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DE69629704D1 - Verfahren und vorrichtung zum zerbrechen von sprödem material - Google Patents

Verfahren und vorrichtung zum zerbrechen von sprödem material

Info

Publication number
DE69629704D1
DE69629704D1 DE69629704T DE69629704T DE69629704D1 DE 69629704 D1 DE69629704 D1 DE 69629704D1 DE 69629704 T DE69629704 T DE 69629704T DE 69629704 T DE69629704 T DE 69629704T DE 69629704 D1 DE69629704 D1 DE 69629704D1
Authority
DE
Germany
Prior art keywords
brittle material
breaking brittle
breaking
brittle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69629704T
Other languages
English (en)
Other versions
DE69629704T2 (de
Inventor
A Ariglio
Harry Menegus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of DE69629704D1 publication Critical patent/DE69629704D1/de
Application granted granted Critical
Publication of DE69629704T2 publication Critical patent/DE69629704T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/329—Plural breakers

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
DE69629704T 1995-08-31 1996-06-20 Verfahren und vorrichtung zum zerbrechen von sprödem material Expired - Fee Related DE69629704T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US52161695A 1995-08-31 1995-08-31
US521616 1995-08-31
PCT/US1996/010674 WO1997007927A1 (en) 1995-08-31 1996-06-20 Method and apparatus for breaking brittle materials

Publications (2)

Publication Number Publication Date
DE69629704D1 true DE69629704D1 (de) 2003-10-02
DE69629704T2 DE69629704T2 (de) 2004-07-08

Family

ID=24077433

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69629704T Expired - Fee Related DE69629704T2 (de) 1995-08-31 1996-06-20 Verfahren und vorrichtung zum zerbrechen von sprödem material

Country Status (7)

Country Link
US (1) US5826772A (de)
EP (1) EP0847317B1 (de)
JP (1) JP3923526B2 (de)
KR (1) KR100447786B1 (de)
DE (1) DE69629704T2 (de)
TW (1) TW458861B (de)
WO (1) WO1997007927A1 (de)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP4396953B2 (ja) * 1998-08-26 2010-01-13 三星電子株式会社 レーザ切断装置および切断方法
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
KR100626983B1 (ko) * 1999-06-18 2006-09-22 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저를 이용한 스크라이브 방법
US6363599B1 (en) 1999-08-04 2002-04-02 Komag, Inc. Method for manufacturing a magnetic disk including a glass substrate
US6718612B2 (en) * 1999-08-04 2004-04-13 Asahi Glass Company, Ltd. Method for manufacturing a magnetic disk comprising a glass substrate using a protective layer over a glass workpiece
US6664503B1 (en) 1999-09-07 2003-12-16 Asahi Glass Company, Ltd. Method for manufacturing a magnetic disk
US6795274B1 (en) 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
KR100603210B1 (ko) * 1999-10-25 2006-07-20 삼성전자주식회사 유리 기판 절단용 레이저 커팅 장치 및 이를 이용한 유리 기판 절단 방법
AU1227501A (en) * 1999-11-01 2001-05-14 P.T.G. Precision Technology Center Llc Laser driven glass cut-initiation
WO2001034529A1 (en) * 1999-11-12 2001-05-17 P.T.G. Precision Technology Center Limited Llc Laser glass cutting with super cooled gas chill
US6501047B1 (en) * 1999-11-19 2002-12-31 Seagate Technology Llc Laser-scribing brittle substrates
KR100623970B1 (ko) * 1999-11-22 2006-09-13 삼성전자주식회사 레이저 커팅 설비 및 이를 이용한 커팅 방법
ES2304987T3 (es) * 1999-11-24 2008-11-01 Applied Photonics, Inc. Metodo y aparato para separar materiales no metalicos.
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
US6962279B1 (en) * 2000-10-18 2005-11-08 Ge Medical Systems Global Technology Company, Llc Apparatus and method for glass separation for flat panel displays
US20030051353A1 (en) * 2001-02-13 2003-03-20 Andreas Gartner Formation of a disk from a fracturable material
US6483074B2 (en) * 2001-03-07 2002-11-19 International Business Machines Corporation Laser beam system for micro via formation
RU2206525C2 (ru) * 2001-07-25 2003-06-20 Кондратенко Владимир Степанович Способ резки хрупких неметаллических материалов
TW515781B (en) * 2001-07-27 2003-01-01 Hannstar Display Corp Method for dividing fragile material and laminated glass
DE10206920A1 (de) * 2002-02-19 2003-08-21 Hegla Fahrzeug Und Maschb Gmbh Verfahren zum Trennen von Glas und Vorrichtung zum Durchführen des Verfahrens
CN100485902C (zh) 2002-03-12 2009-05-06 浜松光子学株式会社 基板的分割方法
EP1498216B1 (de) 2002-03-12 2010-12-29 Hamamatsu Photonics K.K. Verfahren zum schneiden eines bearbeiteten objekts
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI277477B (en) * 2002-03-12 2007-04-01 Mitsuboshi Diamond Ind Co Ltd Method and system for machining fragile material
JP4032857B2 (ja) * 2002-07-24 2008-01-16 ソニー株式会社 タッチパネル用のガラス基板、タッチパネル及び携帯端末
US20040089128A1 (en) * 2002-08-07 2004-05-13 Watson Charles Lee Glass score line "running" and "breaking" device
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
ATE329886T1 (de) * 2003-02-27 2006-07-15 Tecnopat Ag Verfahren und vorrichtung zum teilen von glastafeln
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
US8685838B2 (en) 2003-03-12 2014-04-01 Hamamatsu Photonics K.K. Laser beam machining method
JP2004343008A (ja) * 2003-05-19 2004-12-02 Disco Abrasive Syst Ltd レーザ光線を利用した被加工物分割方法
JP2005019667A (ja) * 2003-06-26 2005-01-20 Disco Abrasive Syst Ltd レーザ光線を利用した半導体ウエーハの分割方法
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
EP2269765B1 (de) * 2003-07-18 2014-10-15 Hamamatsu Photonics K.K. Geschnittener Halbleiterchip
JP4563097B2 (ja) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2005129851A (ja) * 2003-10-27 2005-05-19 Disco Abrasive Syst Ltd レーザ光線を利用した加工方法
JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
JP2008503355A (ja) * 2004-06-21 2008-02-07 アプライド フォトニクス，インク． 基板材料の切断、分断または分割装置、システムおよび方法
US20060042314A1 (en) * 2004-08-27 2006-03-02 Abbott John S Iii Noncontact glass sheet stabilization device used in fusion forming of a glass sheet
EP1806202B1 (de) * 2004-10-25 2011-08-17 Mitsuboshi Diamond Industrial Co., Ltd. Verfahren und vorrichtung zur bildung von rissen
US20080305615A1 (en) * 2004-12-28 2008-12-11 Mitsuboshi Diamond Industrial Co., Ltd. Method of Scribing and Breaking Substrate Made of a Brittle Material and System for Scribing and Breaking Substrate
US20060261118A1 (en) * 2005-05-17 2006-11-23 Cox Judy K Method and apparatus for separating a pane of brittle material from a moving ribbon of the material
US20060280920A1 (en) * 2005-06-10 2006-12-14 Abbott John S Iii Selective contact with a continuously moving ribbon of brittle material to dampen or reduce propagation or migration of vibrations along the ribbon
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7626138B2 (en) * 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
KR101081613B1 (ko) * 2005-09-13 2011-11-09 가부시키가이샤 레미 취성재료의 할단방법 및 장치
WO2007037118A1 (ja) * 2005-09-28 2007-04-05 Shibaura Mechatronics Corporation 脆性材料のレーザ割断装置、レーザ割断システム及びその方法
DE102005062230A1 (de) 2005-12-21 2007-06-28 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen von Scheiben aus sprödem Material, insbesondere von Wafern
TWI298280B (en) * 2006-09-06 2008-07-01 Nat Applied Res Laboratories Method for cutting non-metal material
US7971012B2 (en) * 2007-05-15 2011-06-28 Pitney Bowes Inc. Mail processing computer automatic recovery system and method
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US20090085254A1 (en) * 2007-09-28 2009-04-02 Anatoli Anatolyevich Abramov Laser scoring with flat profile beam
PL2220332T3 (pl) * 2007-11-05 2017-04-28 Baker Hughes Incorporated Sposoby i urządzenia do formowania elementów skrawania posiadających ukosowaną krawędź dla narzędzi do wiercenia w ziemi
US10016876B2 (en) 2007-11-05 2018-07-10 Baker Hughes, A Ge Company, Llc Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US9346130B2 (en) 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
KR20170082649A (ko) 2009-03-20 2017-07-14 코닝 인코포레이티드 정밀 레이저 스코어링
JP2010229005A (ja) 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
US8269138B2 (en) * 2009-05-21 2012-09-18 Corning Incorporated Method for separating a sheet of brittle material
KR100966082B1 (ko) * 2009-06-16 2010-06-28 주식회사 토비스 액정 패널 절단 방법
JP5627201B2 (ja) * 2009-06-17 2014-11-19 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
JP5609870B2 (ja) * 2009-07-03 2014-10-22 旭硝子株式会社 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8171753B2 (en) 2009-11-18 2012-05-08 Corning Incorporated Method for cutting a brittle material
TWI580652B (zh) 2009-11-30 2017-05-01 康寧公司 用以在包括壓縮表面層及內部張力層之強化玻璃基板中形成相交刻劃孔口的方法
US20110127242A1 (en) * 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) * 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8887529B2 (en) 2010-10-29 2014-11-18 Corning Incorporated Method and apparatus for cutting glass ribbon
JP2015511571A (ja) 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
CN104114506B (zh) 2012-02-29 2017-05-24 伊雷克托科学工业股份有限公司 加工强化玻璃的方法和装置及藉此制造的物品
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
AT13206U1 (de) * 2012-07-17 2013-08-15 Lisec Maschb Gmbh Verfahren und Anordnung zum Teilen von Flachglas
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US9919381B2 (en) 2013-01-30 2018-03-20 Corning Incorporated Apparatus and methods for continuous laser cutting of flexible glass
CN103252587A (zh) * 2013-04-27 2013-08-21 北京工业大学 玻璃表面盲孔加工方法
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
CN104280922B (zh) * 2014-10-27 2017-05-03 京东方科技集团股份有限公司 一种液晶屏玻璃切割方法和装置
CN107000254B (zh) * 2015-02-03 2019-09-24 中央硝子株式会社 平板玻璃的切割方法、平板玻璃的切割装置、切割平板玻璃的制造方法以及切割平板玻璃
US11420894B2 (en) * 2015-04-24 2022-08-23 Nanoplus Ltd. Brittle object cutting apparatus and cutting method thereof
US9931714B2 (en) 2015-09-11 2018-04-03 Baker Hughes, A Ge Company, Llc Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams
US10549519B2 (en) * 2017-01-12 2020-02-04 Caterpillar Inc. Systems and methods for calibrating additive manufacturing operations based on energy density
WO2021011225A1 (en) 2019-07-18 2021-01-21 Corning Incorporated Methods for separating transparent articles from a transparent mother sheet using an open ended pressure assembly
DE102020105898A1 (de) * 2020-03-05 2021-09-09 Schott Ag Verfahren zum Bearbeiten eines sprödharten Werkstoffes, insbesondere von Gläsern mittels Laserquellen, die IR-Strahlung im Wellenlängenbereich von 2 µm bis 5 µm emittieren
US12168281B2 (en) 2022-01-11 2024-12-17 Baker Hughes Oilfield Operations Llc Polycrystalline diamond compact cutting elements, methods of forming same and earth-boring tools

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
GB1246481A (en) * 1968-03-29 1971-09-15 Pilkington Brothers Ltd Improvements in or relating to the cutting of glass
US3610871A (en) * 1970-02-19 1971-10-05 Western Electric Co Initiation of a controlled fracture
US3695497A (en) * 1970-08-26 1972-10-03 Ppg Industries Inc Method of severing glass
US3790362A (en) * 1970-09-15 1974-02-05 Ppg Industries Inc Directional control for thermal severing of glass
US3795502A (en) * 1972-05-26 1974-03-05 Ppg Industries Inc Method of cutting glass
AT342232B (de) * 1972-10-12 1978-03-28 Glaverbel Verfahren und vorrichtung zum trennen eines korpers aus einem glasartigen oder vitrokristallinen material
US4467168A (en) * 1981-04-01 1984-08-21 Creative Glassworks International Method of cutting glass with a laser and an article made therewith
DE3230554C2 (de) * 1982-04-28 1984-07-26 GTI Glastechnische Industrie Peter Lisec, GmbH, Amstetten Verfahren und Vorrichtung zum Schneiden von Verbundglas
US4558622A (en) * 1983-11-04 1985-12-17 Russell Tausheck Apparatus for cutting laminated glass
JPS6469534A (en) * 1987-09-10 1989-03-15 Kazuo Sato Method for cutting workpiece, such as glass
EP0397236B1 (de) * 1989-05-08 1994-10-05 Koninklijke Philips Electronics N.V. Verfahren zum Spalten einer Platte aus sprödem Werkstoff
DE69008927T2 (de) * 1989-05-08 1994-12-01 Philips Nv Verfahren zum Spalten einer Platte aus sprödem Werkstoff.
JP2712723B2 (ja) * 1990-03-07 1998-02-16 松下電器産業株式会社 レーザ切断方法
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5303861A (en) * 1992-09-01 1994-04-19 Corning Incorporated Separating sheet glass
US5622540A (en) * 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet

Also Published As

Publication number Publication date
EP0847317A4 (de) 2000-11-15
EP0847317B1 (de) 2003-08-27
DE69629704T2 (de) 2004-07-08
TW458861B (en) 2001-10-11
JPH11511385A (ja) 1999-10-05
WO1997007927A1 (en) 1997-03-06
KR19990044290A (ko) 1999-06-25
US5826772A (en) 1998-10-27
EP0847317A1 (de) 1998-06-17
KR100447786B1 (ko) 2004-11-06
JP3923526B2 (ja) 2007-06-06

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