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DE69622317D1 - Drahtsäge - Google Patents

Drahtsäge

Info

Publication number
DE69622317D1
DE69622317D1 DE69622317T DE69622317T DE69622317D1 DE 69622317 D1 DE69622317 D1 DE 69622317D1 DE 69622317 T DE69622317 T DE 69622317T DE 69622317 T DE69622317 T DE 69622317T DE 69622317 D1 DE69622317 D1 DE 69622317D1
Authority
DE
Germany
Prior art keywords
wire saw
saw
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69622317T
Other languages
English (en)
Inventor
Shozo Katamachi
Shigeru Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9700895A external-priority patent/JP3084699B2/ja
Priority claimed from JP11576495A external-priority patent/JP3211930B2/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Application granted granted Critical
Publication of DE69622317D1 publication Critical patent/DE69622317D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/08—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69622317T 1995-04-21 1996-04-19 Drahtsäge Expired - Lifetime DE69622317D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9700895A JP3084699B2 (ja) 1994-05-16 1995-04-21 ワイヤーソーのワイヤーリール取付構造
JP11576495A JP3211930B2 (ja) 1994-05-16 1995-05-15 ワイヤーソー

Publications (1)

Publication Number Publication Date
DE69622317D1 true DE69622317D1 (de) 2002-08-22

Family

ID=26438159

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69622317T Expired - Lifetime DE69622317D1 (de) 1995-04-21 1996-04-19 Drahtsäge

Country Status (4)

Country Link
US (1) US5896851A (de)
EP (1) EP0742066B1 (de)
KR (1) KR100394223B1 (de)
DE (1) DE69622317D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19717379A1 (de) * 1997-04-24 1998-10-29 Wacker Siltronic Halbleitermat Drahtsäge und Montagestation für eine Drahtführungsrolle einer Drahtsäge sowie Verfahren zum Auswechseln einer Drahtführungsrolle
JPH1110509A (ja) * 1997-06-24 1999-01-19 Nippei Toyama Corp ワイヤソーの張力付与機構
TW383249B (en) 1998-09-01 2000-03-01 Sumitomo Spec Metals Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board
US6106365A (en) * 1998-11-06 2000-08-22 Seh America, Inc. Method and apparatus to control mounting pressure of semiconductor crystals
MY126994A (en) 1999-12-14 2006-11-30 Hitachi Metals Ltd Method and apparatus for cutting a rare earth alloy
CN1228162C (zh) * 2000-11-24 2005-11-23 株式会社新王磁材 稀土合金的切断方法和稀土磁铁的制造方法
US6945242B2 (en) * 2001-10-17 2005-09-20 Neomax Co., Ltd. Cutting method using wire saw, wire saw device, and method of manufacturing rare-earth magnet
US20030170948A1 (en) * 2002-03-07 2003-09-11 Memc Electronic Materials, Inc. Method and apparatus for slicing semiconductor wafers
US20080245461A1 (en) * 2007-04-06 2008-10-09 Georgia-Pacific Gypsum Llc Cover stock cutter and splicing apparatus for wallboard manufacture and methods of using the same
CN101970193A (zh) * 2008-02-11 2011-02-09 Memc电子材料有限公司 用于将锭线锯切片成晶片中的碳纳米管加强线锯梁
EP2546014A1 (de) * 2011-07-15 2013-01-16 Meyer Burger AG Vorrichtung zum Antrieb eines Drahtes oder drahtähnlicher Objekte
US9597819B2 (en) * 2012-09-03 2017-03-21 Hitachi Metals, Ltd. Method for cutting high-hardness material by multi-wire saw
CN102856439B (zh) * 2012-09-24 2015-02-25 天津英利新能源有限公司 应用于全玻太阳能电池板的剥离方法及其剥离机
CN104493982A (zh) * 2014-12-30 2015-04-08 南京铭品机械制造有限公司 一种数控丝锯加工机
CN107140470A (zh) * 2017-06-14 2017-09-08 何志达 一种电力电缆装置
CN109206009A (zh) * 2017-07-04 2019-01-15 白金光学科技（苏州）有限公司 发光二极管用荧光玻璃及其制备工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR885669A (fr) * 1942-05-04 1943-09-22 Ris Atel Procédé et dispositif pour polir le chas des aiguilles à l'aide d'un fil chargé d'abrasif
GB771622A (en) * 1954-12-08 1957-04-03 British Thomson Houston Co Ltd Improved apparatus for cutting crystal
US3841297A (en) * 1971-12-01 1974-10-15 Motorola Inc Machine for cutting brittle materials
DE3209164C2 (de) * 1982-03-13 1983-12-22 Messner, Caspar O.H., Prof.Dr.sc.techn., Zürich Drahtsäge
JPH064219B2 (ja) * 1985-02-07 1994-01-19 住友金属工業株式会社 ワイヤ式切断加工装置の溝ロ−ラ駆動方法
JP2673544B2 (ja) * 1988-06-14 1997-11-05 株式会社日平トヤマ 脆性材料の切断方法
US5099820A (en) * 1988-11-03 1992-03-31 Photec Industrie S.A. Abrasion-type splitting unit
JPH05220732A (ja) * 1992-02-17 1993-08-31 Sumitomo Metal Ind Ltd マルチワイヤソー用多溝ローラ

Also Published As

Publication number Publication date
KR100394223B1 (ko) 2003-11-28
EP0742066A2 (de) 1996-11-13
EP0742066A3 (de) 1997-04-23
US5896851A (en) 1999-04-27
EP0742066B1 (de) 2002-07-17
KR960037236A (ko) 1996-11-19

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Legal Events

Date Code Title Description
8332 No legal effect for de