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DE60322576D1 - Anbringvorrichtung und verfahren für elektronische teile - Google Patents

Anbringvorrichtung und verfahren für elektronische teile

Info

Publication number
DE60322576D1
DE60322576D1 DE60322576T DE60322576T DE60322576D1 DE 60322576 D1 DE60322576 D1 DE 60322576D1 DE 60322576 T DE60322576 T DE 60322576T DE 60322576 T DE60322576 T DE 60322576T DE 60322576 D1 DE60322576 D1 DE 60322576D1
Authority
DE
Germany
Prior art keywords
electronic parts
electronic
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60322576T
Other languages
English (en)
Inventor
Kazuhide Nagao
Shigeyuki Yoshitomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60322576D1 publication Critical patent/DE60322576D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE60322576T 2002-12-03 2003-11-25 Anbringvorrichtung und verfahren für elektronische teile Expired - Lifetime DE60322576D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002351053A JP4147923B2 (ja) 2002-12-03 2002-12-03 電子部品実装装置および電子部品実装方法
PCT/JP2003/015014 WO2004052071A1 (en) 2002-12-03 2003-11-25 Electronic parts mounting apparatus and method

Publications (1)

Publication Number Publication Date
DE60322576D1 true DE60322576D1 (de) 2008-09-11

Family

ID=32463130

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60322576T Expired - Lifetime DE60322576D1 (de) 2002-12-03 2003-11-25 Anbringvorrichtung und verfahren für elektronische teile

Country Status (8)

Country Link
US (1) US7089656B2 (de)
EP (1) EP1568262B1 (de)
JP (1) JP4147923B2 (de)
KR (1) KR101005800B1 (de)
CN (1) CN1711817B (de)
AU (1) AU2003286419A1 (de)
DE (1) DE60322576D1 (de)
WO (1) WO2004052071A1 (de)

