DE69627954D1 - Herstellungsverfahren von Luftbrücker - Google Patents

Herstellungsverfahren von Luftbrücker

Info

Publication number: DE69627954D1
Authority: DE; Germany
Prior art keywords: manufacturing process; air bridges; bridges; air; manufacturing
Prior art date: 1995-10-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69627954T

Other languages

English (en)

Other versions

DE69627954T2 (de

Inventor

Mark Jon Loboda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Dow Silicones Corp

Original Assignee

Dow Corning Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-10-23

Filing date

1996-10-16

Publication date

2003-06-12

1996-10-16 Application filed by Dow Corning Corp filed Critical Dow Corning Corp

2003-06-12 Publication of DE69627954D1 publication Critical patent/DE69627954D1/de

2004-02-19 Application granted granted Critical

2004-02-19 Publication of DE69627954T2 publication Critical patent/DE69627954T2/de

2016-10-17 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10P14/60—
- H10W20/48—
- H10W20/072—
- H10W20/46—
- H10W20/483—
- H10W70/65—

DE69627954T 1995-10-23 1996-10-16 Herstellungsverfahren von Luftbrücker Expired - Fee Related DE69627954T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US54707495A	1995-10-23	1995-10-23
US547074		1995-10-23

Publications (2)

Publication Number	Publication Date
DE69627954D1 true DE69627954D1 (de)	2003-06-12
DE69627954T2 DE69627954T2 (de)	2004-02-19

Family

ID=24183250

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69627954T Expired - Fee Related DE69627954T2 (de)	1995-10-23	1996-10-16	Herstellungsverfahren von Luftbrücker

Country Status (6)

Country	Link
US (1)	US6268262B1 (de)
EP (1)	EP0771026B1 (de)
JP (1)	JPH09172066A (de)
KR (1)	KR100415338B1 (de)
DE (1)	DE69627954T2 (de)
TW (1)	TW308719B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6294455B1 (en) *	1997-08-20	2001-09-25	Micron Technology, Inc.	Conductive lines, coaxial lines, integrated circuitry, and methods of forming conductive lines, coaxial lines, and integrated circuitry
US6670719B2 (en)	1999-08-25	2003-12-30	Micron Technology, Inc.	Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture
US6709968B1 (en)	2000-08-16	2004-03-23	Micron Technology, Inc.	Microelectronic device with package with conductive elements and associated method of manufacture
US6875687B1 (en)	1999-10-18	2005-04-05	Applied Materials, Inc.	Capping layer for extreme low dielectric constant films
EP1094506A3 (de) *	1999-10-18	2004-03-03	Applied Materials, Inc.	Schutzschicht für Filme mit besonders kleiner Dielektrizitätskonstante
DE19957302C2 (de) *	1999-11-29	2001-11-15	Infineon Technologies Ag	Substrat mit mindestens zwei darauf angeordneten Metallstrukturen und Verfahren zu dessen Herstellung
WO2001069672A1 (en) *	2000-03-13	2001-09-20	Koninklijke Philips Electronics N.V.	A method of manufacturing a semiconductor device
US6798064B1 (en) *	2000-07-12	2004-09-28	Motorola, Inc.	Electronic component and method of manufacture
US6413852B1 (en) *	2000-08-31	2002-07-02	International Business Machines Corporation	Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
US6449839B1 (en) *	2000-09-06	2002-09-17	Visteon Global Tech., Inc.	Electrical circuit board and a method for making the same
TW535253B (en) *	2000-09-08	2003-06-01	Applied Materials Inc	Plasma treatment of silicon carbide films
DE10109778A1 (de) *	2001-03-01	2002-09-19	Infineon Technologies Ag	Hohlraumstruktur und Verfahren zum Herstellen einer Hohlraumstruktur
DE10142201C2 (de) *	2001-08-29	2003-10-16	Infineon Technologies Ag	Verfahren zur Erzeugung von Hohlräumen mit Submikrometer-Strukturen in einer Halbleitereinrichtung mittels einer gefrierenden Prozessflüssigkeit
JP3793143B2 (ja) *	2002-11-28	2006-07-05	株式会社シマノ	自転車用電子制御装置
ATE358330T1 (de) *	2003-12-10	2007-04-15	Freescale Semiconductor Inc	Verfahren um ein element herzustellen welches einen von magnetischem material umgebenen elektrischen leiter enthält
US7262586B1 (en)	2005-03-31	2007-08-28	Cypress Semiconductor Corporation	Shunt type voltage regulator
JP5072417B2 (ja) *	2007-04-23	2012-11-14	株式会社東芝	半導体装置およびその製造方法
US7964442B2 (en) *	2007-10-09	2011-06-21	Applied Materials, Inc.	Methods to obtain low k dielectric barrier with superior etch resistivity
JP2013089859A (ja) *	2011-10-20	2013-05-13	Toshiba Corp	半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4756977A (en)	1986-12-03	1988-07-12	Dow Corning Corporation	Multilayer ceramics from hydrogen silsesquioxane
JP2703773B2 (ja) *	1988-04-14	1998-01-26	シャープ株式会社	半導体装置の製造方法
US5354695A (en) *	1992-04-08	1994-10-11	Leedy Glenn J	Membrane dielectric isolation IC fabrication
JPH02177550A (ja) *	1988-12-28	1990-07-10	Toshiba Corp	半導体装置およびその製造方法
JP2856778B2 (ja) *	1989-09-07	1999-02-10	株式会社東芝	半導体装置の配線構造
JPH04268750A (ja) *	1991-02-25	1992-09-24	Toshiba Corp	半導体集積回路
US5374792A (en) *	1993-01-04	1994-12-20	General Electric Company	Micromechanical moving structures including multiple contact switching system
US5353498A (en) *	1993-02-08	1994-10-11	General Electric Company	Method for fabricating an integrated circuit module
US5324683A (en)	1993-06-02	1994-06-28	Motorola, Inc.	Method of forming a semiconductor structure having an air region
US5461003A (en) *	1994-05-27	1995-10-24	Texas Instruments Incorporated	Multilevel interconnect structure with air gaps formed between metal leads
US5674758A (en) *	1995-06-06	1997-10-07	Regents Of The University Of California	Silicon on insulator achieved using electrochemical etching
EP0895090B1 (de) *	1997-07-31	2003-12-10	STMicroelectronics S.r.l.	Verfahren zum Herstellen hochempfindlicher integrierter Beschleunigungs- und Gyroskopsensoren und Sensoren, die derartig hergestellt werden

