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DE60200906D1 - Latentes Vernetzungsmittel für Epoxidharze und härtbare Epoxidharzzusammensetzungen - Google Patents

Latentes Vernetzungsmittel für Epoxidharze und härtbare Epoxidharzzusammensetzungen

Info

Publication number
DE60200906D1
DE60200906D1 DE60200906T DE60200906T DE60200906D1 DE 60200906 D1 DE60200906 D1 DE 60200906D1 DE 60200906 T DE60200906 T DE 60200906T DE 60200906 T DE60200906 T DE 60200906T DE 60200906 D1 DE60200906 D1 DE 60200906D1
Authority
DE
Germany
Prior art keywords
crosslinking agent
resin compositions
epoxy resin
latent crosslinking
epoxy resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60200906T
Other languages
English (en)
Other versions
DE60200906T2 (de
Inventor
Hiroyasu Koto
Junji Ohashi
Hiroshi Sakamoto
Masato Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of DE60200906D1 publication Critical patent/DE60200906D1/de
Application granted granted Critical
Publication of DE60200906T2 publication Critical patent/DE60200906T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
DE60200906T 2001-05-16 2002-05-15 Latentes Vernetzungsmittel für Epoxidharze und härtbare Epoxidharzzusammensetzungen Expired - Lifetime DE60200906T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001145801A JP4752131B2 (ja) 2001-05-16 2001-05-16 エポキシ樹脂用潜在性硬化剤及び硬化性エポキシ樹脂組成物
JP2001145801 2001-05-16

Publications (2)

Publication Number Publication Date
DE60200906D1 true DE60200906D1 (de) 2004-09-16
DE60200906T2 DE60200906T2 (de) 2005-09-01

Family

ID=18991552

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60200906T Expired - Lifetime DE60200906T2 (de) 2001-05-16 2002-05-15 Latentes Vernetzungsmittel für Epoxidharze und härtbare Epoxidharzzusammensetzungen

Country Status (7)

Country Link
US (2) US20030004296A1 (de)
EP (1) EP1260532B1 (de)
JP (1) JP4752131B2 (de)
KR (1) KR100842719B1 (de)
CN (1) CN1239560C (de)
DE (1) DE60200906T2 (de)
TW (1) TWI242020B (de)

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* Cited by examiner, † Cited by third party
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KR100513406B1 (ko) * 2003-12-23 2005-09-09 삼성전자주식회사 반도체 시험장치
EP1674487B1 (de) * 2004-12-22 2016-06-29 Akzo Nobel Coatings International B.V. Wässerige Polymerdispersionen.
US20080063871A1 (en) * 2006-09-11 2008-03-13 Jung Ki S Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
US8198370B2 (en) * 2007-12-28 2012-06-12 E I Du Pont De Nemours And Company Coated substrate
JP5153597B2 (ja) * 2008-12-05 2013-02-27 リンテック株式会社 チップ用保護膜形成用シートおよび保護膜付半導体チップ
US9546243B2 (en) * 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
CN104387525B (zh) * 2014-12-05 2016-09-07 宁波南海化学有限公司 一种咪唑改性的共聚物及其制备方法和应用
CN104945599B (zh) * 2015-06-18 2017-03-01 常州大学 一种潜伏性环氧树脂固化‑发泡剂及其制备方法
TWI707946B (zh) * 2016-01-07 2020-10-21 日商積水化學工業股份有限公司 液晶顯示元件用密封劑、上下導通材料及液晶顯示元件
EP3263628A1 (de) * 2016-06-27 2018-01-03 Hexcel Composites Limited Partikelförmige härtungskomponenten
CN108034332A (zh) * 2017-12-28 2018-05-15 湖北楚禾新材料有限公司 一种水性钢结构防火涂料及其制备方法
KR102065784B1 (ko) * 2018-05-30 2020-01-14 주식회사 이원그린텍 무취의 2액형 에폭시수지 조성물
EP3830169B1 (de) * 2018-07-27 2025-04-16 Henkel AG & Co. KGaA Zweiteilige zusammensetzung auf epoxidbasis
EP3835383B1 (de) 2019-12-13 2023-04-12 Henkel AG & Co. KGaA Einkomponentige (1k) härtbare klebstoffzusammensetzung
EP4001339B1 (de) 2020-11-16 2024-01-24 Henkel AG & Co. KGaA Epoxidzusammensetzung mit einer epoxidverbindung auf biobasis
EP4332144B1 (de) 2022-09-05 2025-06-04 Henkel AG & Co. KGaA Einkomponentige (1k) härtbare klebstoffzusammensetzung
EP4474440A1 (de) 2023-06-06 2024-12-11 Henkel AG & Co. KGaA Ablösbares klebeband
EP4481913A1 (de) 2023-06-20 2024-12-25 Henkel AG & Co. KGaA Elektronikbaugruppe mit elektrochemisch ablösbaren komponenten
EP4566808A1 (de) 2023-12-06 2025-06-11 Henkel AG & Co. KGaA Verklebte struktur mit einem elektrochemisch ablösbaren klebstoff
CN118064030B (zh) * 2024-02-02 2025-12-05 武汉长弢新材料有限公司 一种可低温固化涂料及其制备与应用
EP4663713A1 (de) 2024-06-13 2025-12-17 Henkel AG & Co. KGaA Verklebte struktur mit thermisch ablösbarer klebefolie