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US7353589B2 (en) * 2003-10-15 2008-04-08 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
DE602005018461D1 (de) * 2004-03-15 2010-02-04 Panasonic Corp Verfahren und vorrichtung zur untersuchung der anbringgenauigkeit einer komponente
DE102004052884B4 (de) * 2004-11-02 2010-05-20 Siemens Electronics Assembly Systems Gmbh & Co. Kg Beleuchtungsanordnung und optisches Meßsystem zum Erfassen von Objekten
US7581313B2 (en) * 2005-03-10 2009-09-01 Panasonic Corporation Component mounting method and mounter
JP2007188128A (ja) * 2006-01-11 2007-07-26 Omron Corp カラー画像を用いた測定方法および測定装置
US7860600B2 (en) * 2006-02-09 2010-12-28 Panasonic Corporation Method of determining pickup order of components
JP4050772B1 (ja) * 2006-12-12 2008-02-20 田中電子工業株式会社 金属細線の真直性の測定方法及び測定装置
NL1034086C2 (nl) * 2007-07-03 2009-01-06 Assembleon Bv Werkwijze voor het plaatsen van ten minste een van aansluitpunten voorziene component op een substraat alsmede een dergelijke inrichting.
JP2009302157A (ja) * 2008-06-10 2009-12-24 Pioneer Electronic Corp 電子部品の座標入力方法及び装置
JP4960311B2 (ja) * 2008-07-02 2012-06-27 パナソニック株式会社 部品実装方法
EA014277B1 (ru) * 2008-12-02 2010-10-29 Александр Иванович Таран Способ совмещения элементов многокристальных модулей для капиллярной сборки и установка для его реализации
KR101575286B1 (ko) * 2009-04-17 2015-12-22 한화테크윈 주식회사 부품 실장기용 헤드 어셈블리
KR101113088B1 (ko) * 2009-05-19 2012-02-15 미래산업 주식회사 부품 실장장치 및 그의 부품 인식방법
JP5152147B2 (ja) * 2009-10-26 2013-02-27 パナソニック株式会社 部品実装機、部品実装システム及び部品実装方法
JP5441266B2 (ja) * 2010-06-24 2014-03-12 合同会社ＩＰ Ｂｒｉｄｇｅ１号 部品実装システムおよび画像認識用データ作成装置ならびに画像認識用データ作成方法
JP5561056B2 (ja) * 2010-09-15 2014-07-30 ソニー株式会社 光照射装置、部品撮像装置及び部品実装装置
KR101638440B1 (ko) * 2011-02-07 2016-07-12 한화테크윈 주식회사 부품 촬상 장치 및 그 방법
FR2977939B1 (fr) 2011-07-11 2013-08-09 Edixia Procede d'acquisition de plusieurs images d'un meme objet a l'aide d'une seule camera lineaire
WO2013031057A1 (ja) * 2011-08-29 2013-03-07 パナソニック株式会社 部品実装装置、ノズル及び部品実装位置補正方法
CN103257142A (zh) * 2012-02-15 2013-08-21 亚亚科技股份有限公司 光学检测装置
JP2013206910A (ja) * 2012-03-27 2013-10-07 Sony Corp 照明装置、撮像装置、部品実装装置、及び基板の製造方法
CN103424072A (zh) * 2012-05-23 2013-12-04 珠海格力电器股份有限公司 视觉检测单元和视觉检测系统
TWI567859B (zh) * 2014-02-10 2017-01-21 新川股份有限公司 安裝裝置及其偏移量修正方法
KR20160004818A (ko) * 2014-07-04 2016-01-13 한화테크윈 주식회사 흡착 노즐 및 그 제조 방법
CN105472961B (zh) * 2014-09-30 2020-07-21 韩华精密机械株式会社 表面贴装机的部件吸持头
US10477751B2 (en) * 2014-10-03 2019-11-12 Fuji Corporation Component mounting system and error stoppage diagnosis method for component mounting device
KR20160047251A (ko) * 2014-10-22 2016-05-02 한화테크윈 주식회사 부품 실장 검사 장치
CN106376230B (zh) * 2016-09-30 2019-01-18 哈尔滨工业大学 贴片头偏移量的校正方法
DE112018007668T5 (de) * 2018-05-31 2021-04-08 Yamaha Hatsudoki Kabushiki Kaisha Erkennungsparameteroptimierungsvorrichtung, komponentenmontier-system und erkennunsparameteroptimierungsverfahren
CN114503797B (zh) * 2019-10-10 2024-09-24 松下知识产权经营株式会社 部件搭载系统以及部件搭载方法
CN112862903B (zh) * 2021-03-03 2022-10-18 深圳市旗众智能科技有限公司 贴片机相机与吸杆之间的偏移量标定方法
CN115070407B (zh) * 2022-05-18 2023-07-11 电子科技大学 辅助天线阵面大规模阵元组装定位方法
KR102534307B1 (ko) 2022-10-11 2023-05-26 주식회사 코엠에스 부품 실장기용 로터리 헤드 공압공급 구조
KR102534304B1 (ko) 2022-10-11 2023-05-26 주식회사 코엠에스 정밀 구동제어가 가능한 부품 실장기용 헤드
KR102534305B1 (ko) 2022-10-11 2023-05-26 주식회사 코엠에스 다중방향으로 구동가능한 스핀들 지지구조를 갖는 부품 실장기용 로터리 헤드

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GB2223429B (en) * 1988-08-24 1993-02-17 Tdk Corp Apparatus for and method of automatically mounting electronic component on printed circuit board
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JP2937785B2 (ja) * 1995-02-02 1999-08-23 ヤマハ発動機株式会社 実装機の部品状態検出装置
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JP4023851B2 (ja) * 1996-06-27 2007-12-19 松下電器産業株式会社 電子部品実装方法
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Also Published As

Publication number Publication date
CN1711817A (zh) 2005-12-21
KR20050086680A (ko) 2005-08-30
CN1711817B (zh) 2010-05-12
EP1568262B1 (de) 2008-07-30
WO2004052071A1 (en) 2004-06-17
KR101005800B1 (ko) 2011-01-05
JP2004186384A (ja) 2004-07-02
JP4147923B2 (ja) 2008-09-10
US20040109172A1 (en) 2004-06-10
AU2003286419A1 (en) 2004-06-23
EP1568262A1 (de) 2005-08-31
US7089656B2 (en) 2006-08-15

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)