DE60330802D1 - Halogenfreier farbstoff enthaltende lichtempfindliche harzzusammensetzung - Google Patents

Halogenfreier farbstoff enthaltende lichtempfindliche harzzusammensetzung

Info

Publication number: DE60330802D1
Authority: DE; Germany
Prior art keywords: component; alkyl; resin composition; phenyl; halogen
Prior art date: 2002-11-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60330802T

Other languages

English (en)

Inventor

Hidetaka Oka

Jean-Marie Adam

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

BASF SE

Original Assignee

BASF SE

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-11-28

Filing date

2003-11-19

Publication date

2010-02-11

2003-11-19 Application filed by BASF SE filed Critical BASF SE

2010-02-11 Application granted granted Critical

2010-02-11 Publication of DE60330802D1 publication Critical patent/DE60330802D1/de

2023-11-20 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Spectroscopy & Molecular Physics (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Materials For Photolithography (AREA)
Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Polymerisation Methods In General (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)

DE60330802T 2002-11-28 2003-11-19 Halogenfreier farbstoff enthaltende lichtempfindliche harzzusammensetzung Expired - Lifetime DE60330802D1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
EP02406035		2002-11-28
PCT/EP2003/050849 WO2004049070A2 (en)	2002-11-28	2003-11-19	Photosensitive resin composition comprising a halogen-free colorant

Publications (1)

Publication Number	Publication Date
DE60330802D1 true DE60330802D1 (de)	2010-02-11

Family

ID=32338233

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60330802T Expired - Lifetime DE60330802D1 (de)	2002-11-28	2003-11-19	Halogenfreier farbstoff enthaltende lichtempfindliche harzzusammensetzung

Country Status (13)

Country	Link
US (1)	US8034531B2 (de)
EP (1)	EP1565789B1 (de)
JP (1)	JP4390707B2 (de)
KR (1)	KR101081756B1 (de)
CN (1)	CN100549825C (de)
AT (1)	ATE453877T1 (de)
AU (1)	AU2003298293A1 (de)
BR (1)	BR0316657A (de)
CA (1)	CA2507471A1 (de)
DE (1)	DE60330802D1 (de)
MX (1)	MXPA05005682A (de)
TW (1)	TW200421022A (de)
WO (1)	WO2004049070A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4788716B2 (ja)	2005-10-25	2011-10-05	日立化成工業株式会社	感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US7713342B2 (en) *	2006-12-19	2010-05-11	Xerox Corporation	Phase change inks
JP5291893B2 (ja) *	2007-05-08	2013-09-18	太陽ホールディングス株式会社	光硬化性樹脂組成物およびその硬化物
WO2012036477A2 (ko) *	2010-09-16	2012-03-22	주식회사 엘지화학	감광성 수지 조성물, 드라이 필름 솔더 레지스트 및 회로 기판
JP5809182B2 (ja) *	2013-03-26	2015-11-10	株式会社タムラ製作所	感光性樹脂組成物
CN108003172A (zh) *	2017-12-12	2018-05-08	深圳市华星光电技术有限公司	一种绿色光阻材料及其制备方法和应用

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* Cited by examiner, † Cited by third party
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US4039585A (en) *	1975-09-08	1977-08-02	Uop Inc.	Hydroformylation process
JPS61243869A (ja) *	1985-04-19	1986-10-30	Taiyo Ink Seizo Kk	レジストインキ組成物
US4789620A (en) *	1986-03-03	1988-12-06	Mitsubishi Rayon Co. Ltd.	Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
US5578419A (en) *	1991-12-12	1996-11-26	Mitsui Toatsu Chemicals, Incorporated	Dyes for color filters, and photosensitive resist resin composition containing the same
EP0633296B1 (de) *	1993-07-09	1999-10-13	Mitsui Chemicals, Inc.	Neue Farbstoffe und ihre Verwendung
US5691101A (en) *	1994-03-15	1997-11-25	Kabushiki Kaisha Toshiba	Photosensitive composition
DE59507879D1 (de) *	1994-09-23	2000-04-06	Ciba Sc Holding Ag	Verfahren zur Herstellung von bromierten, Alkoxy-substituierten Metall-Phthalocyaninen
US5798137A (en) *	1995-06-07	1998-08-25	Advanced Silicon Materials, Inc.	Method for silicon deposition
EP0763580B1 (de) *	1995-09-11	2003-08-13	Toyo Ink Manufacturing Co., Ltd.	Wässriges Pigmentdispergiermittel, dieses enthaltende Zusammensetzung und wässrige Pigmentdispersion
JP3653855B2 (ja)	1996-04-15	2005-06-02	三菱化学株式会社	フタロシアニン化合物及びそれを用いた光学記録媒体
CN1145678C (zh) *	1996-10-03	2004-04-14	西巴特殊化学品控股有限公司	取代的酞菁类化合物及其制备方法
JP3286905B2 (ja)	1997-08-04	2002-05-27	株式会社リコー	フタロシアニン化合物
JP4523679B2 (ja)	1998-06-22	2010-08-11	太陽インキ製造株式会社	ハロゲンフリーの着色顔料を用いたプリント配線板用緑色レジストインキ組成物
WO2000017275A1 (de) *	1998-09-21	2000-03-30	Ciba Specialty Chemicals Holding Inc.	Substituierte phthalocyanine
DE19915717A1 (de) *	1999-04-08	2000-10-12	Agfa Gevaert Ag	Aufzeichnungsmaterial mit pigmentgefärbter strahlungsempfindlicher Schicht
JP4075286B2 (ja) *	1999-06-21	2008-04-16	東洋インキ製造株式会社	ハロゲンを含有しない緑色顔料組成物
US6214433B1 (en) *	1999-10-04	2001-04-10	Dsm N.V.	Radiation-curable coatings for optical discs and optical discs incorporating such coatings
US6713230B2 (en) *	1999-10-25	2004-03-30	Nan Ya Plastics Corporation	Photosensitive ink composition
US20020077384A1 (en) *	2000-05-10	2002-06-20	Seiko Epson Corporation	Ink jet recording ink composition containing pigment coated with resin
TWI237531B (en)	2000-12-13	2005-08-01	Goo Chemical Co Ltd	Solder resist ink
US7144677B2 (en) *	2001-03-21	2006-12-05	Ricoh Company, Ltd.	Optical recording method and optical recording medium
JP4472205B2 (ja) *	2001-04-17	2010-06-02	株式会社リコー	フタロシアニン化合物
TWI227478B (en) *	2001-04-26	2005-02-01	Fuji Photo Film Co Ltd	Optical information recording medium
US6726755B2 (en) *	2002-02-08	2004-04-27	Xerox Corporation	Ink compositions containing phthalocyanines

2003
- 2003-11-19 CN CNB2003801043254A patent/CN100549825C/zh not_active Expired - Fee Related
- 2003-11-19 AT AT03796025T patent/ATE453877T1/de not_active IP Right Cessation
- 2003-11-19 BR BR0316657-0A patent/BR0316657A/pt not_active Application Discontinuation
- 2003-11-19 KR KR1020057009694A patent/KR101081756B1/ko not_active Expired - Fee Related
- 2003-11-19 MX MXPA05005682A patent/MXPA05005682A/es not_active Application Discontinuation
- 2003-11-19 CA CA002507471A patent/CA2507471A1/en not_active Abandoned
- 2003-11-19 EP EP03796025A patent/EP1565789B1/de not_active Expired - Lifetime
- 2003-11-19 DE DE60330802T patent/DE60330802D1/de not_active Expired - Lifetime
- 2003-11-19 WO PCT/EP2003/050849 patent/WO2004049070A2/en not_active Ceased
- 2003-11-19 JP JP2004554539A patent/JP4390707B2/ja not_active Expired - Fee Related
- 2003-11-19 AU AU2003298293A patent/AU2003298293A1/en not_active Abandoned
- 2003-11-19 US US10/535,373 patent/US8034531B2/en not_active Expired - Fee Related
- 2003-11-27 TW TW092133372A patent/TW200421022A/zh unknown

Also Published As

Publication number	Publication date
US8034531B2 (en)	2011-10-11
KR20050084033A (ko)	2005-08-26
AU2003298293A1 (en)	2004-06-18
JP2006508381A (ja)	2006-03-09
WO2004049070A2 (en)	2004-06-10
KR101081756B1 (ko)	2011-11-10
JP4390707B2 (ja)	2009-12-24
CN1717627A (zh)	2006-01-04
ATE453877T1 (de)	2010-01-15
BR0316657A (pt)	2005-10-18
US20050282923A1 (en)	2005-12-22
EP1565789A2 (de)	2005-08-24
CA2507471A1 (en)	2004-06-10
WO2004049070A3 (en)	2004-07-22
EP1565789B1 (de)	2009-12-30
CN100549825C (zh)	2009-10-14
TW200421022A (en)	2004-10-16
MXPA05005682A (es)	2005-07-26

Publication	Publication Date	Title
KR100890086B1 (ko)	2009-03-24	잉크젯용 경화성 수지 조성물, 그의 경화물 및 이것을사용한 인쇄 배선판
ES437825A1 (es)	1977-07-01	Un procedimiento para tratar un substrato.
CN101821299B (zh)	2012-10-10	感光性接枝聚合物以及含有该接枝聚合物的感光性树脂组合物
TW200834234A (en)	2008-08-16	Radiation-sensitive resin compositions
TWI266147B (en)	2006-11-11	Novel photosensitive resin compositions
US5506321A (en)	1996-04-09	Photosolder resist composition
KR930006035A (ko)	1993-04-20	알킬비스아실포스핀옥사이드 광개시제 및 이를 함유하는 조성물
US20090306243A1 (en)	2009-12-10	Composition for forming cured film pattern and method for producing cured film pattern by using the same
DE60330802D1 (de)	2010-02-11	Halogenfreier farbstoff enthaltende lichtempfindliche harzzusammensetzung
TW200606590A (en)	2006-02-16	Waveguide compositions and waveguides formed therefrom
TW201129600A (en)	2011-09-01	Solder resist composition and printed circuit board
SG160355A1 (en)	2010-04-29	Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
WO2002048217A1 (en)	2002-06-20	Polymer for photoresist and resin compositions therefor
CN109476898A (zh)	2019-03-15	树脂组合物
AU705375B2 (en)	1999-05-20	Photosensitive resin composition
NO20034048D0 (no)	2003-09-12	Addukter av polyalkylenglykolmonoglycidyletere og aminforbindelser
EP3059621A1 (de)	2016-08-24	Lichtleiterpfad und optische/elektrische hybrid-leiterplatte
TW200512534A (en)	2005-04-01	Liquid photo solder resist composition and photo solder resist film thereof
KR100714811B1 (ko)	2007-05-04	산감응성 공중합체 및 그 용도
TW200641522A (en)	2006-12-01	Positive resist composition, method for forming resist pattern and compound
MY148552A (en)	2013-04-30	Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
EP0525185A4 (en)	1993-02-24	Positive resist composition
TW201819352A (zh)	2018-06-01	一種感光性樹脂組合物及其應用
ATE222541T1 (de)	2002-09-15	Verfahren zur herstellung von elektronischen bauteilen
HK1044048A1 (zh)	2002-10-04	光敏组合物

Legal Events

Date	Code	Title	Description
2011-01-20	8364	No opposition during term of opposition