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DE69832104D1 - Verbindung durch Aufbringen eines dem Relief entsprechenden viskosen Produktes - Google Patents

Verbindung durch Aufbringen eines dem Relief entsprechenden viskosen Produktes

Info

Publication number
DE69832104D1
DE69832104D1 DE69832104T DE69832104T DE69832104D1 DE 69832104 D1 DE69832104 D1 DE 69832104D1 DE 69832104 T DE69832104 T DE 69832104T DE 69832104 T DE69832104 T DE 69832104T DE 69832104 D1 DE69832104 D1 DE 69832104D1
Authority
DE
Germany
Prior art keywords
relief
applying
connection
product corresponding
viscous product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69832104T
Other languages
English (en)
Other versions
DE69832104T2 (de
Inventor
Philippe Patrice
Michael Zafrany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SA filed Critical Gemplus SA
Application granted granted Critical
Publication of DE69832104D1 publication Critical patent/DE69832104D1/de
Publication of DE69832104T2 publication Critical patent/DE69832104T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H10W70/093—
    • H10W70/699—
    • H10W70/60—
    • H10W70/6523—
    • H10W70/654—
    • H10W72/07131—
    • H10W72/50—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/865—
    • H10W72/874—
    • H10W72/884—
    • H10W74/00—
    • H10W90/00—
    • H10W90/22—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69832104T 1997-03-27 1998-03-09 Verbindung durch Aufbringen eines dem Relief entsprechenden viskosen Produktes Expired - Lifetime DE69832104T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9704094 1997-03-27
FR9704094A FR2761498B1 (fr) 1997-03-27 1997-03-27 Module electronique et son procede de fabrication et carte a puce comportant un tel module

Publications (2)

Publication Number Publication Date
DE69832104D1 true DE69832104D1 (de) 2005-12-01
DE69832104T2 DE69832104T2 (de) 2006-11-23

Family

ID=9505498

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69832104T Expired - Lifetime DE69832104T2 (de) 1997-03-27 1998-03-09 Verbindung durch Aufbringen eines dem Relief entsprechenden viskosen Produktes

Country Status (11)