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US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
US4068625A (en) * 1976-05-12 1978-01-17 Charles Lester Brown Engine intake air moisturizer
US4133790A (en) * 1976-12-20 1979-01-09 Desoto, Inc. Air drying thermosetting aqueous epoxy-acrylic copolymer coating systems
JPS6030348B2 (ja) * 1978-06-15 1985-07-16 東レ株式会社 塗料用組成物
US4268656A (en) * 1980-01-16 1981-05-19 National Starch And Chemical Corporation Co-curing agents for epoxy resins
JPS57100127A (en) * 1980-12-12 1982-06-22 Taoka Chem Co Ltd Curable composition
JPS56155222A (en) 1980-04-30 1981-12-01 Sumitomo Chem Co Ltd Curable composition
JPS57119921A (en) 1981-01-19 1982-07-26 Mitsui Toatsu Chem Inc Curable resin composition
JPS5953526A (ja) 1982-09-21 1984-03-28 Ajinomoto Co Inc エポキシ樹脂用潜在性硬化剤
JPS61111944A (ja) * 1984-10-31 1986-05-30 Nitto Electric Ind Co Ltd 光学ガラスフアイバ用被覆材料
JPS62146915A (ja) * 1985-12-20 1987-06-30 Asahi Denka Kogyo Kk 硬化性エポキシ樹脂組成物
GB8622998D0 (en) * 1986-09-24 1986-10-29 Ciba Geigy Ag Curable compositions
JPH01271421A (ja) * 1988-04-21 1989-10-30 Mitsui Petrochem Ind Ltd 制振材用組成物および制振材
JPH01278526A (ja) * 1988-04-28 1989-11-08 Somar Corp エポキシ樹脂組成物
GB8824391D0 (en) * 1988-10-18 1988-11-23 Ciba Geigy Ag Compositions
JP2712425B2 (ja) * 1988-11-22 1998-02-10 大日本インキ化学工業株式会社 硬化性樹脂組成物
JPH066621B2 (ja) * 1990-04-16 1994-01-26 富士化成工業株式会社 一成分系加熱硬化性エポキシド組成物
JP3270775B2 (ja) * 1992-01-24 2002-04-02 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 改良されたエポキシ樹脂用潜在性硬化剤及びその製造方法
JP3198159B2 (ja) 1992-07-03 2001-08-13 大日本塗料株式会社 被覆用組成物
US5480720A (en) * 1994-03-01 1996-01-02 Rohm And Haas Company Adhesive composition
JP3648765B2 (ja) * 1994-09-07 2005-05-18 味の素株式会社 エポキシ樹脂硬化性組成物
JP3918316B2 (ja) * 1998-09-04 2007-05-23 味の素株式会社 硬化性樹脂組成物
CA2269378C (en) * 1998-04-17 2008-04-01 Ajinomoto Co., Inc. Curable resin composition
JP4520003B2 (ja) * 2000-04-14 2010-08-04 株式会社カネカ 硬化性組成物

Also Published As

Publication number Publication date
US7226976B2 (en) 2007-06-05
EP1260532A1 (de) 2002-11-27
US20050187371A1 (en) 2005-08-25
CN1239560C (zh) 2006-02-01
DE60200906T2 (de) 2005-09-01
CN1388143A (zh) 2003-01-01
US20030004296A1 (en) 2003-01-02
TWI242020B (en) 2005-10-21
KR100842719B1 (ko) 2008-07-01
EP1260532B1 (de) 2004-08-11
JP2002338663A (ja) 2002-11-27
KR20020087874A (ko) 2002-11-23
JP4752131B2 (ja) 2011-08-17

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