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DE60319899D1 - Doppeldiffundierter MOSFET - Google Patents

Doppeldiffundierter MOSFET

Info

Publication number
DE60319899D1
DE60319899D1 DE60319899T DE60319899T DE60319899D1 DE 60319899 D1 DE60319899 D1 DE 60319899D1 DE 60319899 T DE60319899 T DE 60319899T DE 60319899 T DE60319899 T DE 60319899T DE 60319899 D1 DE60319899 D1 DE 60319899D1
Authority
DE
Germany
Prior art keywords
double diffused
diffused mosfet
mosfet
double
diffused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60319899T
Other languages
English (en)
Other versions
DE60319899T2 (de
Inventor
Yasushi Hamazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Application granted granted Critical
Publication of DE60319899D1 publication Critical patent/DE60319899D1/de
Publication of DE60319899T2 publication Critical patent/DE60319899T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/151LDMOS having built-in components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65Lateral DMOS [LDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/157Impurity concentrations or distributions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/514Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
    • H10D64/516Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/141Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
    • H10D62/142Anode regions of thyristors or collector regions of gated bipolar-mode devices
DE60319899T 2002-01-18 2003-01-17 Doppeldiffundierter MOSFET Expired - Lifetime DE60319899T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002010127A JP3824310B2 (ja) 2002-01-18 2002-01-18 二重拡散型mosfetおよびこれを用いた半導体装置
JP2002010127 2002-01-18

Publications (2)

Publication Number Publication Date
DE60319899D1 true DE60319899D1 (de) 2008-05-08
DE60319899T2 DE60319899T2 (de) 2009-04-09

Family

ID=19191571

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60319899T Expired - Lifetime DE60319899T2 (de) 2002-01-18 2003-01-17 Doppeldiffundierter MOSFET

Country Status (5)

Country Link
US (1) US6914298B1 (de)
EP (1) EP1331672B1 (de)
JP (1) JP3824310B2 (de)
CN (1) CN100349302C (de)
DE (1) DE60319899T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098509B2 (en) * 2004-01-02 2006-08-29 Semiconductor Components Industries, L.L.C. High energy ESD structure and method
JP4197660B2 (ja) 2004-04-30 2008-12-17 ローム株式会社 Mosトランジスタおよびこれを備えた半導体集積回路装置
JP2006054247A (ja) * 2004-08-10 2006-02-23 Fuji Electric Device Technology Co Ltd 半導体装置
US7759696B2 (en) 2005-10-20 2010-07-20 Panasonic Corporation High-breakdown voltage semiconductor switching device and switched mode power supply apparatus using the same
JP4695961B2 (ja) * 2005-10-20 2011-06-08 パナソニック株式会社 高耐圧半導体スイッチング素子及びそれを用いたスイッチング電源装置
DE102005060521A1 (de) * 2005-12-09 2007-06-14 Atmel Germany Gmbh DMOS-Transistor mit optimierter Randstruktur
JP4630207B2 (ja) * 2006-03-15 2011-02-09 シャープ株式会社 半導体装置
JP2007318062A (ja) * 2006-04-27 2007-12-06 Matsushita Electric Ind Co Ltd 高耐圧半導体スイッチング素子
JP5431663B2 (ja) * 2006-09-15 2014-03-05 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置及びその製造方法
US7531888B2 (en) * 2006-11-30 2009-05-12 Fairchild Semiconductor Corporation Integrated latch-up free insulated gate bipolar transistor
JP4788749B2 (ja) * 2007-11-09 2011-10-05 株式会社デンソー 半導体装置
JP5515248B2 (ja) * 2008-03-26 2014-06-11 富士電機株式会社 半導体装置
JP5329118B2 (ja) * 2008-04-21 2013-10-30 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー Dmosトランジスタ
CN101771077B (zh) * 2008-12-30 2015-01-07 世界先进积体电路股份有限公司 具静电放电保护的水平扩散金属氧化物半导体晶体管元件
JP2010278258A (ja) * 2009-05-28 2010-12-09 Panasonic Corp 高耐圧半導体装置及びそれを用いた電流制御装置
JP2011018809A (ja) * 2009-07-09 2011-01-27 Panasonic Corp 半導体装置およびその製造方法
US8120108B2 (en) * 2010-01-27 2012-02-21 Texas Instruments Incorporated High voltage SCRMOS in BiCMOS process technologies
US8125030B2 (en) * 2010-01-27 2012-02-28 Texas Instruments Incorporated High voltage SCRMOS in BiCMOS process technologies
JP5487304B2 (ja) 2010-06-21 2014-05-07 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5808827B2 (ja) * 2012-02-16 2015-11-10 ルネサスエレクトロニクス株式会社 半導体装置
CN103839998B (zh) * 2012-11-27 2017-10-24 上海华虹宏力半导体制造有限公司 Ldmos器件及其制造方法
US9337178B2 (en) * 2012-12-09 2016-05-10 Semiconductor Components Industries, Llc Method of forming an ESD device and structure therefor
KR20150114982A (ko) * 2013-01-30 2015-10-13 마이크로칩 테크놀로지 인코포레이티드 Esd 자기­보호 기능을 구비한 dmos 반도체 디바이스 및 그 기능부를 포함하는 lin 버스 드라이버
CN106206561B (zh) 2015-04-29 2019-05-10 无锡华润上华科技有限公司 Ldmos可控硅结构的静电保护器件
CN104992977B (zh) 2015-05-25 2018-06-19 上海华虹宏力半导体制造有限公司 Nldmos器件及其制造方法
US10249614B2 (en) 2015-05-28 2019-04-02 Macronix International Co., Ltd. Semiconductor device
US10217733B2 (en) 2015-09-15 2019-02-26 Semiconductor Components Industries, Llc Fast SCR structure for ESD protection
JP7279393B2 (ja) * 2019-02-15 2023-05-23 富士電機株式会社 半導体集積回路の製造方法
JP7699056B2 (ja) 2019-11-29 2025-06-26 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168333A (en) 1987-02-26 1992-12-01 Kabushiki Kaisha Toshiba Conductivity-modulation metal oxide semiconductor field effect transistor
DE68929359T2 (de) * 1988-09-22 2002-08-22 Koninklijke Philips Electronics N.V., Eindhoven Laterale bipolare Transistoranordnungen mit isolierter Steuerelektrode mit geteilter Anode
US5155562A (en) * 1990-02-14 1992-10-13 Fuji Electric Co., Ltd. Semiconductor device equipped with a conductivity modulation misfet
JP4357127B2 (ja) 2000-03-03 2009-11-04 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
JP3824310B2 (ja) 2006-09-20
CN1433083A (zh) 2003-07-30
CN100349302C (zh) 2007-11-14
DE60319899T2 (de) 2009-04-09
US6914298B1 (en) 2005-07-05
EP1331672A2 (de) 2003-07-30
EP1331672A3 (de) 2004-10-27
EP1331672B1 (de) 2008-03-26
JP2003218348A (ja) 2003-07-31

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