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DE602007002230D1 - Gekapseltes Mikrobauteil mit mindestens einem Getter - Google Patents

Gekapseltes Mikrobauteil mit mindestens einem Getter

Info

Publication number
DE602007002230D1
DE602007002230D1 DE602007002230T DE602007002230T DE602007002230D1 DE 602007002230 D1 DE602007002230 D1 DE 602007002230D1 DE 602007002230 T DE602007002230 T DE 602007002230T DE 602007002230 T DE602007002230 T DE 602007002230T DE 602007002230 D1 DE602007002230 D1 DE 602007002230D1
Authority
DE
Germany
Prior art keywords
getter
microcomponent
encapsulated
encapsulated microcomponent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007002230T
Other languages
English (en)
Inventor
Jean-Louis Pornin
Charlotte Gillot
Francois Baleras
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE602007002230D1 publication Critical patent/DE602007002230D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
DE602007002230T 2006-07-13 2007-07-11 Gekapseltes Mikrobauteil mit mindestens einem Getter Active DE602007002230D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0652978A FR2903678B1 (fr) 2006-07-13 2006-07-13 Microcomposant encapsule equipe d'au moins un getter

Publications (1)

Publication Number Publication Date
DE602007002230D1 true DE602007002230D1 (de) 2009-10-15

Family

ID=37776793

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007002230T Active DE602007002230D1 (de) 2006-07-13 2007-07-11 Gekapseltes Mikrobauteil mit mindestens einem Getter

Country Status (5)

Country Link
US (1) US7786561B2 (de)
EP (1) EP1878693B1 (de)
JP (1) JP5452849B2 (de)
DE (1) DE602007002230D1 (de)
FR (1) FR2903678B1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8159056B1 (en) * 2008-01-15 2012-04-17 Rf Micro Devices, Inc. Package for an electronic device
US8481365B2 (en) * 2008-05-28 2013-07-09 Nxp B.V. MEMS devices
FR2933390B1 (fr) * 2008-07-01 2010-09-03 Commissariat Energie Atomique Procede d'encapsulation d'un dispositif microelectronique par un materiau getter
WO2010010721A1 (ja) * 2008-07-25 2010-01-28 日本電気株式会社 封止パッケージ、プリント回路基板、電子機器及び封止パッケージの製造方法
FR2940588B1 (fr) * 2008-12-19 2011-01-07 St Microelectronics Grenoble Ensemble multicomposant blinde a montage en surface
DE102009004724A1 (de) * 2009-01-15 2010-07-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil
FR2947812B1 (fr) 2009-07-07 2012-02-10 Commissariat Energie Atomique Cavite etanche et procede de realisation d'une telle cavite etanche
JP5816624B2 (ja) * 2009-08-24 2015-11-18 キャベンディッシュ・キネティックス・インコーポレイテッドＣａｖｅｎｄｉｓｈ Ｋｉｎｅｔｉｃｓ， Ｉｎｃ． 光変調用浮動ロッカーｍｅｍｓデバイスの製造方法
FR2950972A1 (fr) * 2009-10-02 2011-04-08 Commissariat Energie Atomique Procede et cellule de mesure de la concentration globale en ions d'un fluide corporel
US8748206B2 (en) * 2010-11-23 2014-06-10 Honeywell International Inc. Systems and methods for a four-layer chip-scale MEMS device
US9171964B2 (en) * 2010-11-23 2015-10-27 Honeywell International Inc. Systems and methods for a three-layer chip-scale MEMS device
FR2976436B1 (fr) * 2011-06-09 2013-07-05 Commissariat Energie Atomique Dispositif d'imagerie infrarouge a blindage integre contre des rayonnements infrarouges parasites et procede de fabrication du dispositif.
FR2980034B1 (fr) * 2011-09-08 2014-07-04 Commissariat Energie Atomique Procede de realisation d'une structure a cavite fermee hermetiquement et sous atmosphere controlee
FR2981059A1 (fr) 2011-10-11 2013-04-12 Commissariat Energie Atomique Procede d'encapsulation de micro-dispositif par report de capot et depot de getter a travers le capot
FR2981198B1 (fr) 2011-10-11 2014-04-04 Commissariat Energie Atomique Structure d'encapsulation de dispositif electronique et procede de realisation d'une telle structure
FR2982073B1 (fr) 2011-10-28 2014-10-10 Commissariat Energie Atomique Structure d'encapsulation hermetique d'un dispositif et d'un composant electronique
JP5576542B1 (ja) * 2013-08-09 2014-08-20 太陽誘電株式会社 回路モジュール及び回路モジュールの製造方法
US9718672B2 (en) * 2015-05-27 2017-08-01 Globalfoundries Singapore Pte. Ltd. Electronic devices including substantially hermetically sealed cavities and getter films with Kelvin measurement arrangement for evaluating the getter films and methods for fabricating the same
US9567208B1 (en) * 2015-11-06 2017-02-14 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and method for fabricating the same
DE102017210459A1 (de) * 2017-06-22 2018-12-27 Robert Bosch Gmbh Mikromechanische Vorrichtung mit einer ersten Kaverne und einer zweiten Kaverne
JP7247730B2 (ja) * 2019-04-23 2023-03-29 三菱電機株式会社 電子モジュール
CN111792621B (zh) * 2020-07-06 2024-04-16 中国科学院上海微系统与信息技术研究所 一种圆片级薄膜封装方法及封装器件
CN116022720A (zh) * 2021-10-27 2023-04-28 上海新微技术研发中心有限公司 复合吸气剂薄膜结构

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3324395B2 (ja) * 1995-10-31 2002-09-17 富士電機株式会社 電界型真空管とそれを用いた圧力センサ、加速度センサおよびそれらの製造方法
JPH09148467A (ja) * 1995-11-24 1997-06-06 Murata Mfg Co Ltd 動作素子の真空封止の構造およびその製造方法
JP3716501B2 (ja) * 1996-07-04 2005-11-16 双葉電子工業株式会社 真空気密容器の製造方法
ATE340761T1 (de) * 1999-12-15 2006-10-15 Asulab Sa Hermetische in-situ-gehäusungsmethode von mikrosystemen
IT1318937B1 (it) 2000-09-27 2003-09-19 Getters Spa Metodo per la produzione di dispositivi getter porosi con ridottaperdita di particelle e dispositivi cosi' prodotti
US6992375B2 (en) * 2000-11-30 2006-01-31 Texas Instruments Incorporated Anchor for device package
JP3991689B2 (ja) * 2002-01-28 2007-10-17 松下電器産業株式会社 ガス放電型表示パネル
JP3853234B2 (ja) * 2002-03-05 2006-12-06 三菱電機株式会社 赤外線検出器
US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
US7429495B2 (en) * 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
US20050250253A1 (en) * 2002-10-23 2005-11-10 Cheung Kin P Processes for hermetically packaging wafer level microscopic structures
ITMI20030069A1 (it) 2003-01-17 2004-07-18 Getters Spa Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato.
ITMI20032209A1 (it) * 2003-11-14 2005-05-15 Getters Spa Processo per la produzione di dispositivi che richiedono per il loro funzionamento un materiale getter non evaporabile.
FR2864341B1 (fr) * 2003-12-19 2006-03-24 Commissariat Energie Atomique Microcomposant a cavite hermetique comportant un bouchon et procede de fabrication d'un tel microcomposant
JP2006088088A (ja) * 2004-09-27 2006-04-06 Nissan Motor Co Ltd ガス吸着素子とこれを用いた赤外線センサ
US8043880B2 (en) * 2005-07-28 2011-10-25 Hewlett-Packard Development, L.P. Microelectronic device
JP5139673B2 (ja) * 2005-12-22 2013-02-06 セイコーインスツル株式会社 三次元配線及びその製造方法、力学量センサ及びその製造方法

Also Published As

Publication number Publication date
EP1878693B1 (de) 2009-09-02
JP5452849B2 (ja) 2014-03-26
FR2903678A1 (fr) 2008-01-18
FR2903678B1 (fr) 2008-10-24
US7786561B2 (en) 2010-08-31
EP1878693A1 (de) 2008-01-16
US20080049386A1 (en) 2008-02-28
JP2008072091A (ja) 2008-03-27

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