DE60319899D1 - Doppeldiffundierter MOSFET - Google Patents
Doppeldiffundierter MOSFETInfo
- Publication number
- DE60319899D1 DE60319899D1 DE60319899T DE60319899T DE60319899D1 DE 60319899 D1 DE60319899 D1 DE 60319899D1 DE 60319899 T DE60319899 T DE 60319899T DE 60319899 T DE60319899 T DE 60319899T DE 60319899 D1 DE60319899 D1 DE 60319899D1
- Authority
- DE
- Germany
- Prior art keywords
- double diffused
- diffused mosfet
- mosfet
- double
- diffused
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/151—LDMOS having built-in components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/65—Lateral DMOS [LDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/514—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
- H10D64/516—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/141—Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
- H10D62/142—Anode regions of thyristors or collector regions of gated bipolar-mode devices
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002010127A JP3824310B2 (ja) | 2002-01-18 | 2002-01-18 | 二重拡散型mosfetおよびこれを用いた半導体装置 |
| JP2002010127 | 2002-01-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60319899D1 true DE60319899D1 (de) | 2008-05-08 |
| DE60319899T2 DE60319899T2 (de) | 2009-04-09 |
Family
ID=19191571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60319899T Expired - Lifetime DE60319899T2 (de) | 2002-01-18 | 2003-01-17 | Doppeldiffundierter MOSFET |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6914298B1 (de) |
| EP (1) | EP1331672B1 (de) |
| JP (1) | JP3824310B2 (de) |
| CN (1) | CN100349302C (de) |
| DE (1) | DE60319899T2 (de) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7098509B2 (en) * | 2004-01-02 | 2006-08-29 | Semiconductor Components Industries, L.L.C. | High energy ESD structure and method |
| JP4197660B2 (ja) | 2004-04-30 | 2008-12-17 | ローム株式会社 | Mosトランジスタおよびこれを備えた半導体集積回路装置 |
| JP2006054247A (ja) * | 2004-08-10 | 2006-02-23 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
| US7759696B2 (en) | 2005-10-20 | 2010-07-20 | Panasonic Corporation | High-breakdown voltage semiconductor switching device and switched mode power supply apparatus using the same |
| JP4695961B2 (ja) * | 2005-10-20 | 2011-06-08 | パナソニック株式会社 | 高耐圧半導体スイッチング素子及びそれを用いたスイッチング電源装置 |
| DE102005060521A1 (de) * | 2005-12-09 | 2007-06-14 | Atmel Germany Gmbh | DMOS-Transistor mit optimierter Randstruktur |
| JP4630207B2 (ja) * | 2006-03-15 | 2011-02-09 | シャープ株式会社 | 半導体装置 |
| JP2007318062A (ja) * | 2006-04-27 | 2007-12-06 | Matsushita Electric Ind Co Ltd | 高耐圧半導体スイッチング素子 |
| JP5431663B2 (ja) * | 2006-09-15 | 2014-03-05 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置及びその製造方法 |
| US7531888B2 (en) * | 2006-11-30 | 2009-05-12 | Fairchild Semiconductor Corporation | Integrated latch-up free insulated gate bipolar transistor |
| JP4788749B2 (ja) * | 2007-11-09 | 2011-10-05 | 株式会社デンソー | 半導体装置 |
| JP5515248B2 (ja) * | 2008-03-26 | 2014-06-11 | 富士電機株式会社 | 半導体装置 |
| JP5329118B2 (ja) * | 2008-04-21 | 2013-10-30 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | Dmosトランジスタ |
| CN101771077B (zh) * | 2008-12-30 | 2015-01-07 | 世界先进积体电路股份有限公司 | 具静电放电保护的水平扩散金属氧化物半导体晶体管元件 |
| JP2010278258A (ja) * | 2009-05-28 | 2010-12-09 | Panasonic Corp | 高耐圧半導体装置及びそれを用いた電流制御装置 |
| JP2011018809A (ja) * | 2009-07-09 | 2011-01-27 | Panasonic Corp | 半導体装置およびその製造方法 |
| US8120108B2 (en) * | 2010-01-27 | 2012-02-21 | Texas Instruments Incorporated | High voltage SCRMOS in BiCMOS process technologies |
| US8125030B2 (en) * | 2010-01-27 | 2012-02-28 | Texas Instruments Incorporated | High voltage SCRMOS in BiCMOS process technologies |
| JP5487304B2 (ja) | 2010-06-21 | 2014-05-07 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP5808827B2 (ja) * | 2012-02-16 | 2015-11-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| CN103839998B (zh) * | 2012-11-27 | 2017-10-24 | 上海华虹宏力半导体制造有限公司 | Ldmos器件及其制造方法 |
| US9337178B2 (en) * | 2012-12-09 | 2016-05-10 | Semiconductor Components Industries, Llc | Method of forming an ESD device and structure therefor |
| KR20150114982A (ko) * | 2013-01-30 | 2015-10-13 | 마이크로칩 테크놀로지 인코포레이티드 | Esd 자기보호 기능을 구비한 dmos 반도체 디바이스 및 그 기능부를 포함하는 lin 버스 드라이버 |
| CN106206561B (zh) | 2015-04-29 | 2019-05-10 | 无锡华润上华科技有限公司 | Ldmos可控硅结构的静电保护器件 |
| CN104992977B (zh) | 2015-05-25 | 2018-06-19 | 上海华虹宏力半导体制造有限公司 | Nldmos器件及其制造方法 |
| US10249614B2 (en) | 2015-05-28 | 2019-04-02 | Macronix International Co., Ltd. | Semiconductor device |
| US10217733B2 (en) | 2015-09-15 | 2019-02-26 | Semiconductor Components Industries, Llc | Fast SCR structure for ESD protection |
| JP7279393B2 (ja) * | 2019-02-15 | 2023-05-23 | 富士電機株式会社 | 半導体集積回路の製造方法 |
| JP7699056B2 (ja) | 2019-11-29 | 2025-06-26 | ローム株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5168333A (en) | 1987-02-26 | 1992-12-01 | Kabushiki Kaisha Toshiba | Conductivity-modulation metal oxide semiconductor field effect transistor |
| DE68929359T2 (de) * | 1988-09-22 | 2002-08-22 | Koninklijke Philips Electronics N.V., Eindhoven | Laterale bipolare Transistoranordnungen mit isolierter Steuerelektrode mit geteilter Anode |
| US5155562A (en) * | 1990-02-14 | 1992-10-13 | Fuji Electric Co., Ltd. | Semiconductor device equipped with a conductivity modulation misfet |
| JP4357127B2 (ja) | 2000-03-03 | 2009-11-04 | 株式会社東芝 | 半導体装置 |
-
2002
- 2002-01-18 JP JP2002010127A patent/JP3824310B2/ja not_active Expired - Lifetime
-
2003
- 2003-01-16 CN CNB031015212A patent/CN100349302C/zh not_active Expired - Lifetime
- 2003-01-17 EP EP03001022A patent/EP1331672B1/de not_active Expired - Lifetime
- 2003-01-17 DE DE60319899T patent/DE60319899T2/de not_active Expired - Lifetime
- 2003-01-17 US US10/346,806 patent/US6914298B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3824310B2 (ja) | 2006-09-20 |
| CN1433083A (zh) | 2003-07-30 |
| CN100349302C (zh) | 2007-11-14 |
| DE60319899T2 (de) | 2009-04-09 |
| US6914298B1 (en) | 2005-07-05 |
| EP1331672A2 (de) | 2003-07-30 |
| EP1331672A3 (de) | 2004-10-27 |
| EP1331672B1 (de) | 2008-03-26 |
| JP2003218348A (ja) | 2003-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |