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DE60326916D1 - Piezoelektrischer Vielschichtaktor - Google Patents

Piezoelektrischer Vielschichtaktor

Info

Publication number
DE60326916D1
DE60326916D1 DE60326916T DE60326916T DE60326916D1 DE 60326916 D1 DE60326916 D1 DE 60326916D1 DE 60326916 T DE60326916 T DE 60326916T DE 60326916 T DE60326916 T DE 60326916T DE 60326916 D1 DE60326916 D1 DE 60326916D1
Authority
DE
Germany
Prior art keywords
multilayer actuator
piezoelectric multilayer
piezoelectric
actuator
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60326916T
Other languages
English (en)
Inventor
Satoshi Sasaki
Kazushi Tachimoto
Mitsunao Homma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of DE60326916D1 publication Critical patent/DE60326916D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H10N30/874—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices embedded within piezoelectric or electrostrictive material, e.g. via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
DE60326916T 2002-12-04 2003-12-03 Piezoelektrischer Vielschichtaktor Expired - Lifetime DE60326916D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002352941 2002-12-04
JP2002363119 2002-12-13

Publications (1)

Publication Number Publication Date
DE60326916D1 true DE60326916D1 (de) 2009-05-14

Family

ID=32314122

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60326916T Expired - Lifetime DE60326916D1 (de) 2002-12-04 2003-12-03 Piezoelektrischer Vielschichtaktor

Country Status (4)

Country Link
US (1) US7161089B2 (de)
EP (1) EP1427030B1 (de)
KR (1) KR100996827B1 (de)
DE (1) DE60326916D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100786156B1 (ko) * 2004-07-06 2007-12-18 동경 엘렉트론 주식회사 인터포저 및 인터포저의 제조 방법
JP5559975B2 (ja) * 2009-03-12 2014-07-23 富士フイルム株式会社 液体吐出ヘッド、液体吐出ヘッドの製造方法及び画像形成装置
KR101197921B1 (ko) * 2011-10-18 2012-11-05 삼성전기주식회사 적층 세라믹 전자 부품
KR102400185B1 (ko) 2014-11-12 2022-05-20 삼성전자주식회사 관통전극을 갖는 반도체 소자
CN112702840B (zh) 2019-10-23 2023-10-27 奥特斯(中国)有限公司 有嵌入的部件和水平长型过孔的部件承载件及其制造方法
JP7546397B2 (ja) * 2020-07-27 2024-09-06 日東電工株式会社 インダクタ
KR102901384B1 (ko) * 2021-02-17 2025-12-18 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
JP2023043862A (ja) * 2021-09-16 2023-03-29 方略電子股▲ふん▼有限公司 電子装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117069A (en) * 1988-03-28 1992-05-26 Prime Computer, Inc. Circuit board fabrication
US5126707A (en) 1989-12-25 1992-06-30 Takeshi Ikeda Laminated lc element and method for manufacturing the same
US5304743A (en) * 1992-05-12 1994-04-19 Lsi Logic Corporation Multilayer IC semiconductor package
JP2958505B2 (ja) 1993-06-30 1999-10-06 株式会社村田製作所 積層型圧電体素子の内部電極と外部電極の接続構造
JPH08316542A (ja) 1995-05-19 1996-11-29 Nippon Cement Co Ltd 積層型圧電アクチュエーターの製造方法
JPH0992753A (ja) 1995-09-26 1997-04-04 Toshiba Corp 多層セラミックス回路基板およびその製造方法
JP4234205B2 (ja) * 1996-11-08 2009-03-04 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド 電子アセンブリおよび電子物品内でのヴァイアのインダクタンスを低減する方法
JP3336913B2 (ja) 1997-06-30 2002-10-21 株式会社村田製作所 電子部品のパッケージ構造
JP2000151111A (ja) 1998-08-31 2000-05-30 Toppan Printing Co Ltd 半導体装置用基板
JP3381779B2 (ja) 1998-09-17 2003-03-04 セイコーエプソン株式会社 圧電振動子ユニット、圧電振動子ユニットの製造方法、及びインクジェット式記録ヘッド
JP3571247B2 (ja) 1999-03-31 2004-09-29 太陽誘電株式会社 積層電子部品
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US6395995B1 (en) * 2000-03-15 2002-05-28 Intel Corporation Apparatus for coupling integrated circuit packages to bonding pads having vias
JP3531573B2 (ja) * 2000-03-17 2004-05-31 株式会社村田製作所 積層型セラミック電子部品およびその製造方法ならびに電子装置
JP3705090B2 (ja) 2000-07-24 2005-10-12 ブラザー工業株式会社 圧電式インクジェットプリンタヘッド
JP2002064274A (ja) 2000-08-21 2002-02-28 Toppan Printing Co Ltd ビアホール構造とその形成方法およびこれを用いた多層配線基板
JP3804459B2 (ja) 2001-03-01 2006-08-02 ブラザー工業株式会社 積層型圧電素子
JP2001358016A (ja) 2001-05-02 2001-12-26 Taiyo Yuden Co Ltd 積層チップインダクタ

Also Published As

Publication number Publication date
KR20040048849A (ko) 2004-06-10
KR100996827B1 (ko) 2010-11-29
EP1427030B1 (de) 2009-04-01
EP1427030A3 (de) 2005-03-16
EP1427030A2 (de) 2004-06-09
US7161089B2 (en) 2007-01-09
US20040112635A1 (en) 2004-06-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition