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DE60325669D1 - Verfahren zum Transferieren eines Objekts und Verfahren zur Herstellung eines Halbleiterbauelements - Google Patents

Verfahren zum Transferieren eines Objekts und Verfahren zur Herstellung eines Halbleiterbauelements

Info

Publication number
DE60325669D1
DE60325669D1 DE60325669T DE60325669T DE60325669D1 DE 60325669 D1 DE60325669 D1 DE 60325669D1 DE 60325669 T DE60325669 T DE 60325669T DE 60325669 T DE60325669 T DE 60325669T DE 60325669 D1 DE60325669 D1 DE 60325669D1
Authority
DE
Germany
Prior art keywords
transferring
producing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60325669T
Other languages
English (en)
Inventor
Toru Takayama
Yuugo Goto
Junya Maruyama
Yumiko Ohno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Application granted granted Critical
Publication of DE60325669D1 publication Critical patent/DE60325669D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0214Manufacture or treatment of multiple TFTs using temporary substrates
    • H10P90/1914
    • H10W10/181
    • H10P72/7434
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive
DE60325669T 2002-05-17 2003-05-09 Verfahren zum Transferieren eines Objekts und Verfahren zur Herstellung eines Halbleiterbauelements Expired - Lifetime DE60325669D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002143797 2002-05-17

Publications (1)

Publication Number Publication Date
DE60325669D1 true DE60325669D1 (de) 2009-02-26

Family

ID=29267852

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60325669T Expired - Lifetime DE60325669D1 (de) 2002-05-17 2003-05-09 Verfahren zum Transferieren eines Objekts und Verfahren zur Herstellung eines Halbleiterbauelements

Country Status (7)

Country Link
US (3) US7147740B2 (de)
EP (1) EP1363319B1 (de)
JP (1) JP5094776B2 (de)
KR (2) KR100993130B1 (de)
CN (2) CN1458665B (de)
DE (1) DE60325669D1 (de)
TW (3) TWI289932B (de)

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CN102867736B (zh) 2016-05-11
US20090321004A1 (en) 2009-12-31
TW200403858A (en) 2004-03-01
TW200739816A (en) 2007-10-16
US20030217805A1 (en) 2003-11-27
KR20100058436A (ko) 2010-06-03
US7147740B2 (en) 2006-12-12
CN102867736A (zh) 2013-01-09
US8945331B2 (en) 2015-02-03
KR100993130B1 (ko) 2010-11-10
KR101028352B1 (ko) 2011-04-11
EP1363319B1 (de) 2009-01-07
JP5094776B2 (ja) 2012-12-12
TW201021158A (en) 2010-06-01
EP1363319A2 (de) 2003-11-19
TWI289932B (en) 2007-11-11
TWI360200B (en) 2012-03-11
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US20070243352A1 (en) 2007-10-18
EP1363319A3 (de) 2005-01-26

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