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DE69600283D1 - Vorrichtung zur Montage von elektronischen Bauelementen - Google Patents

Vorrichtung zur Montage von elektronischen Bauelementen

Info

Publication number
DE69600283D1
DE69600283D1 DE69600283T DE69600283T DE69600283D1 DE 69600283 D1 DE69600283 D1 DE 69600283D1 DE 69600283 T DE69600283 T DE 69600283T DE 69600283 T DE69600283 T DE 69600283T DE 69600283 D1 DE69600283 D1 DE 69600283D1
Authority
DE
Germany
Prior art keywords
electronic components
assembling electronic
assembling
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69600283T
Other languages
English (en)
Other versions
DE69600283T2 (de
Inventor
Tsuneto Igarashi
Shigetoshi Negishi
Kunio Tanaka
Masahiro Morimoto
Kazuaki Kosaka
Yoshifumi Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69600283D1 publication Critical patent/DE69600283D1/de
Publication of DE69600283T2 publication Critical patent/DE69600283T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
DE69600283T 1995-06-14 1996-06-07 Vorrichtung zur Montage von elektronischen Bauelementen Expired - Fee Related DE69600283T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7147187A JP2708016B2 (ja) 1995-06-14 1995-06-14 電子部品自動実装装置

Publications (2)

Publication Number Publication Date
DE69600283D1 true DE69600283D1 (de) 1998-06-18
DE69600283T2 DE69600283T2 (de) 1998-10-01

Family

ID=15424540

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69600283T Expired - Fee Related DE69600283T2 (de) 1995-06-14 1996-06-07 Vorrichtung zur Montage von elektronischen Bauelementen

Country Status (4)

Country Link
US (1) US5692293A (de)
EP (1) EP0749270B1 (de)
JP (1) JP2708016B2 (de)
DE (1) DE69600283T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3132353B2 (ja) * 1995-08-24 2001-02-05 松下電器産業株式会社 チップの搭載装置および搭載方法
US5926950A (en) * 1995-12-28 1999-07-27 Fuji Machine Mfg. Co., Ltd. Electronic component transferring device and method, and electronic component mounting system and method
US6168009B1 (en) 1995-12-28 2001-01-02 Fuji Machine Mfg. Co. Ltd. Apparatus for positioning electronic component holder head and apparatus for transferring electronic component
JP3677108B2 (ja) * 1996-01-29 2005-07-27 三星テクウィン株式会社 部品搭載装置
JP3245081B2 (ja) * 1997-02-04 2002-01-07 松下電器産業株式会社 電子部品実装機
JP2002504865A (ja) * 1997-06-21 2002-02-12 ファイントール インターナツィオナール ホールディング アセンブリまたは製造ロボットおよびそのためのワークステーション
DE19857331C1 (de) * 1998-12-11 2001-01-25 Siemens Ag Kühleinrichtung für Bestückungsautomaten
JP3907876B2 (ja) 1999-08-25 2007-04-18 松下電器産業株式会社 電子部品装着装置
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
DE10344763B4 (de) * 2003-09-26 2006-09-14 Siemens Ag Bestückkopf zum Bestücken von Substraten mit elektrischen Bauelementen
EP1801046B1 (de) 2004-09-22 2010-03-31 Hallys Corporation Übertragungsvorrichtung
ATE488985T1 (de) 2004-12-03 2010-12-15 Hallys Corp Zwischenglied-bondierungseinrichtung
WO2006109678A1 (ja) 2005-04-06 2006-10-19 Hallys Corporation 電子部品の製造装置
JP7197285B2 (ja) * 2018-05-14 2022-12-27 Juki株式会社 実装装置、実装方法
JP2022090523A (ja) * 2020-12-07 2022-06-17 東急建設株式会社 ロボットハンド、ロボットアーム及び制御システム

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224279A (ja) * 1983-06-01 1984-12-17 富士機械製造株式会社 電子部品の位置決め保持方法および装置
CH664110A5 (fr) * 1985-11-08 1988-02-15 Ismeca S A Machine automatique de placement de composants sur des substrats, tete de placement pour cette machine.
JPH0777308B2 (ja) * 1987-05-28 1995-08-16 三洋電機株式会社 部品装着装置
JP2568623B2 (ja) * 1988-04-12 1997-01-08 松下電器産業株式会社 電子部品の実装方法
JPH07120873B2 (ja) * 1988-05-25 1995-12-20 松下電器産業株式会社 電子部品装着装置
JPH07109957B2 (ja) * 1988-06-21 1995-11-22 松下電器産業株式会社 電子部品装着方法
JP2593350B2 (ja) * 1989-01-05 1997-03-26 ティーディーケイ株式会社 チップ部品の自動装着機
DE3904587A1 (de) * 1989-02-16 1990-08-23 Arnold & Richter Kg Montagekopf fuer handhabungsgeraete
JP2503082B2 (ja) * 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
JP2793033B2 (ja) * 1990-10-24 1998-09-03 三洋電機株式会社 部品装着装置
JPH05304396A (ja) * 1991-07-12 1993-11-16 Canon Inc 部品の実装順序の決定方法及びその装置
JP3368923B2 (ja) * 1992-12-28 2003-01-20 松下電器産業株式会社 電子部品実装装置
JP2823481B2 (ja) * 1993-05-26 1998-11-11 三洋電機株式会社 電子部品自動装着装置
JP3313224B2 (ja) * 1994-01-25 2002-08-12 松下電器産業株式会社 電子部品実装装置
JP3469652B2 (ja) * 1994-09-26 2003-11-25 富士機械製造株式会社 電子部品装着装置

Also Published As

Publication number Publication date
DE69600283T2 (de) 1998-10-01
US5692293A (en) 1997-12-02
JPH08340196A (ja) 1996-12-24
EP0749270A1 (de) 1996-12-18
EP0749270B1 (de) 1998-05-13
JP2708016B2 (ja) 1998-02-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee