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DE60334542D1 - Verfahren zur lageregelung eines bauteilträgers an einer rotierenden bestückungsvorrichtung und einstellbare bestückungsvorrichtung - Google Patents

Verfahren zur lageregelung eines bauteilträgers an einer rotierenden bestückungsvorrichtung und einstellbare bestückungsvorrichtung

Info

Publication number
DE60334542D1
DE60334542D1 DE60334542T DE60334542T DE60334542D1 DE 60334542 D1 DE60334542 D1 DE 60334542D1 DE 60334542 T DE60334542 T DE 60334542T DE 60334542 T DE60334542 T DE 60334542T DE 60334542 D1 DE60334542 D1 DE 60334542D1
Authority
DE
Germany
Prior art keywords
fitting device
component
locating
rotating
adjustable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60334542T
Other languages
English (en)
Inventor
Pascal Dromard
Claudio Mathez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ismeca Semiconductor Holding SA
Original Assignee
Ismeca Semiconductor Holding SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding SA filed Critical Ismeca Semiconductor Holding SA
Application granted granted Critical
Publication of DE60334542D1 publication Critical patent/DE60334542D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automatic Assembly (AREA)
  • Specific Conveyance Elements (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
  • Tyre Moulding (AREA)
  • Discharging, Photosensitive Material Shape In Electrophotography (AREA)
DE60334542T 2002-06-14 2003-05-19 Verfahren zur lageregelung eines bauteilträgers an einer rotierenden bestückungsvorrichtung und einstellbare bestückungsvorrichtung Expired - Lifetime DE60334542D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH10142002 2002-06-14
PCT/CH2003/000321 WO2003107731A1 (fr) 2002-06-14 2003-05-19 Methode pour l'ajustement des supports d'un barillet et barillet

Publications (1)

Publication Number Publication Date
DE60334542D1 true DE60334542D1 (de) 2010-11-25

Family

ID=29721344

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60334542T Expired - Lifetime DE60334542D1 (de) 2002-06-14 2003-05-19 Verfahren zur lageregelung eines bauteilträgers an einer rotierenden bestückungsvorrichtung und einstellbare bestückungsvorrichtung

Country Status (9)

Country Link
EP (1) EP1514461B1 (de)
JP (1) JP2005529820A (de)
KR (1) KR20050033556A (de)
CN (1) CN100393189C (de)
AT (1) ATE484945T1 (de)
AU (1) AU2003223823A1 (de)
DE (1) DE60334542D1 (de)
MY (1) MY142931A (de)
WO (1) WO2003107731A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521803B2 (ja) 2010-06-10 2014-06-18 ソニー株式会社 通信装置、通信方法、及び、通信システム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62292328A (ja) * 1986-06-12 1987-12-19 Matsushita Electric Ind Co Ltd 部品装着方法
JPH0777308B2 (ja) * 1987-05-28 1995-08-16 三洋電機株式会社 部品装着装置
EP0293175A3 (de) * 1987-05-28 1990-08-22 Sanyo Electric Co., Ltd. Bauteilemontagegerät
JPH0590789A (ja) * 1991-09-26 1993-04-09 Japan Tobacco Inc ワーク実装機
JP3739218B2 (ja) * 1998-04-02 2006-01-25 松下電器産業株式会社 部品装着方法及び装置

Also Published As

Publication number Publication date
ATE484945T1 (de) 2010-10-15
EP1514461A1 (de) 2005-03-16
WO2003107731A1 (fr) 2003-12-24
CN1659948A (zh) 2005-08-24
MY142931A (en) 2011-01-31
KR20050033556A (ko) 2005-04-12
AU2003223823A1 (en) 2003-12-31
JP2005529820A (ja) 2005-10-06
CN100393189C (zh) 2008-06-04
EP1514461B1 (de) 2010-10-13

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