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DE60212609D1 - Laser-Detektor-Einheit und Verfahren zur Montage derselben - Google Patents

Laser-Detektor-Einheit und Verfahren zur Montage derselben

Info

Publication number
DE60212609D1
DE60212609D1 DE60212609T DE60212609T DE60212609D1 DE 60212609 D1 DE60212609 D1 DE 60212609D1 DE 60212609 T DE60212609 T DE 60212609T DE 60212609 T DE60212609 T DE 60212609T DE 60212609 D1 DE60212609 D1 DE 60212609D1
Authority
DE
Germany
Prior art keywords
reference surface
mount
sub
laser
laser diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60212609T
Other languages
English (en)
Inventor
Ming-Wei Chen
K Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Finisar Corp
Original Assignee
Finisar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Finisar Corp filed Critical Finisar Corp
Application granted granted Critical
Publication of DE60212609D1 publication Critical patent/DE60212609D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H01S5/0238—Positioning of the laser chips using marks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Head (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Lasers (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DE60212609T 2001-03-13 2002-03-08 Laser-Detektor-Einheit und Verfahren zur Montage derselben Expired - Lifetime DE60212609D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US27540201P 2001-03-13 2001-03-13
US09/923,471 US6577656B2 (en) 2001-03-13 2001-08-06 System and method of packaging a laser/detector
PCT/US2002/007247 WO2002073755A2 (en) 2001-03-13 2002-03-08 System and method of packaging a laser/detector

Publications (1)

Publication Number Publication Date
DE60212609D1 true DE60212609D1 (de) 2006-08-03

Family

ID=26957398

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60212609T Expired - Lifetime DE60212609D1 (de) 2001-03-13 2002-03-08 Laser-Detektor-Einheit und Verfahren zur Montage derselben

Country Status (6)

Country Link
US (1) US6577656B2 (de)
EP (1) EP1380079B1 (de)
AT (1) ATE331329T1 (de)
AU (1) AU2002252271A1 (de)
DE (1) DE60212609D1 (de)
WO (1) WO2002073755A2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4262937B2 (ja) * 2001-07-26 2009-05-13 シャープ株式会社 半導体レーザ装置
USD484105S1 (en) 2002-07-10 2003-12-23 Mitsubishi Denki Kabushiki Kaisha Optical module
USD505664S1 (en) * 2002-07-10 2005-05-31 Mitsubishi Denki Kabushiki Kaisha Optical package
USD483338S1 (en) 2002-07-10 2003-12-09 Mitsubishi Denki Kabushiki Kaisha Optical module
USD494147S1 (en) 2002-07-10 2004-08-10 Mitsubishi Denki Kabushiki Kaisha Optical module
US7061949B1 (en) * 2002-08-16 2006-06-13 Jds Uniphase Corporation Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
US7061025B2 (en) * 2003-03-10 2006-06-13 Mccolloch Lawrence R Optoelectronic device packaging assemblies and methods of making the same
KR100841210B1 (ko) * 2007-11-26 2008-06-24 김정수 경사거울의 후면 반사율이 조절된 티오형 레이저 다이오드 패키지 및 그 경사거울의 제작 방법
KR100871011B1 (ko) 2008-01-23 2008-11-27 김정수 파장 잠금 기능을 갖는 티오형 레이저 다이오드 패키지 및 그 패키지에 구비된 경사필터의 제작 방법
JP2011077456A (ja) * 2009-10-01 2011-04-14 Sumitomo Electric Ind Ltd 半導体光素子及び半導体光デバイス
US8456961B1 (en) 2011-03-22 2013-06-04 Western Digital (Fremont), Llc Systems and methods for mounting and aligning a laser in an electrically assisted magnetic recording assembly
US8518748B1 (en) 2011-06-29 2013-08-27 Western Digital (Fremont), Llc Method and system for providing a laser submount for an energy assisted magnetic recording head
US8288204B1 (en) 2011-08-30 2012-10-16 Western Digital (Fremont), Llc Methods for fabricating components with precise dimension control
US9475151B1 (en) 2012-10-30 2016-10-25 Western Digital (Fremont), Llc Method and apparatus for attaching a laser diode and a slider in an energy assisted magnetic recording head
JP2020009915A (ja) * 2018-07-09 2020-01-16 ウシオオプトセミコンダクター株式会社 半導体発光装置および半導体発光装置の製造方法
CN110783810B (zh) * 2019-10-23 2020-08-14 武汉东飞凌科技有限公司 同轴封装型边发射激光器的封帽同轴度定位方法
EP3965146B1 (de) 2020-09-03 2025-04-09 Schott Ag Sockel für eine elektronische komponente
EP3965145B1 (de) 2020-09-03 2025-04-16 Schott Ag Transistorsockel für optoelektronisches hochgeschwindigkeits-gehäuse
EP3965147A1 (de) * 2020-09-03 2022-03-09 Schott Ag Sockel für eine elektronische oder optoelektronische komponente und verfahren zu seiner herstellung
US20230176196A1 (en) * 2021-12-08 2023-06-08 Beijing Voyager Technology Co., Ltd. Submount for a transmitter of an optical sensing system including a pair of co-packaged laser bars
TWI841329B (zh) * 2023-03-30 2024-05-01 佳必琪國際股份有限公司 防水電連接裝置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0691296B2 (ja) 1987-03-31 1994-11-14 三菱電機株式会社 半導体レ−ザの組立方法
DE68912512T2 (de) * 1988-10-28 1994-05-26 Matsushita Electric Ind Co Ltd Halbleiterlaser-Vorrichtung.
JPH03274781A (ja) * 1990-03-23 1991-12-05 Rohm Co Ltd レーザダイオード
US5485479A (en) * 1990-11-07 1996-01-16 Fuji Electric Co., Ltd. Semiconductor laser device encapsulated in a transparent resin layer
JPH07170019A (ja) * 1993-12-14 1995-07-04 Fuji Electric Co Ltd 半導体レーザ装置
JP2695995B2 (ja) * 1991-01-14 1998-01-14 株式会社東芝 光半導体装置
US5367530A (en) * 1992-05-29 1994-11-22 Sanyo Electric Co., Ltd. Semiconductor laser apparatus
JPH0799368A (ja) * 1993-09-29 1995-04-11 Mitsubishi Electric Corp 光半導体装置
JPH07335980A (ja) * 1994-06-07 1995-12-22 Fuji Electric Co Ltd 半導体レーザ装置
US5764675A (en) * 1994-06-30 1998-06-09 Juhala; Roland E. Diode laser array
JP3082695B2 (ja) * 1997-01-16 2000-08-28 日本電気株式会社 半導体レーザ装置、その製造方法
GB2326760B (en) * 1997-06-28 2002-02-13 Mitel Semiconductor Ab Optical source with monitor

Also Published As

Publication number Publication date
WO2002073755A2 (en) 2002-09-19
AU2002252271A1 (en) 2002-09-24
US20020131460A1 (en) 2002-09-19
WO2002073755A3 (en) 2003-09-18
ATE331329T1 (de) 2006-07-15
EP1380079B1 (de) 2006-06-21
EP1380079A2 (de) 2004-01-14
US6577656B2 (en) 2003-06-10

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Legal Events

Date Code Title Description
8332 No legal effect for de