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DE60305119D1 - Auslaugbeständige Lötlegierungen für elektrisch leitende Dickfilme auf Silberbasis - Google Patents

Auslaugbeständige Lötlegierungen für elektrisch leitende Dickfilme auf Silberbasis

Info

Publication number
DE60305119D1
DE60305119D1 DE60305119T DE60305119T DE60305119D1 DE 60305119 D1 DE60305119 D1 DE 60305119D1 DE 60305119 T DE60305119 T DE 60305119T DE 60305119 T DE60305119 T DE 60305119T DE 60305119 D1 DE60305119 D1 DE 60305119D1
Authority
DE
Germany
Prior art keywords
leach
silver
electrically conductive
thick films
solder alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60305119T
Other languages
English (en)
Other versions
DE60305119T2 (de
Inventor
Bradley H Carter
Shing Yeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of DE60305119D1 publication Critical patent/DE60305119D1/de
Application granted granted Critical
Publication of DE60305119T2 publication Critical patent/DE60305119T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead
    • H05K3/346—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12701—Pb-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60305119T 2002-09-23 2003-09-23 Auslaugbeständige Lötlegierungen für elektrisch leitende Dickfilme auf Silberbasis Expired - Lifetime DE60305119T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US252502 2002-09-23
US10/252,502 US6630251B1 (en) 2002-09-23 2002-09-23 Leach-resistant solder alloys for silver-based thick-film conductors

Publications (2)

Publication Number Publication Date
DE60305119D1 true DE60305119D1 (de) 2006-06-14
DE60305119T2 DE60305119T2 (de) 2006-10-26

Family

ID=28675124

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60305119T Expired - Lifetime DE60305119T2 (de) 2002-09-23 2003-09-23 Auslaugbeständige Lötlegierungen für elektrisch leitende Dickfilme auf Silberbasis

Country Status (3)

Country Link
US (1) US6630251B1 (de)
EP (1) EP1402989B1 (de)
DE (1) DE60305119T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100476301B1 (ko) * 2002-07-27 2005-03-15 한국과학기술원 전기도금법에 의한 반도체 소자의 플립칩 접속용 ｕｂｍ의형성방법
US6811892B2 (en) * 2002-08-22 2004-11-02 Delphi Technologies, Inc. Lead-based solder alloys containing copper
US20080242063A1 (en) * 2007-03-30 2008-10-02 Mengzhi Pang Solder composition doped with a barrier component and method of making same
US8128868B2 (en) * 2009-02-12 2012-03-06 International Business Machines Corporation Grain refinement by precipitate formation in PB-free alloys of tin
US8493746B2 (en) 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
TWI381901B (zh) * 2009-12-15 2013-01-11 元智大學 抑制錫-鎳介金屬於銲點中生成的方法
CN101920405B (zh) * 2010-08-23 2013-07-31 中国电力科学研究院 一种镀锌钢接地网用锡铅基复合钎料及其制备方法
JP5281122B2 (ja) * 2011-06-16 2013-09-04 株式会社フジクラ 接合方法、及び、製造方法
TWI503196B (zh) * 2012-11-02 2015-10-11 Univ Yuan Ze 具多層介金屬層的銲點結構
JP2015056641A (ja) * 2013-09-13 2015-03-23 株式会社東芝 半導体装置及びその製造方法
US20170232562A1 (en) * 2014-08-22 2017-08-17 Kabushiki Kaisha Toyota Jidoshokki Bonding structure, bonding material and bonding method
CN111630646A (zh) * 2018-12-28 2020-09-04 Ｊｘ金属株式会社 焊料接合部

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622205A (en) * 1985-04-12 1986-11-11 Ibm Corporation Electromigration lifetime increase of lead base alloys
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
JPH01233087A (ja) * 1988-03-11 1989-09-18 Furukawa Electric Co Ltd:The 銅入り半田
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US5607099A (en) * 1995-04-24 1997-03-04 Delco Electronics Corporation Solder bump transfer device for flip chip integrated circuit devices
US5803340A (en) * 1995-09-29 1998-09-08 Delco Electronics Corporation Composite solder paste for flip chip bumping
US5928568A (en) * 1996-06-24 1999-07-27 Delco Electonics Corporation Thick film circuit having conductor composition with coated metallic particles
US5803344A (en) * 1996-09-09 1998-09-08 Delco Electronics Corp. Dual-solder process for enhancing reliability of thick-film hybrid circuits
US5938862A (en) 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
US6251501B1 (en) * 1999-03-29 2001-06-26 Delphi Technologies, Inc. Surface mount circuit device and solder bumping method therefor
US6281106B1 (en) 1999-11-25 2001-08-28 Delphi Technologies, Inc. Method of solder bumping a circuit component
US6375062B1 (en) 2000-11-06 2002-04-23 Delphi Technologies, Inc. Surface bumping method and structure formed thereby
US6476332B1 (en) * 2001-09-12 2002-11-05 Visteon Global Technologies, Inc. Conductor systems for thick film electronic circuits
US6570260B1 (en) * 2002-02-15 2003-05-27 Delphi Technologies, Inc. Solder process and solder alloy therefor

Also Published As

Publication number Publication date
DE60305119T2 (de) 2006-10-26
EP1402989B1 (de) 2006-05-10
EP1402989A1 (de) 2004-03-31
US6630251B1 (en) 2003-10-07

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Legal Events

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