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DE69838604D1 - Gedruckte platte und verfahren zu deren herstellung - Google Patents

Gedruckte platte und verfahren zu deren herstellung

Info

Publication number
DE69838604D1
DE69838604D1 DE69838604T DE69838604T DE69838604D1 DE 69838604 D1 DE69838604 D1 DE 69838604D1 DE 69838604 T DE69838604 T DE 69838604T DE 69838604 T DE69838604 T DE 69838604T DE 69838604 D1 DE69838604 D1 DE 69838604D1
Authority
DE
Germany
Prior art keywords
production
printed plate
printed
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69838604T
Other languages
English (en)
Other versions
DE69838604T2 (de
Inventor
Satoshi Nakamura
Masaharu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP01018497A external-priority patent/JP3198331B2/ja
Priority claimed from JP13336697A external-priority patent/JPH10321975A/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Application granted granted Critical
Publication of DE69838604D1 publication Critical patent/DE69838604D1/de
Publication of DE69838604T2 publication Critical patent/DE69838604T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE69838604T 1997-01-23 1998-01-22 Gedruckte platte und verfahren zu deren herstellung Expired - Fee Related DE69838604T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP1018497 1997-01-23
JP01018497A JP3198331B2 (ja) 1997-01-23 1997-01-23 金属端子片を有する回路基板の製造方法、この製造方法により得られる回路基板、およびこの回路基板に対する導体片の接続方法
JP13336697A JPH10321975A (ja) 1997-05-23 1997-05-23 プリント基板に対する電線等の接続構造
JP13336697 1997-05-23
PCT/JP1998/000280 WO1998033363A1 (en) 1997-01-23 1998-01-22 Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board

Publications (2)

Publication Number Publication Date
DE69838604D1 true DE69838604D1 (de) 2007-12-06
DE69838604T2 DE69838604T2 (de) 2008-06-05

Family

ID=26345414

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69838604T Expired - Fee Related DE69838604T2 (de) 1997-01-23 1998-01-22 Gedruckte platte und verfahren zu deren herstellung

Country Status (7)

Country Link
US (1) US6281449B1 (de)
EP (1) EP0893945B1 (de)
KR (1) KR100364450B1 (de)
CN (1) CN1125508C (de)
DE (1) DE69838604T2 (de)
TW (1) TW361772U (de)
WO (1) WO1998033363A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3776907B2 (ja) * 2003-11-21 2006-05-24 ローム株式会社 回路基板
KR20090007006A (ko) * 2007-07-13 2009-01-16 삼성전자주식회사 액정 표시 장치 및 그의 제조 방법
US20100294546A1 (en) * 2009-05-22 2010-11-25 Sean Nickel Circuit board and method for a low profile wire connection
WO2011004556A1 (ja) * 2009-07-06 2011-01-13 株式会社フジクラ 貫通配線基板及びその製造方法
DE202012002352U1 (de) * 2011-05-17 2012-04-18 Erni Electronics Gmbh Anordnung aus Steckverbinder und Leiterplatte
WO2013192418A2 (en) * 2012-06-21 2013-12-27 Ideal Industries, Inc. Electrical connectors for use with printed circuit boards
US9296056B2 (en) * 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
DE102015100647B4 (de) * 2015-01-19 2021-05-06 Lisa Dräxlmaier GmbH Leiterplatte mit Steckkontaktelement
DE102016106482A1 (de) 2016-04-08 2017-10-12 Biotronik Se & Co. Kg Verbindungselement für eine elektronische Bauelementanordnung und Verfahren zum Herstellen desselben, elektronische Bauelementanordnung und Verfahren zum Herstellen desselben
CN108620704B (zh) * 2017-03-17 2021-02-02 泰科电子(上海)有限公司 夹持系统和焊接方法
FR3063200A1 (fr) * 2017-06-08 2018-08-24 Continental Automotive France Procede de soudure d'au moins une connexion electrique sur une carte de circuit imprime et carte de circuit imprime
US10938173B2 (en) * 2018-09-25 2021-03-02 Caliente LLC Resistance welding copper terminals through mylar

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3120415A (en) * 1959-06-01 1964-02-04 Sanders Associates Inc Connector for flexible cable
US3529212A (en) * 1967-12-26 1970-09-15 Corning Glass Works Printed circuit assembly
JPS6255878A (ja) 1985-09-02 1987-03-11 株式会社日立製作所 細線溶接用端子およびそれを使用した細線の溶接方法
JPS6355373A (ja) 1986-08-21 1988-03-09 Soroku Kawaguchi 重力機関
JPS6355373U (de) * 1986-09-30 1988-04-13
JPS63299063A (ja) 1987-05-29 1988-12-06 Tokyo Electric Co Ltd リ−ド線の固定構造
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
DE3916944A1 (de) * 1989-05-24 1990-11-29 Swf Auto Electric Gmbh Elektrisches geraet
US5091826A (en) * 1990-03-27 1992-02-25 At&T Bell Laboratories Printed wiring board connector
DE4324917A1 (de) * 1992-07-27 1994-02-03 Grote & Hartmann Elektrisches Kontaktelement für eine Leiterplatten-Randverbindung

Also Published As

Publication number Publication date
EP0893945A1 (de) 1999-01-27
US6281449B1 (en) 2001-08-28
EP0893945B1 (de) 2007-10-24
EP0893945A4 (de) 2005-03-30
WO1998033363A1 (en) 1998-07-30
TW361772U (en) 1999-06-11
CN1216212A (zh) 1999-05-05
KR100364450B1 (ko) 2003-05-09
DE69838604T2 (de) 2008-06-05
KR20000064744A (ko) 2000-11-06
CN1125508C (zh) 2003-10-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee