DE60311765D1 - Leiterplatte für Hochgeschwindigkeitskommunikation - Google Patents

Leiterplatte für Hochgeschwindigkeitskommunikation

Info

Publication number: DE60311765D1
Authority: DE; Germany
Prior art keywords: circuit board; printed circuit; high speed; speed communication; communication
Prior art date: 2003-03-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60311765T

Other languages

English (en)

Other versions

DE60311765T2 (de

Inventor

Yuichiro Murata

Naoki Nakagawa

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Electric Corp

Original Assignee

Mitsubishi Electric Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-03-07

Filing date

2003-12-11

Publication date

2007-03-29

2003-12-11 Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp

2007-03-29 Publication of DE60311765D1 publication Critical patent/DE60311765D1/de

2007-10-31 Application granted granted Critical

2007-10-31 Publication of DE60311765T2 publication Critical patent/DE60311765T2/de

2023-12-12 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Coupling Device And Connection With Printed Circuit (AREA)
Combinations Of Printed Boards (AREA)
Structure Of Printed Boards (AREA)

DE60311765T 2003-03-07 2003-12-11 Leiterplatte für Hochgeschwindigkeitskommunikation Expired - Lifetime DE60311765T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2003061818		2003-03-07
JP2003061818A JP4233360B2 (ja)	2003-03-07	2003-03-07	高速通信用プリント配線基板

Publications (2)

Publication Number	Publication Date
DE60311765D1 true DE60311765D1 (de)	2007-03-29
DE60311765T2 DE60311765T2 (de)	2007-10-31

Family

ID=32767880

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60311765T Expired - Lifetime DE60311765T2 (de)	2003-03-07	2003-12-11	Leiterplatte für Hochgeschwindigkeitskommunikation

Country Status (5)

Country	Link
US (1)	US7151675B2 (de)
EP (1)	EP1458225B1 (de)
JP (1)	JP4233360B2 (de)
CN (1)	CN1271898C (de)
DE (1)	DE60311765T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9013450B1 (en) *	2003-11-03	2015-04-21	Imaging Systems Technology, Inc.	IR touch
JP4186972B2 (ja) *	2005-09-28	2008-11-26	松下電器産業株式会社	基板間接続用シート状デバイスおよび接続構造体
JP4860990B2 (ja) *	2005-11-29	2012-01-25	キヤノン株式会社	回路接続構造およびプリント回路板
WO2009022374A1 (ja) *	2007-08-10	2009-02-19	Fujitsu Access Limited	ｘＤＳＬ通信システム
JP2020178967A (ja) *	2019-04-26	2020-11-05	株式会社三共	遊技機

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3237968B2 (ja) *	1993-08-18	2001-12-10	富士通株式会社	半導体素子モジュール
US5530623A (en) *	1993-11-19	1996-06-25	Ncr Corporation	High speed memory packaging scheme
JP2882266B2 (ja) *	1993-12-28	1999-04-12	株式会社日立製作所	信号伝送装置及び回路ブロック
JP3407469B2 (ja) *	1995-04-17	2003-05-19	株式会社日立製作所	情報処置装置
US5734208A (en) *	1996-06-14	1998-03-31	Dell Usa, L.P.	Dynamic termination for signal buses going to a connector
US6219733B1 (en)	1998-08-26	2001-04-17	International Business Machines Corporation	Transmission line loop
US6115278A (en) *	1999-02-09	2000-09-05	Silicon Graphics, Inc.	Memory system with switching for data isolation
JP3621608B2 (ja)	1999-07-28	2005-02-16	ケル株式会社	マザーボード
US6308232B1 (en) *	1999-09-01	2001-10-23	Rambus Inc.	Electronically moveable terminator and method for using same in a memory system
US6496380B1 (en)	2000-08-24	2002-12-17	High Connection Density, Inc.	High capacity memory module with high electrical design margins
US6674648B2 (en) *	2001-07-23	2004-01-06	Intel Corporation	Termination cards and systems therefore

2003
- 2003-03-07 JP JP2003061818A patent/JP4233360B2/ja not_active Expired - Fee Related
- 2003-08-13 US US10/639,464 patent/US7151675B2/en not_active Expired - Fee Related
- 2003-09-24 CN CNB031587941A patent/CN1271898C/zh not_active Expired - Fee Related
- 2003-12-11 EP EP03028597A patent/EP1458225B1/de not_active Expired - Lifetime
- 2003-12-11 DE DE60311765T patent/DE60311765T2/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US7151675B2 (en)	2006-12-19
CN1527652A (zh)	2004-09-08
DE60311765T2 (de)	2007-10-31
US20050174747A1 (en)	2005-08-11
EP1458225B1 (de)	2007-02-14
EP1458225A3 (de)	2005-10-26
JP2004273725A (ja)	2004-09-30
JP4233360B2 (ja)	2009-03-04
CN1271898C (zh)	2006-08-23
EP1458225A2 (de)	2004-09-15

Publication	Publication Date	Title
DE60309777D1 (de)	2007-01-04	Anschlusskontakt für Leiterplatte
EP1887845A4 (de)	2010-08-11	Leiterplatte
DE602004028794D1 (de)	2010-10-07	Leiterplatte
EP1887846A4 (de)	2010-08-11	Leiterplatte
FI20022140A7 (fi)	2003-06-11	Joustava painettu piirilevy
DE60125269D1 (de)	2007-02-01	Steckverbinder für flexible Leiterplatten
DE60234281D1 (de)	2009-12-17	Mehrschichtige Leiterplatte
DE602005024783D1 (de)	2010-12-30	Verbinder für Leiterplatte
DE60043603D1 (de)	2010-02-11	Verbinder für gedruckte Leiterplatten
SG129435A1 (en)	2007-02-26	Printed circuit board test access point structuresand method for making the same
DE602005021305D1 (de)	2010-07-01	Leiterplatte
EP1863326A4 (de)	2010-03-31	Leiterplatte
GB2422491B (en)	2007-05-16	Printed Circuit Board
GB2403602B (en)	2007-01-10	Pivoted circuit board arrangement
DE502004009830D1 (de)	2009-09-10	Anschlussmodul für leistungsschalter
GB2404089B (en)	2007-05-02	Printed circuit board assembly
DE10392979D2 (de)	2005-07-14	Leiterplatte für elektronische Kraftfahrzeugsteuergeräte
DE502004010138D1 (de)	2009-11-12	Schaltungsmodul
DE602004015387D1 (de)	2008-09-11	Leiterplatte
AU2003244889A1 (en)	2004-01-19	Carriers for printed circuit board marking
GB0806424D0 (en)	2008-05-14	Quasi-waveguide printed circuit board structure
EP1641329A4 (de)	2010-01-20	Leiterplatte
DE60311765D1 (de)	2007-03-29	Leiterplatte für Hochgeschwindigkeitskommunikation
DE60231610D1 (de)	2009-04-30	Mehrschichtige gedruckte Leiterplatte
FR2871336B1 (fr)	2007-01-19	Circuit imprime flex-rigide par collage

Legal Events

Date	Code	Title	Description
2008-03-13	8364	No opposition during term of opposition
2011-08-18	R084	Declaration of willingness to licence	Ref document number: 1458225 Country of ref document: EP Effective date: 20110627

Date

Code

Title

Description

2008-03-13

8364

No opposition during term of opposition

2011-08-18

R084

Declaration of willingness to licence

Ref document number: 1458225

Country of ref document: EP

Effective date: 20110627