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DE69835697D1 - Bauteile-bestückungsvorrichtung und bauteile-zufuhrvorrichtung - Google Patents

Bauteile-bestückungsvorrichtung und bauteile-zufuhrvorrichtung

Info

Publication number
DE69835697D1
DE69835697D1 DE69835697T DE69835697T DE69835697D1 DE 69835697 D1 DE69835697 D1 DE 69835697D1 DE 69835697 T DE69835697 T DE 69835697T DE 69835697 T DE69835697 T DE 69835697T DE 69835697 D1 DE69835697 D1 DE 69835697D1
Authority
DE
Germany
Prior art keywords
component
feeding device
fitting
fitting device
component feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69835697T
Other languages
English (en)
Other versions
DE69835697T2 (de
Inventor
Osamu Okuda
Akira Kabeshita
Naoyuki Kitamura
Yoshihiro Yoshida
Mamoru Inoue
Kazuo Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP30667897A external-priority patent/JP3883674B2/ja
Priority claimed from JP30668097A external-priority patent/JP3540138B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69835697D1 publication Critical patent/DE69835697D1/de
Publication of DE69835697T2 publication Critical patent/DE69835697T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
DE69835697T 1997-11-10 1998-11-09 Bauteile-bestückungsvorrichtung und bauteilezufuhrvorrichtung Expired - Lifetime DE69835697T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP30667897A JP3883674B2 (ja) 1997-11-10 1997-11-10 部品供給装置
JP30668097A JP3540138B2 (ja) 1997-11-10 1997-11-10 部品装着装置
JP30667897 1997-11-10
JP30668097 1997-11-10
PCT/JP1998/005049 WO1999025168A1 (en) 1997-11-10 1998-11-09 Part mounting apparatus and part supply apparatus

Publications (2)

Publication Number Publication Date
DE69835697D1 true DE69835697D1 (de) 2006-10-05
DE69835697T2 DE69835697T2 (de) 2007-03-29

Family

ID=26564822

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69835697T Expired - Lifetime DE69835697T2 (de) 1997-11-10 1998-11-09 Bauteile-bestückungsvorrichtung und bauteilezufuhrvorrichtung

Country Status (5)

