DE6610869U - CONTROLLED SEMICONDUCTOR COMPONENT - Google Patents

Description

SEMIKRON Ges. F. Rectifier construction and electronics mbH.

8500 Nuremberg, Wiesentalstraße 40 Telephone 0911/30141, 31813 - Telex 06/22155

Date: October 12, 1967 Our reference: 71K16707 G

Controllable semiconductor

Component

Due to the constant expansion of the possible uses for semis « ter components with high current carrying capacity, especially for controllable Semiconductor rectifiers, in many branches of technology, result in ever new demands for more economical manufacturers Embodiments of semiconductor rectifiers with a simple structure and an expedient configuration.

Controllable semiconductor rectifiers are known; where the made of semiconductor wafer and firmly connected to it on both sides, having approximately the same linear thermal expansion coefficient as the semiconductor material Contact plates consisting of semiconductor tablets in a plate-shaped or screw-shaped base body and from beehei ^ üroigem Upper part of the existing housing and arranged by Iiötung or by Pressure is contacted by means of spring elements with corresponding contact parts of current conductors · In the so-called pressure contacting is • 8 required, the semiconductor tablet and all for contacting to arrange serving components gas-tight in the semiconductor housing.

Disc-shaped controllable semiconductor rectifiers are also used known, in which the semiconductor tablet for pressure contact is gas-tight in one of noble metal foils and an insulating body Sheath formed is included.

These known semiconductor arrangements require numerous Yerverfahren steps with considerable technical and technical aspects for production economic outlay «Furthermore, the embodiments limit

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the housing mostly the possible uses of the semiconductor arrangements »

Las controllable semiconductor component according to the invention does not have the disadvantages inherent in the known arrangements in the v / es ent borrowed on. It also shows a simple and economical structure for an optional arrangement in conventional housing shapes or for installation between plate-shaped cooling elements »

The invention relates to a semiconductor component, in particular one controllable semiconductor rectifier for high current carrying capacityj, one on both sides with square plates, their linear thermal expansion coefficient uer-jenigesi of the semiconductor material »corresponds, firmly connected Semiconductor disk in a disk-shaped metallic component and housing formed from an annular insulating body is arranged in a gas-tight manner and consists in that the contact plates on their side facing away from the semiconductor wafer, formations on = show that both an advantageous planar connection with building components as well as the assembly with and the guidance of adjoining contact parts resting under pressure and an arrangement of the semiconductor component in the desired polarity ensure that the central plane area of the semiconductor wafer facing away surface of the contact plates for favorable contact with other contact parts by pressure by means of a spring body with a ductile metallic coating is provided that the part of the semiconductor housing forming an annular insulating material body at least a metallized through hole penetrating it for implementation has a current conductor part for the control electrode, and that the insulating body on its outer circumferential surface Einsn ring conductor for Position-independent contacting on the outside of the housing of the current conductor part running between the control electrode and the insulating material body wearing.

Based on the representations in FIGS. 1 to 5, structure and we = as well as installation options for the subject matter of the invention shown and explained * FIG. 1 shows an exemplary embodiment in section for a controllable semiconductor component according to FIG

SEMIKSON I

Society for sliding construction and electronics mbHo sheet 3 1

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Invention _o In Figure 2, another embodiment J for the housing structure is aarges in section _o Figures 3 and 4 represent in jf section and in plan view an advantageous design and arrangement! dvjr control electrode supply line. FIG. 5 shows the arrangement of the controllable semiconductor component according to the invention in a conventional housing. The same designations are chosen for the same cables in all figures,

In Figure 1, the in known T.'eise _f by diffusion do = formatted Haibleitsrscheibe 1 on a hoehohmigen Basisschieht a t beispislsweise kreissegnentfcrmige control electrode 1a "It can also !, two ODSR Steccrelektroden more identical or different £ shaping and / or area extension * The half · = f.

tersraoibe 1 is with its non-subdivided contact electrode - with a no pnp layer sequence having structure with the anode - firmly applied to an electrode plate 2 _t made of a material with a thermal expansion coefficient corresponding to the semiconductor material, for example molybdenum. That power supply which, together with the control electrode, forms the further contacting surface of the semiconductor wafer 1, that is to say the cathode in the example shown, is firmly connected to an electrode plate 3 which is adapted in terms of its extension. The surface of the electrode plates 2 and 3 facing away from the semiconductor wafer 1 is in extensive contact with guide plates 4, 5. The structural unit formed from the electrode plate and the guide plate is referred to as a contact plate. Lead guide plates have, on their surface facing away from the respective electrodes, a planar attachment 4a, 5a iuf, which is used for an adapted, guided assignment of corresponding contact parts of pin conductors, and. if necessary to achieve a pressure correspondence with these contact parts, a particularly suitable, metallic, ductile contacting layer forming space, for example at least one. .- from 3inem or .Tehreron Edelrr.e {; all or from alloys with precious metal pn has ₀ The dimensions of the edges of the TMiVtrungsplPtten ι, 5 are based on the design of the control electrode and its connection and on the specified space required for the further covering of the Semiconductor wafer forming construction

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SEMIKEOS

Society for "parallel construction a" electronics nibH _o sheet 4

parts ο The guide plates 4 _S 5 are made of an electrically and thermally good conductive material _? preferably made of copper = one each. circular disk-shaped metal body 8 _? 9 *, also referred to as a locking ring, is fixed on the inner Saadsone with the outer _{palm of the guide pad 4 * 5 facing away from the semiconductor wafer and enclosing the attachment 4a f} 5a and on its outer edge zone with the end face of a ring-shaped insulating material body 10 connected, the locking rings 8.9 v / iron in their Hittelzoxie at least one arcuate design to compensate for thermal expansions in mutually adjacent. Components when using det. Semiconductor component on ο

The leadership positions 4 _? 5 _f the connection rings 8,9 and the insulating body 10 together form the housing of the semiconductor _{tablet consisting of semiconductor wafer 1 and electrode plates 2 S} 3 and are preferably connected in a gastight manner by soldering or welding 10 on predetermined surface sections each have a metal ring, which is more suitable for connection with an associated locking ring ο The insulating body 10 consists of a suitable ceramic material and is also suitable for connection with the V: connection rings 8s9 provided areas metallized

In the middle area of its A: beneath surface, the insulating material body 10 has a concentrically running, web-shaped, preferably self-contained projection 12, furthermore referred to as a contact ring disk-shaped semiconductor "construction <>". i ^^ nt Grehäusee and can any ^f! uerschni ~ t have "Hinössteni eJne _p / ur Auf'eninantelfläohe eist. Iac lic · i * s fcoi'fJK or per.? eiiien 10 any angle bi, AEE IAEE _p JcrBisringförmige I'lächc of the contact ring 12 has a konssntrischfc Ausr-parunf;?, which is cistallirrj.ert and for receiving uil b "aRFC w ^ e inun B ft; s ti gang of a ring iter serves.

Advantageously V / ^r eiea lc.i.in the insulating "of f & ürper surface in the space reserved for the arrangement of the Ringleitor.j region of its smooth, such as cylindrical Außenmant el eiriQ extending concentrically metallization -» rgegebener width and thickness of wear on

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SEMIKEOS

Gesellschaft f. Gleichriohterbau u »Electronics mbH» Sheet 5

a ring conductor made of wire or ribbon material is firmly attached, for example pulled on and soldered »

At least one by the arrangement and the look! the tax = The insulating material body has electrodes specific point on its inner circumferential surface 10 has a preferably radial through hole 10a which is metallized, and through which to achieve the control =

electrode lead of the inside the disc-shaped semiconductor

§ Component housing provided, wire or ribbon-shaped current conductor 11 ^ s leads and is soldered tight. The free end of the conductor 11 is, for example, arc-shaped and resiliently in such a way that it contacts the ausgebildetj control electrode 1a preferably under pressure "The current conductor 11, however, can also be firmly connected by soldering to the control electrode 1a _o

The through-hole "» Oa ends in the annular metallization of the Approach 12 on the outer surface of the insulating body 10 "" so that at the same time the galvanic connection between the control i electrode 1a and the outer casing surface of the semiconductor component is produced »This means that a position-independent arrangement of the aeheiln-shaped semiconductor component in a predetermined Semiconductor rectifier structure and a simple «also position-independent Contacting the control electrode with an external, arbitrarily designed current conductor is guaranteed »

