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DE60303224D1 - Bestückungskopf und ursprungserkennung von dem bestückungskopf - Google Patents

Bestückungskopf und ursprungserkennung von dem bestückungskopf

Info

Publication number
DE60303224D1
DE60303224D1 DE60303224T DE60303224T DE60303224D1 DE 60303224 D1 DE60303224 D1 DE 60303224D1 DE 60303224 T DE60303224 T DE 60303224T DE 60303224 T DE60303224 T DE 60303224T DE 60303224 D1 DE60303224 D1 DE 60303224D1
Authority
DE
Germany
Prior art keywords
fitting head
origin detection
fitting
head
origin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60303224T
Other languages
English (en)
Other versions
DE60303224T2 (de
Inventor
Osamu Okuda
Kazuo Kido
Hideki Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002267950A external-priority patent/JP3971687B2/ja
Priority claimed from JP2003277293A external-priority patent/JP4041778B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE60303224D1 publication Critical patent/DE60303224D1/de
Application granted granted Critical
Publication of DE60303224T2 publication Critical patent/DE60303224T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
DE60303224T 2002-09-13 2003-09-11 Komponentenplatzierungskopf und Nullpunktsdetektionsverfahren für den Komponentenplatzierungskopf Expired - Lifetime DE60303224T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2002267950A JP3971687B2 (ja) 2002-09-13 2002-09-13 部品装着ヘッド及び部品装着ヘッドにおける原点検出方法
JP2002267950 2002-09-13
JP2002268010 2002-09-13
JP2002268010 2002-09-13
JP2003277293 2003-07-22
JP2003277293A JP4041778B2 (ja) 2002-09-13 2003-07-22 部品装着ヘッド
PCT/JP2003/011602 WO2004026016A1 (en) 2002-09-13 2003-09-11 Component placing head and origin detection method of component placing head

Publications (2)

Publication Number Publication Date
DE60303224D1 true DE60303224D1 (de) 2006-04-06
DE60303224T2 DE60303224T2 (de) 2006-09-14

Family

ID=31998766

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60303224T Expired - Lifetime DE60303224T2 (de) 2002-09-13 2003-09-11 Komponentenplatzierungskopf und Nullpunktsdetektionsverfahren für den Komponentenplatzierungskopf

Country Status (5)

Country Link
US (1) US7293352B2 (de)
EP (1) EP1541001B1 (de)
CN (1) CN100358404C (de)
DE (1) DE60303224T2 (de)
WO (1) WO2004026016A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080060415A (ko) * 2006-12-27 2008-07-02 미래산업 주식회사 핸들러의 전자부품 픽커
CN103547139B (zh) * 2012-07-10 2018-04-17 韩华泰科株式会社 电子元件贴装设备及其控制方法
JP5705932B2 (ja) * 2013-08-30 2015-04-22 ファナック株式会社 磁石搬送位置決め装置
CN104669284A (zh) * 2013-11-30 2015-06-03 深圳富泰宏精密工业有限公司 吸放料装置
DE112015007115T5 (de) * 2015-11-11 2018-08-02 Yamaha Hatsudoki Kabushiki Kaisha Wellenvorrichtung, Montagekopf und Oberflächen-Montagevorrichtung
JP6617290B2 (ja) * 2016-09-14 2019-12-11 パナソニックＩｐマネジメント株式会社 電子部品装着装置
EP3708307A1 (de) 2019-03-13 2020-09-16 Mikron SA Boudry Fördervorrichtung für werkstücke
CN110355303B (zh) * 2019-07-05 2024-07-30 中航富士达科技股份有限公司 一种半硬同轴射频电缆防回弹高精度弯曲成型装置
CN112762879A (zh) * 2021-01-19 2021-05-07 华北电力大学 一种非晶磁芯卷绕的外径检测机构及检测卷绕外径方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62236655A (ja) 1986-04-01 1987-10-16 Nippon Denso Co Ltd 位置制御機械の原点検出装置
EP0578136B1 (de) * 1992-07-01 1995-11-22 Yamaha Hatsudoki Kabushiki Kaisha Verfahren zum Montieren von Komponenten und Vorrichtung dafür
JP3036364B2 (ja) * 1994-07-15 2000-04-24 松下電器産業株式会社 部品搬送装置および部品搬送方法
JP3340579B2 (ja) * 1995-02-22 2002-11-05 松下電器産業株式会社 電子部品実装装置
KR100360818B1 (ko) 1996-12-25 2002-11-13 마츠시타 덴끼 산교 가부시키가이샤 부품 유지 헤드, 부품 장착 장치 및 부품 유지 방법
US6027019A (en) * 1997-09-10 2000-02-22 Kou; Yuen-Foo Michael Component feeder configuration monitoring
JP3744179B2 (ja) * 1998-02-19 2006-02-08 松下電器産業株式会社 電子部品実装方法
JP4050396B2 (ja) * 1998-07-22 2008-02-20 ヤマハ発動機株式会社 電子部品装着装置および電子部品装着装置の装着ヘッド取付方法
KR100478983B1 (ko) * 1999-05-21 2005-03-24 마츠시타 덴끼 산교 가부시키가이샤 부품흡착노즐 승강장치 및 이 승강장치를 구비한 부품 실장장치

Also Published As

Publication number Publication date
CN100358404C (zh) 2007-12-26
CN1682582A (zh) 2005-10-12
EP1541001A1 (de) 2005-06-15
US7293352B2 (en) 2007-11-13
US20060005379A1 (en) 2006-01-12
WO2004026016A1 (en) 2004-03-25
EP1541001B1 (de) 2006-01-11
DE60303224T2 (de) 2006-09-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)