Country Link
US (1) US6594887B1 (de)
EP (2) EP1054584B1 (de)
CN (1) CN1151708C (de)
DE (1) DE69835697T2 (de)
WO (1) WO1999025168A1 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
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WO1999025168A1 (en) * 1997-11-10 1999-05-20 Matsushita Electric Industrial Co., Ltd. Part mounting apparatus and part supply apparatus
US6571462B1 (en) * 1999-04-27 2003-06-03 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus using duplicate sources of components
JP4514322B2 (ja) * 2000-12-08 2010-07-28 パナソニック株式会社 部品実装方法、及び部品実装装置
US6853874B2 (en) * 2000-12-08 2005-02-08 Fuji Machine Mfg. Co., Ltd. Variable-width substrate conveyor, method of changing width of the same, and method of matching widths of two adjacent substrate conveyors
GB2372884B (en) * 2001-02-28 2005-01-05 Speedprint Ltd Multifunction machine and method of forming a control interface
JP4582963B2 (ja) * 2001-06-14 2010-11-17 パナソニック株式会社 電子部品装着装置
KR100436213B1 (ko) * 2001-12-17 2004-06-16 미래산업 주식회사 반도체 소자 테스트 핸들러용 소자 정렬장치
US6874225B2 (en) * 2001-12-18 2005-04-05 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus
JP3966728B2 (ja) * 2002-01-07 2007-08-29 株式会社リコー チップ部品収容装置及びそれを備えたチップ部品検査装置
CN101267728B (zh) * 2002-11-21 2011-09-21 富士机械制造株式会社 元件安装设备
CN100377326C (zh) * 2002-12-02 2008-03-26 松下电器产业株式会社 零件供给头装置、零件供给装置、零件安装装置、以及安装头部的移动方法
JP4313031B2 (ja) * 2002-12-13 2009-08-12 パナソニック株式会社 ツール交換装置及びツール
USD494988S1 (en) 2003-03-13 2004-08-24 Matsushita Electric Industrial Co., Ltd. Electric component placement machine
USD493808S1 (en) 2003-03-13 2004-08-03 Matsushita Electric Industrial Co., Ltd. Electric component placement machine
JP4003882B2 (ja) * 2003-09-26 2007-11-07 シャープ株式会社 基板移載システム
JP2005347317A (ja) * 2004-05-31 2005-12-15 Yamaha Motor Co Ltd 部品供給装置およびそれを備えた実装機
EP1796453A1 (de) * 2004-09-28 2007-06-13 Matsushita Electric Industrial Co., Ltd. Wartungsverfahren und komponenten-anbringvorrichtung
KR100687676B1 (ko) * 2006-02-10 2007-02-27 (주)테크윙 테스트핸들러
CN101106897B (zh) * 2006-09-27 2010-12-29 深圳市翠涛自动化设备有限公司 应用多头转塔机构的高速拾放机
WO2008090976A1 (ja) * 2007-01-25 2008-07-31 Panasonic Corporation 段積みトレイの供給装置及び供給方法、並びに部品実装装置及び方法
DE102007048413B3 (de) * 2007-10-09 2009-04-16 Siemens Ag Zuführvorrichtung vor Bauelemente zu einem Bestückautomaten zur Bestückung von Substraten mit Bauelementen
DE102007048410B4 (de) 2007-10-09 2009-07-30 Siemens Ag Zuführvorrichtung für Bauelemente zu einem Bestückautomaten zur Bestückung von Substraten mit den Bauelementen
US8483914B2 (en) * 2008-09-03 2013-07-09 Caterpillar Inc. Electrically adjustable control interface
KR20110107809A (ko) 2009-01-08 2011-10-04 파나소닉 주식회사 부품 실장장치 및 그 방법
JP5246064B2 (ja) * 2009-06-29 2013-07-24 パナソニック株式会社 電子部品実装方法
JP5152147B2 (ja) * 2009-10-26 2013-02-27 パナソニック株式会社 部品実装機、部品実装システム及び部品実装方法
JP5351777B2 (ja) * 2010-01-08 2013-11-27 ヤマハ発動機株式会社 部品供給装置および表面実装機
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
JP5755935B2 (ja) * 2011-05-13 2015-07-29 富士機械製造株式会社 部品ピッチ計測装置及び部品ピッチ計測方法
JP5812456B2 (ja) * 2012-02-28 2015-11-11 富士機械製造株式会社 部品実装機
CN104704938B (zh) * 2012-09-28 2018-01-26 富士机械制造株式会社 对基板作业机
JP6239267B2 (ja) * 2013-05-21 2017-11-29 Ｊｕｋｉオートメーションシステムズ株式会社 実装装置、コンベア装置、制御方法及びプログラム
US10462947B2 (en) * 2013-10-31 2019-10-29 Fuji Corporation Component mounting machine
KR102120713B1 (ko) * 2014-03-18 2020-06-11 (주)테크윙 반도체소자 테스트용 핸들러
JP6423440B2 (ja) * 2014-09-12 2018-11-14 株式会社Ｆｕｊｉ 対基板作業装置及び対基板作業システム
CN105704998B (zh) * 2014-11-27 2019-02-22 英业达科技有限公司 取件置放方法
US10902161B2 (en) * 2015-03-06 2021-01-26 Fuji Corporation Method for optimizing component type arrangement and apparatus for optimizing component type arrangement
CN110582193B (zh) * 2015-03-26 2021-06-11 株式会社富士 元件安装线的最优化装置及元件安装线的最优化方法
WO2017042898A1 (ja) * 2015-09-08 2017-03-16 富士機械製造株式会社 テープフィーダ
JP6875512B2 (ja) * 2017-05-18 2021-05-26 株式会社Ｆｕｊｉ 部品供給装置
JP2019075466A (ja) * 2017-10-16 2019-05-16 パナソニックＩｐマネジメント株式会社 製造作業装置
WO2019087392A1 (ja) * 2017-11-06 2019-05-09 株式会社Ｆｕｊｉ 部品実装ライン
KR102233946B1 (ko) * 2018-12-19 2021-03-30 한국원자력의학원 단일 혈액백 x선 조사기
DE102019125978B3 (de) * 2019-09-26 2020-12-17 Ersa Gmbh Bestückungssystem zur Bestückung von Leiterplatten mit elektronischen Bauteilen, Löt- und Pressanlage
DE112021008441T5 (de) * 2021-11-10 2024-08-22 Fuji Corporation Bauteilmontagemaschine und Bauteilmontagesystem
CN114161108B (zh) * 2021-12-03 2023-04-25 深圳国人科技股份有限公司 一种自动装阵子装置和方法
CN119421340A (zh) * 2024-12-24 2025-02-11 安徽富创通科技有限公司 一种大尺寸核心板的贴装方法

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WO1999025168A1 (en) * 1997-11-10 1999-05-20 Matsushita Electric Industrial Co., Ltd. Part mounting apparatus and part supply apparatus

Also Published As

Publication number Publication date
DE69835697T2 (de) 2007-03-29
EP1771059A3 (de) 2007-04-11
EP1054584B1 (de) 2006-08-23
CN1151708C (zh) 2004-05-26
US6594887B1 (en) 2003-07-22
EP1054584A4 (de) 2002-06-26
WO1999025168A1 (en) 1999-05-20
CN1279000A (zh) 2001-01-03
EP1771059A2 (de) 2007-04-04
EP1054584A1 (de) 2000-11-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)