The optional arrangement of a disk-shaped semiconductor component according to the invention on a base body of a conventional semiconductor housing or between plate-shaped cooling components is indicated in FIG. 1: "The base body 6 is for receiving and guiding of the attachment 4a of the semiconductor component provided with an adapted recess «For the arrangement of the invention Semiconductor component between plate-shaped cooling elements, a cooling plate 7 is suitably designed in a corresponding manner »

It goes without saying that the for the inclusion of semiconductor components According to the invention provided components different training can have «and that the guide plates 4» 5 of the semiconductor component in a corresponding manner cutouts or

SEMIERON
f Gesellschaft f * Gleiehrichterbau u _e Electronics mbH. Sheet 6

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} can have sublime training? whereby the mutual guidance of adjacent contact parts of the semiconductor component and power lines and / or cooling components is ensured in an advantageous manner »

In Figure 2, another * embodiment for the connection of insulating body and guide _{plate is shown. The ring-shaped insulating body 13 has on that end face 9} which is assigned to the undivided contact surface of the semiconductor wafer, a circular ring-shaped projection 13a adjacent to the inner circumferential surface ^ on which The component stack consisting of guide plates, slectrode plates and semiconductor wafers is placed flat with its assigned guide plate »This eliminates the locking ring 9» The mutually assigned surfaces of guide plate 4 and insulating material body section 13a are firmly connected by means of half-soldering * The insulating material body 13 consists made of a suitable ceramic material o The attachment 4a protrudes from the projection 13a of the insulating material body for the advantageous arrangement of adjacent contact components Component and adjacent contact components is possible, the guide plate can also be designed simply as a disk-shaped component without an attachment «

If necessary, the contact plates can also be designed in this way be that the correspondingly dimensioned electrode plates have an annular shape on their edge zone facing away from the semiconductor wafer Have flange, to achieve a desired connection with the locking rings 8.9 made of a suitable material consists for example of copper and after training and expansion an advantageous joining of the contact plates with adjacent ones Contact components made possible

The locking rings 8, 9 can, for example , be angled at their edge areas associated with the insulating material body 10 and with the angled edge in grooved * concentric :, running, metallized recesses in the end faces of the insulating material.

SEMICRON

Society for Crleichriohterbau u. Electronics mbH «Sheet 7 !

engage the body and be soldered = *

In Figures 3 and 4 an embodiment for the structure of the insulating body and for the design and arrangement of the single conductor for contacting the control electrode is shown provided, metallized surfaces connected by soldering to a single hollow cylinder component feat. The metalized end faces of the insulating rings 14 and 15, which are assigned to one another, each have a concentrically running recess 16. When the insulating rings 14 and 15 are closed, the two recesses 16 form a channel running concentrically within the insulating body, which is used to accommodate an annular current conductor 18 for the The control electrode is used »This conductor is firmly connected to the two insulating rings. In FIG. 4, the insulating ring 15 is shown in a top view with the current conductor 18 placed thereon clocking of the control electrode an inner section 19. The outer edge surface of the conductor 18 protrudes at a suitable extent] beyond the outer jacket surface of the insulating body and ensures a position-independent contacting of the power line connection outside the housing for the control electrode Formation of a gas-tight enclosure of the semiconductor wafer in the case of “The electrical power to be supplied to the control electrode determines the cross section? Of the conductor 18 and the extent of the recesses 16.

It goes without saying that the conductor 18 can have any cross-section and also any design at predetermined points or over the entire circumference of the insulating body. For example, punching with a design protruding radially from the outer surface of the insulating body can serve as a conductor, whereby the external contacting of the control electrode is possible in any way. The inner conductor section

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SEMICRON

Society for rectifier construction and electronics mbHe

Sheet 8

is only indicated in Figure 4 * but preferably in this way designed that the free end rests under pressure on the control electrode in the manner of a spring for contacting the control electrode,

A further development of a semiconductor component according to the invention is that the guide plates and / or the electrode plates and the insulating body to achieve a suitable Have metal rings firmly attached to the welded joint at predetermined points »If necessary, the electrode plates for a function as contact plates suitably dimensioned and designed its