1996
- 1996-10-11 TW TW085112418A patent/TW308719B/zh active
- 1996-10-16 EP EP96307505A patent/EP0771026B1/de not_active Expired - Lifetime
- 1996-10-16 DE DE69627954T patent/DE69627954T2/de not_active Expired - Fee Related
- 1996-10-21 JP JP8277686A patent/JPH09172066A/ja active Pending
- 1996-10-23 KR KR1019960047594A patent/KR100415338B1/ko not_active Expired - Fee Related
1997
- 1997-08-11 US US08/999,951 patent/US6268262B1/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
EP0771026B1 (de)	2003-05-07
KR970023839A (ko)	1997-05-30
EP0771026A2 (de)	1997-05-02
JPH09172066A (ja)	1997-06-30
KR100415338B1 (ko)	2004-04-13
TW308719B (de)	1997-06-21
US6268262B1 (en)	2001-07-31
DE69627954T2 (de)	2004-02-19
EP0771026A3 (de)	1998-06-10

Publication	Publication Date	Title
DE69627954D1 (de)	2003-06-12	Herstellungsverfahren von Luftbrücker
DE69601673D1 (de)	1999-04-15	Herstellungsverfahren von Packungen
DE69433361D1 (de)	2004-01-08	Herstellungsmethode von selbstmontierenden Mikrostrukturen
DE69427676D1 (de)	2001-08-16	Herstellungsverfahren von Elektroden
DE69627895D1 (de)	2003-06-05	Herstellungsverfahren von mikroprismenmatrixen
ATE218279T1 (de)	2002-06-15	Formen von schokoladen
DE69514950D1 (de)	2000-03-16	Herstellung von imitierten Kunstwerken
DE69634667D1 (de)	2005-06-02	Boule-oscillationsmustern für die herstellung von geschmolzenem quarzglas
KR970002404A (ko)	1997-01-24	광 전도체의 제조방법
DE59606486D1 (de)	2001-04-05	Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden
DE69605950D1 (de)	2000-02-10	Herstellungsverfahren einer Anzeige
DE69804513D1 (de)	2002-05-02	Herstellung von zeolith-l
DE69624959D1 (de)	2003-01-09	Herstellung von Pentafluorphenylverbindungen
DE69502426D1 (de)	1998-06-18	Herstellungsverfahren von Tonerzusammensetzungen
DE69626462T2 (de)	2004-01-15	Herstellung von Gas
DE59602691D1 (de)	1999-09-16	Herstellung von primären Guerbetaminen
DE69528286D1 (de)	2002-10-24	Herstellung von nudeln
DE69502001D1 (de)	1998-05-14	Herstellung von uranoxid
DE69623986D1 (de)	2002-10-31	Herstellung von Allomelanin
DE69502395D1 (de)	1998-06-10	Herstellung von triarylboran
ID19540A (id)	1998-07-23	Metode pembuatan turunan-turunan benzofenon
DE69520374D1 (de)	2001-04-19	Formen von Strukturelementen
DK75393D0 (da)	1993-06-24	Production of protein
DE69605708D1 (de)	2000-01-27	Reinigung von Pentafluorethan
DE69613921D1 (de)	2001-08-23	Herstellung von Methylaminen

Legal Events

Date	Code	Title	Description
2004-06-03	8364	No opposition during term of opposition
2005-08-18	8339	Ceased/non-payment of the annual fee