Country Link
US (2) US6435414B1 (de)
EP (2) EP1168240B1 (de)
JP (1) JP3869860B2 (de)
CN (1) CN1183486C (de)
AU (1) AU720691B2 (de)
BR (1) BR9808062A (de)
CA (1) CA2283692A1 (de)
DE (1) DE69832104T2 (de)
FR (1) FR2761498B1 (de)
RU (1) RU2200975C2 (de)
WO (1) WO1998044451A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2761498B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Module electronique et son procede de fabrication et carte a puce comportant un tel module
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
FR2797075B1 (fr) * 1999-07-26 2001-10-12 Gemplus Card Int Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard
FR2797995B1 (fr) * 1999-08-25 2002-03-22 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2797996B1 (fr) * 1999-08-25 2003-10-03 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2799306B1 (fr) * 1999-10-04 2003-09-19 Gemplus Card Int Procede d'isolation de puce de circuit integre par depot de matiere sur la face active
FR2800198B1 (fr) * 1999-10-26 2002-03-29 Gemplus Card Int Procede de protection de puces de circuit integre par aspiration sous vide
FR2808920B1 (fr) * 2000-05-10 2003-10-03 Gemplus Card Int Procede de protection de puces de circuit integre
FR2818800B1 (fr) * 2000-12-21 2003-04-04 Gemplus Card Int Interconnexion par organe deformable pour dispositif electronique
FR2818801B1 (fr) * 2000-12-21 2003-04-04 Gemplus Card Int Interconnexion par organe d'isolation decoupe et cordon de conduction
FR2823011B1 (fr) * 2001-03-30 2004-11-19 Gemplus Card Int Connexion par depot de cordon conductrice sur zone de raccordement delimitee par masque isolant
FR2845805B1 (fr) * 2002-10-10 2005-06-03 Gemplus Card Int Adhesif d'encartage formant navette
PA8584401A1 (es) * 2002-10-11 2005-02-04 Nagraid Sa Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo
FR2847365B1 (fr) * 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
WO2007042071A1 (de) * 2005-10-10 2007-04-19 Alphasem Ag Baugruppe mit wenigstens zwei in elektrisch leitender wirkverbindung stehenden komponenten und verfahren zum herstellen der baugruppe
DE102006056361B4 (de) * 2006-11-29 2012-08-16 Infineon Technologies Ag Modul mit polymerhaltigem elektrischen Verbindungselement und Verfahren
DE102008019571A1 (de) * 2008-04-18 2009-10-22 Giesecke & Devrient Gmbh Chipkarte und Verfahren zu deren Herstellung
RU2438209C1 (ru) * 2010-10-14 2011-12-27 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Электронный модуль
TWM425346U (en) * 2011-05-20 2012-03-21 Mxtran Inc Integrated circuit film for smart card and mobile communication device
US8991711B2 (en) * 2012-07-19 2015-03-31 Infineon Technologies Ag Chip card module
MY184608A (en) * 2013-12-10 2021-04-07 Carsem M Sdn Bhd Pre-molded integrated circuit packages
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
RU2076394C1 (ru) * 1991-06-26 1997-03-27 Минский радиотехнический институт Электропроводящая клеевая композиция для монтажа кристаллов интегральных микросхем
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
DE9315652U1 (de) * 1993-10-15 1993-12-23 Nordson Corp., Westlake, Ohio Auftragskopf zum Aufbringen von Klebstoff auf ein Substrat, insbesondere für eine Verklebung eines Chips mit einer Karte
RU2047932C1 (ru) * 1993-10-21 1995-11-10 Тукмачев Владимир Алексеевич Способ изготовления полупроводниковых приборов
US5423889A (en) * 1994-06-24 1995-06-13 Harris Corporation Process for manufacturing a multi-port adhesive dispensing tool
JPH0839974A (ja) * 1994-07-27 1996-02-13 Dainippon Printing Co Ltd Ｉｃカード用ｉｃモジュールとその製造方法、及びｉｃカード
DE4441052A1 (de) * 1994-11-18 1996-05-23 Orga Kartensysteme Gmbh Trägerelement für einen IC-Baustein zum Einsatz in Chipkarten
EP1335422B1 (de) * 1995-03-24 2013-01-16 Shinko Electric Industries Co., Ltd. Herstellungsverfahren für Halbleitervorrichtung mit Chipabmessungen
JPH08310172A (ja) * 1995-05-23 1996-11-26 Hitachi Ltd 半導体装置
FR2761498B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Module electronique et son procede de fabrication et carte a puce comportant un tel module
US6107109A (en) * 1997-12-18 2000-08-22 Micron Technology, Inc. Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

Also Published As

Publication number Publication date
JP2002511188A (ja) 2002-04-09
BR9808062A (pt) 2000-03-08
AU720691B2 (en) 2000-06-08
FR2761498B1 (fr) 1999-06-18
RU2200975C2 (ru) 2003-03-20
CN1183486C (zh) 2005-01-05
US20020125329A1 (en) 2002-09-12
CA2283692A1 (fr) 1998-10-08
EP1168240A2 (de) 2002-01-02
DE69832104T2 (de) 2006-11-23
US6769619B2 (en) 2004-08-03
HK1028833A1 (en) 2001-03-02
EP0970437A1 (de) 2000-01-12
EP1168240A3 (de) 2002-01-30
WO1998044451A1 (fr) 1998-10-08
US6435414B1 (en) 2002-08-20
FR2761498A1 (fr) 1998-10-02
AU6922598A (en) 1998-10-22
CN1257599A (zh) 2000-06-21
EP1168240B1 (de) 2005-10-26
JP3869860B2 (ja) 2007-01-17

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition