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DE60316857D1 - Herstellungsverfahren eines piezoelektrischen Bauelements und eines Flüssigkeitsstrahlkopfes - Google Patents

Herstellungsverfahren eines piezoelektrischen Bauelements und eines Flüssigkeitsstrahlkopfes

Info

Publication number
DE60316857D1
DE60316857D1 DE60316857T DE60316857T DE60316857D1 DE 60316857 D1 DE60316857 D1 DE 60316857D1 DE 60316857 T DE60316857 T DE 60316857T DE 60316857 T DE60316857 T DE 60316857T DE 60316857 D1 DE60316857 D1 DE 60316857D1
Authority
DE
Germany
Prior art keywords
manufacturing
jet head
liquid jet
piezoelectric device
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60316857T
Other languages
English (en)
Other versions
DE60316857T2 (de
Inventor
Masami Murai
Li Xin-Shan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE60316857D1 publication Critical patent/DE60316857D1/de
Application granted granted Critical
Publication of DE60316857T2 publication Critical patent/DE60316857T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
    • H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Special Spraying Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
DE2003616857 2002-01-22 2003-01-22 Herstellungsverfahren eines piezoelektrischen Bauelements und eines Flüssigkeitsstrahlkopfes Expired - Lifetime DE60316857T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2002012714 2002-01-22
JP2002012714 2002-01-22
JP2002019807 2002-01-29
JP2002019807 2002-01-29
JP2002208641 2002-07-17
JP2002208641 2002-07-17
JP2003005116 2003-01-10
JP2003005116A JP4530615B2 (ja) 2002-01-22 2003-01-10 圧電体素子および液体吐出ヘッド

Publications (2)

Publication Number Publication Date
DE60316857D1 true DE60316857D1 (de) 2007-11-29
DE60316857T2 DE60316857T2 (de) 2008-02-07

Family

ID=27482770

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2003616857 Expired - Lifetime DE60316857T2 (de) 2002-01-22 2003-01-22 Herstellungsverfahren eines piezoelektrischen Bauelements und eines Flüssigkeitsstrahlkopfes
DE60327379T Expired - Fee Related DE60327379D1 (de) 2002-01-22 2003-01-22 Piezoelektrisches Bauelement, Flüssigkeitsstrahlkopf und deren Herstellungsverfahren

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60327379T Expired - Fee Related DE60327379D1 (de) 2002-01-22 2003-01-22 Piezoelektrisches Bauelement, Flüssigkeitsstrahlkopf und deren Herstellungsverfahren

Country Status (5)

Country Link
US (2) US6883901B2 (de)
EP (2) EP1763093B1 (de)
JP (1) JP4530615B2 (de)
CN (1) CN1438117A (de)
DE (2) DE60316857T2 (de)

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TWI220130B (en) * 2003-12-17 2004-08-11 Ind Tech Res Inst Inkjet printhead and manufacturing method thereof
US7399067B2 (en) 2004-02-27 2008-07-15 Canon Kabushiki Kaisha Piezoelectric thin film, method of manufacturing piezoelectric thin film, piezoelectric element, and ink jet recording head
US7470375B2 (en) * 2004-10-22 2008-12-30 Canon Kabushiki Kaisha Method for manufacturing liquid ejection head, substrate for liquid ejection head, and liquid ejection head
JP2006278489A (ja) 2005-03-28 2006-10-12 Seiko Epson Corp 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置
JP5297576B2 (ja) 2005-03-28 2013-09-25 セイコーエプソン株式会社 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置
JP5188076B2 (ja) * 2006-04-03 2013-04-24 キヤノン株式会社 圧電素子及びその製造方法、電子デバイス、インクジェット装置
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US8020974B2 (en) * 2007-01-31 2011-09-20 Panasonic Corporation Piezoelectric thin film device and piezoelectric thin film device manufacturing method, and inkjet head and inkjet recording apparatus
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JP5854183B2 (ja) * 2010-03-02 2016-02-09 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外センサー
CN101814575B (zh) * 2010-04-27 2012-01-04 上海交通大学 微机电系统压电双晶片的制备方法
JP5741799B2 (ja) * 2010-12-06 2015-07-01 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置及び圧電素子
JP5892406B2 (ja) 2011-06-30 2016-03-23 株式会社リコー 電気機械変換素子、液滴吐出ヘッド及び液滴吐出装置
US9761785B2 (en) 2011-10-17 2017-09-12 The United States Of America As Represented By The Secretary Of The Army Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing
US8866367B2 (en) 2011-10-17 2014-10-21 The United States Of America As Represented By The Secretary Of The Army Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making
JP2015023053A (ja) 2013-07-16 2015-02-02 株式会社リコー 電気機械変換素子、液滴吐出ヘッド、液滴吐出装置、画像形成装置、及び、電気機械変換素子の製造方法
JP6175956B2 (ja) * 2013-07-25 2017-08-09 株式会社リコー 電気−機械変換素子、電気−機械変換素子を配置した液滴吐出ヘッド、及び液滴吐出ヘッドを備えた液滴吐出装置
KR101531114B1 (ko) * 2013-12-26 2015-06-23 삼성전기주식회사 압전 액추에이터 모듈, 압전 액추에이터 모듈의 제조방법 및 압전 액추에이터 모듈을 포함하는 mems 센서
JP6948772B2 (ja) 2016-08-31 2021-10-13 セイコーエプソン株式会社 圧電素子、圧電アクチュエーター、圧電モーター、ロボット、電子部品搬送装置およびプリンター
JP2018079589A (ja) * 2016-11-14 2018-05-24 セイコーエプソン株式会社 液体検出装置及び液体容器
CN109572214B (zh) 2017-09-27 2020-08-04 精工爱普生株式会社 液体喷出装置以及打印头

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Also Published As

Publication number Publication date
US20030227518A1 (en) 2003-12-11
JP2004104066A (ja) 2004-04-02
CN1438117A (zh) 2003-08-27
EP1763093B1 (de) 2009-04-22
EP1329964B1 (de) 2007-10-17
US6883901B2 (en) 2005-04-26
EP1329964A3 (de) 2006-03-15
DE60327379D1 (de) 2009-06-04
EP1763093A1 (de) 2007-03-14
US7328490B2 (en) 2008-02-12
JP4530615B2 (ja) 2010-08-25
DE60316857T2 (de) 2008-02-07
US20050078153A1 (en) 2005-04-14
EP1329964A2 (de) 2003-07-23

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