The design of the insulating body is not based on the d & r frame th and described embodiments limited

FIG. 5 shows the arrangement of a semiconductor component according to the invention in a housing consisting in a conventional manner of a base body and a hood-shaped upper part Semiconductor component adapted recess 6a, which is suitably pretreated for pressure contacting if necessary given ₉ that the housing inner ₉ prepared end 22a of a preferably wire or ribbon-shaped conductor 22, which runs approximately parallel to the outer surface line of the contact component 21, independent of position and by suitable angling of the conductor under pressure on the associated concentric tween metallization or on the ring conductor of the contact ring 12 »and that the other section 22b of the current conductor between sleeve-shaped, enclosing insulating parts 23 and 24 adapted to the contact component 2 is insulated from the upper housing part 26 and contact component 21 to the outside of the housing o The insulating parts can, if necessary to manage the electricity

SEMICROBT

Gesellschaft f _a Gleiohrichterbau u, Elektronik mbH "Sheet 9

have suitable recesses for the ladder section *

It can advantageously be used as an external control electrode current conductor also serve a circular disk-shaped stamped part, which between the radial sections of the insulating parts 23 and 24 is arranged and at least one radially extending strip-shaped projection of predetermined length, which extends in one of the radial dimensions the insulating parts is angled adapted length and as a contact bracket rests under pressure on the contact ring like a leaf spring

22nd

The contacting of the external control electrode conductor and contact ring 12 can also be given in such a way "that the inner free end of the conductor is angled radially inward and, also regardless of position, engages in a concentrically running, metallized recess on the circumference of the insulating body 10." circular disc-shaped central portion of the control electrode current conductor 22 has at its inner edge _β another conductor portion to _s which extends in a stretched form between the insulating parts 2j and 24 to the outside of the housing and represents the case outer terminal of the control electrode

When constructing a semiconductor component according to the invention and as shown in FIG. 1, the connections Guide plate-electrode plate and electrode plate-semiconductor disk in a manner known per se and in procedural steps » - ^ Which do not adversely affect the semiconductor properties, idurohführungο The layer structure is specified and the arrangement is then preferably on the side of the guide plate 4 over the locking ring 9 with the insulating body 10, which is in at least a recess already the inner «, to the resilient support on the control electrode provided current conductor 11, firmly connected by soldering or welding »Bach the attachment of the control electrode connection the locking ring 8 is placed on the guide plate S and the insulating body 10 and, in a further process step, the complete inclusion of the semiconductor tablet is achieved «

HKIKBOR company for “ Gleichrlchterbau u * Elektronik mbH.

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The advantages of the subject matter of the invention lie in a simple, compact, particularly economical construction of a disc-shaped, controllable, intended for pressure contacting semiconductor component for high current carrying capacity "in the cheap Formation of the components provided for contacting for the purpose of reversibility of the semiconductor component for the desired polarity and for the purpose of versatile bin construction in different designs of aligned kits and in the arrangement resulting in a position-independent installation of the semiconductor component and radial! guidance of the control electrode connection (s),

Claims (1)

RÄ.587 512 * 13.167 SEMIKHOH See, f < > Glehriehterbau u »Electronics mbHo 8500 Nürnberg ₈ Wiesentalstraße 40! Phone 0911/30141, 31813 - Telex 06/22155 Date: October 12, 1967 Our reference: Y1K16707 G T) 6 4 * a ^ Expectations 1 ο semiconductor component, especially controllable semiconductor · = » Rectifier for high Stromlielastharkeitj with one both tig with Eontairtplatteü, the & a linear heat coefficient of those of the Semiconductor material corresponds, firmly connected semiconductor wafer in one of disc-shaped metallic components and of one ring-shaped insulating body is arranged in a gas-tight manner is characterized »that the contact plates (2 ~ 4 | 3 = 5) on their of the semiconductor wafer (1) facing away from formations (4a, 5a) have both a • advantageous areal connection with housing components as well , the assembly with and the management of adjacent contact parts that breathe under pressure and an arrangement of the semiconductor = Ensure component in the desired polarity that the central planar area of the ab = turned surface of the contact solder for favorable contact with other contact parts are provided with a ductile metallic coating by pressure using a spring body, that the ring-shaped insulating material body (10) forming part of the semiconductor housing has at least one metallized through-hole (10a) penetrating it for the passage of a current conductor part (11) for the control electrode (1a), and that the insulating body has a ring on its outer surface Conductor for the position-independent contacting of the current conductor part (11) running between the control electrode (1a) and the insulating material body (10) 2ο semiconductor device according to claim 1, characterized in that the _g extending between the control electrode (1a) and insulating material (10) current conductor member (11) is arcuate and j SEMIKEOM j Society for in-line construction u, Elektro nik mbH «, sheet 2 rests resiliently on the control electrode, 3 _β semiconductor component according to claim 1 * characterized _? that the formations provided for the arrangement and guidance of the semiconductor component (4a _s 5a) on the side of the contact plates facing away from the semiconductor wafer represent a circular planar recess and / or a circular planar attachment, and that the extent of the formations preferably corresponds to the extent of the contact surfaces of the Semiconductor wafer corresponds to «, _G Ao in semiconductor BaueleEignt according to claim 1 and 3 »characterized in that the contact plates a suitably to their intended for connection Eit housing components palm for a weld joint to obtain a gastight semiconductor package '. have formed metal ring. 5 ο semiconductor component according to claim 1 »3 and 4, characterized in that that the metallic cover layer located on the surface of the contact plates provided for pressure contacting is made up of at least a layer of one or more precious metals or of alloys with precious metals ° 6o semiconductor component according to claim 1, characterized ₉ that for the connection of contact plates and insulating material body (10) kredsringscheibeiiförraig formed, metallic connection rings (8s9) are provided, which in their free section between the connections * have flat, arched formations to compensate for thermal expansions » Τ «Semiconductor component according to claim 1, characterized in that that the insulating body forming part of the semiconductor housing (10) is designed as a hollow cylinder that its end faces are metallized, and it is attached to its outer jacket concentrically running, preferably closed, open cones «Clock ring (12) for arranging a ring conductor for contacting the Sts ^ .erelectrode (la) has » SEMICRON Gesellschaft f <, rectifier construction u _e electronics mbHo sheet 3 8. Semiconductor component according to claim 7, characterized in that § that the contact ring (12) in at least one annular preferential, self-contained portion of its surface a con-> has centrally running, metallized recess for receiving and fastening the ring conductor. 9. Semiconductor component according to claim 7, characterized in that | that the ring-1 provided for contacting the control electrode ter in one compared to the contact plates a good electrical | Insulation-ensuring distance is arranged * 1 1Oo semiconductor component according to claim 1 and / or one of the following | Claims, characterized in that the Isolierstoffkör- | per (13) on its inner circumferential surface a circular disk-shaped j if necessary, stepped training (13a) for recording! having a contact plate, | 11 ο semiconductor component according to claim 1 and / or one of the following claims, characterized in that the insulating body «» | consists of two hollow, axially assembled insulating rings (H ₉ 15), that both insulating rings are metallized on their two end faces, that the end faces intended for mutual connection have a concentrically extending, ring-shaped recess (16), and that the two metallized cutouts with closed arrangement of the insulating rings form an annular channel for receiving a correspondingly designed current conductor (18) for the control electrode « 12. Semiconductor component according to claim 1 and / or one of the following claims, characterized in that the two insulating rings (14,15) of the insulating body between their associated and suitably formed connecting surfaces one have ring-shaped metallic current conductor (18) which is firmly connected to the insulating rings by soldering and if necessary via formations protruding radially beyond the outer jacket surface ensured a desired position-independent contacting of the control electrode on the outside of the housing SBMIKROH Company f Gleichrichterbau u _o Electronics GmbH. B latt 4 13. Semiconductor component according to claim 1 and / or one of the following Claims, characterized in that the insulating material grains each have a concentrically extending, in has calibrated, groove-shaped recess into which the Versohlußringe (8,9) are inserted and soldered with their correspondingly angled edge zone, Ho semiconductor component according to Claim 1 and / or one of the following claims, characterized in that the ring conductor arranged on the outer jacket surface or inside the insulating body is wire or band-shaped and represents a loop, one end (19) of which through the through hole (1Oa) of the insulating body is routed to the control electrode _&