2002-12-01 | Aprion Digital Ltd | Install electrical connection |
| EP1061608A3 (de) * | 1999-05-10 | 2002-10-02 | Hirose Electric Co., Ltd. | Elektrische Zwischenverbinder für zwei Leiterplatten |
| US6413102B2 (en) * | 1999-12-22 | 2002-07-02 | Micron Technology, Inc. | Center bond flip chip semiconductor carrier and a method of making and using it |
| US6471525B1 (en) * | 2000-08-24 | 2002-10-29 | High Connection Density, Inc. | Shielded carrier for land grid array connectors and a process for fabricating same |
| WO2002045474A2 (en) | 2000-12-05 | 2002-06-13 | Aprion Digital Ltd. | Board integrated resilient contact elements array and method of fabrication |
| US6796810B2 (en) | 2002-12-10 | 2004-09-28 | Tyco Electronics Corporation | Conductive elastomeric contact system |
| US6790057B2 (en) | 2002-12-10 | 2004-09-14 | Tyco Electronics Corporation | Conductive elastomeric contact system with anti-overstress columns |
| DE10324047B4 (de) * | 2003-05-27 | 2013-02-28 | Continental Automotive Gmbh | Elektronikeinheit sowie Verfahren zur Herstellung einer Elektronikeinheit |
| US20050082160A1 (en) * | 2003-10-15 | 2005-04-21 | Sharper Image Corporation | Electro-kinetic air transporter and conditioner devices with a mesh collector electrode |
| TWI343156B (en) * | 2003-10-16 | 2011-06-01 | Tyco Electronics Corp | Conductive elastomeric contact system with anti-overstress columns |
| US7059867B1 (en) * | 2005-03-30 | 2006-06-13 | Artesyn Technologies, Inc. | High density multi-lead surface mount interconnect and devices including same |
| US7070420B1 (en) * | 2005-08-08 | 2006-07-04 | Wakefield Steven B | Electrical interconnect system utilizing nonconductive elastomeric elements and continuous conductive elements |
| US7549870B2 (en) * | 2007-01-03 | 2009-06-23 | Tyco Electronics Corporation | Electrical interconnect device utilizing contact caps |
| US7572131B2 (en) * | 2007-03-13 | 2009-08-11 | Tyco Electronics Corporation | Electrical interconnect system utilizing non-conductive elastomeric elements |
| US7726976B2 (en) * | 2007-11-09 | 2010-06-01 | Tyco Electronics Corporation | Shielded electrical interconnect |
| CN101982903A (zh) * | 2010-09-15 | 2011-03-02 | 华为技术有限公司 | 电路板连接器及通信设备 |
| WO2013089687A1 (en) * | 2011-12-13 | 2013-06-20 | Empire Technology Development Llc | Elastomer adhesions |
| US10141690B2 (en) | 2014-08-04 | 2018-11-27 | Vaios Nikolaos Bozikis | Electrical plug and socket securement system |
| US10135190B2 (en) | 2014-08-04 | 2018-11-20 | Vaios Nikolaos Bozikis | Electrical plug and socket securement system |
| US9876298B2 (en) | 2014-08-04 | 2018-01-23 | Te Connectivity Corporation | Flexible connector and methods of manufacture |
| US10104772B2 (en) | 2014-08-19 | 2018-10-16 | International Business Machines Incorporated | Metallized particle interconnect with solder components |
| US10320122B2 (en) | 2017-02-25 | 2019-06-11 | Vaios Nikolaos Bozikis | Double side adjustable electrical cord securement device |
| WO2021212434A1 (zh) * | 2020-04-23 | 2021-10-28 | 宏启胜精密电子(秦皇岛)有限公司 | 板对板连接结构及其制作方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61145888A (ja) * | 1984-12-20 | 1986-07-03 | 松下電器産業株式会社 | 印刷配線基板接続装置 |
| US5098305A (en) * | 1987-05-21 | 1992-03-24 | Cray Research, Inc. | Memory metal electrical connector |
| JPH02139987A (ja) * | 1988-11-18 | 1990-05-29 | Fujitsu Ltd | 複数のプリント基板に対する共通配線機構 |
| DE69225495T2 (de) * | 1991-12-31 | 1998-10-08 | Tessera Inc | Verfahren zur konstruktion von mehrschichtigen schaltungen, strukturen mit personalisierungsmerkmalen und darin verwendete komponenten |
| JP2534003B2 (ja) * | 1992-03-17 | 1996-09-11 | 信越化学工業株式会社 | 積層ゴム成形体 |
| US5417577A (en) * | 1992-09-23 | 1995-05-23 | At&T Corp. | Interconnection method and apparatus |
| JPH0778645A (ja) * | 1993-09-09 | 1995-03-20 | Japan Aviation Electron Ind Ltd | 電気接続用コネクタ |
| US5599193A (en) * | 1994-08-23 | 1997-02-04 | Augat Inc. | Resilient electrical interconnect |
| WO1997013295A1 (en) * | 1995-10-06 | 1997-04-10 | The Whitaker Corporation | Connector and manufacturing method therefor |
| JP2987101B2 (ja) * | 1996-04-15 | 1999-12-06 | 株式会社ニッシン | 半導体装置の接続方法並びに半導体装置の接続器 |
-
1998
- 1998-04-08 US US09/056,972 patent/US6056557A/en not_active Expired - Lifetime
-
1999
- 1999-04-07 CA CA002268294A patent/CA2268294C/en not_active Expired - Fee Related
- 1999-04-08 DE DE69913231T patent/DE69913231T2/de not_active Expired - Lifetime
- 1999-04-08 JP JP11101298A patent/JP2000003742A/ja active Pending
- 1999-04-08 EP EP99302753A patent/EP0949714B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CA2268294C (en) | 2002-06-11 |
| EP0949714A3 (de) | 2000-11-02 |
| CA2268294A1 (en) | 1999-10-08 |
| DE69913231T2 (de) | 2004-09-09 |
| US6056557A (en) | 2000-05-02 |
| JP2000003742A (ja) | 2000-01-07 |
| EP0949714A2 (de) | 1999-10-13 |
| EP0949714B1 (de) | 2003-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |