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DE69900894D1 - Gegen Ermüdung widerstandsfähige, bleifreie Legierung - Google Patents

Gegen Ermüdung widerstandsfähige, bleifreie Legierung

Info

Publication number
DE69900894D1
DE69900894D1 DE69900894T DE69900894T DE69900894D1 DE 69900894 D1 DE69900894 D1 DE 69900894D1 DE 69900894 T DE69900894 T DE 69900894T DE 69900894 T DE69900894 T DE 69900894T DE 69900894 D1 DE69900894 D1 DE 69900894D1
Authority
DE
Germany
Prior art keywords
free
fat
lead
alloy
free alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69900894T
Other languages
English (en)
Other versions
DE69900894T2 (de
Inventor
Shing Yeh
Curtis Wayne Melcher
Bradley Howard Carter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Application granted granted Critical
Publication of DE69900894D1 publication Critical patent/DE69900894D1/de
Publication of DE69900894T2 publication Critical patent/DE69900894T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69900894T 1998-04-03 1999-03-23 Gegen Ermüdung widerstandsfähige, bleifreie Legierung Expired - Lifetime DE69900894T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/070,070 US5938862A (en) 1998-04-03 1998-04-03 Fatigue-resistant lead-free alloy

Publications (2)

Publication Number Publication Date
DE69900894D1 true DE69900894D1 (de) 2002-03-28
DE69900894T2 DE69900894T2 (de) 2002-06-27

Family

ID=22092936

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69900894T Expired - Lifetime DE69900894T2 (de) 1998-04-03 1999-03-23 Gegen Ermüdung widerstandsfähige, bleifreie Legierung

Country Status (3)

Country Link
US (1) US5938862A (de)
EP (1) EP0953400B1 (de)
DE (1) DE69900894T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG98429A1 (en) * 1999-10-12 2003-09-19 Singapore Asahi Chemical & Solder Ind Pte Ltd Lead-free solders
KR100788011B1 (ko) * 1999-12-21 2007-12-21 어드밴스드 마이크로 디바이시즈, 인코포레이티드 플립 칩 접속부를 신뢰성 있게 하기 위해 솔더를 사용한유기 패키지
WO2001047014A1 (en) * 1999-12-21 2001-06-28 Advanced Micro Devices, Inc. Organic flip chip packages with an array of through hole pins
US6229207B1 (en) 2000-01-13 2001-05-08 Advanced Micro Devices, Inc. Organic pin grid array flip chip carrier package
WO2001078931A1 (en) * 2000-04-17 2001-10-25 Fujitsu Limited Solder joining
US6429388B1 (en) 2000-05-03 2002-08-06 International Business Machines Corporation High density column grid array connections and method thereof
DE10025107A1 (de) * 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leifähiges Metallband und Steckverbinder
US6545344B2 (en) * 2000-06-27 2003-04-08 Texas Instruments Incorporated Semiconductor leadframes plated with lead-free solder and minimum palladium
US6523608B1 (en) * 2000-07-31 2003-02-25 Intel Corporation Thermal interface material on a mesh carrier
US6896172B2 (en) * 2000-08-22 2005-05-24 Senju Metal Industry Co., Ltd. Lead-free solder paste for reflow soldering
CZ297089B6 (cs) * 2000-11-16 2006-09-13 Singapore Asahi Chemical And Solder Industries Pte. Ltd. Bezolovnatá pájecí slitina
JP4293500B2 (ja) * 2001-05-07 2009-07-08 第一電子工業株式会社 電子部品の製造方法
US7187083B2 (en) * 2001-05-24 2007-03-06 Fry's Metals, Inc. Thermal interface material and solder preforms
US6653741B2 (en) 2001-05-24 2003-11-25 Fry's Metals, Inc. Thermal interface material and heat sink configuration
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
US6570260B1 (en) * 2002-02-15 2003-05-27 Delphi Technologies, Inc. Solder process and solder alloy therefor
US6767411B2 (en) * 2002-03-15 2004-07-27 Delphi Technologies, Inc. Lead-free solder alloy and solder reflow process
US6811892B2 (en) 2002-08-22 2004-11-02 Delphi Technologies, Inc. Lead-based solder alloys containing copper
US6630251B1 (en) 2002-09-23 2003-10-07 Delphi Technologies, Inc. Leach-resistant solder alloys for silver-based thick-film conductors
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
US7215030B2 (en) * 2005-06-27 2007-05-08 Advanced Micro Devices, Inc. Lead-free semiconductor package
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
US20070231594A1 (en) * 2005-08-12 2007-10-04 John Pereira Multilayer solder article
DE102006047764A1 (de) * 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
DE202006015429U1 (de) * 2006-10-09 2008-02-21 Innowatec Dipl.-Ing. Grieger & Englert Gmbh & Co. Kg Vorrichtung zum Reinigen eines Druckzylinders
RU2367551C2 (ru) * 2007-10-29 2009-09-20 Государственное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Бессвинцовый припой
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3641679A1 (de) * 1986-02-19 1987-08-20 Degussa Verwendung einer weichlotlegierung zum verbinden von keramikteilen
JP2950478B2 (ja) * 1990-04-19 1999-09-20 大豊工業株式会社 滑り軸受合金
US5352407A (en) * 1993-04-29 1994-10-04 Seelig Karl F Lead-free bismuth free tin alloy solder composition
US5405577A (en) * 1993-04-29 1995-04-11 Seelig; Karl F. Lead-free and bismuth-free tin alloy solder composition
TW251249B (de) * 1993-04-30 1995-07-11 At & T Corp
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5435968A (en) * 1994-01-21 1995-07-25 Touchstone, Inc. A lead-free solder composition
US5427865A (en) * 1994-05-02 1995-06-27 Motorola, Inc. Multiple alloy solder preform
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR980006783A (ko) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조

Also Published As

Publication number Publication date
EP0953400A1 (de) 1999-11-03
US5938862A (en) 1999-08-17
DE69900894T2 (de) 2002-06-27
EP0953400B1 (de) 2002-02-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition