DE602006018976D1 - Verfahren zum abtrennen von hochtemperaturfilmen und/oder vorrichtungen von metallsubstraten - Google Patents
Verfahren zum abtrennen von hochtemperaturfilmen und/oder vorrichtungen von metallsubstratenInfo
- Publication number
- DE602006018976D1 DE602006018976D1 DE200660018976 DE602006018976T DE602006018976D1 DE 602006018976 D1 DE602006018976 D1 DE 602006018976D1 DE 200660018976 DE200660018976 DE 200660018976 DE 602006018976 T DE602006018976 T DE 602006018976T DE 602006018976 D1 DE602006018976 D1 DE 602006018976D1
- Authority
- DE
- Germany
- Prior art keywords
- metallic substrate
- polymeric film
- devices
- metal substrates
- removing high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 229920000734 polysilsesquioxane polymer Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C3/00—Selection of compositions for coating the surfaces of moulds, cores, or patterns
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49227—Insulator making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
- Formation Of Insulating Films (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US72170805P | 2005-09-29 | 2005-09-29 | |
| PCT/US2006/033548 WO2007040870A1 (en) | 2005-09-29 | 2006-08-30 | Method of releasing high temperature films and/or devices from metallic substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE602006018976D1 true DE602006018976D1 (de) | 2011-01-27 |
Family
ID=37496438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200660018976 Active DE602006018976D1 (de) | 2005-09-29 | 2006-08-30 | Verfahren zum abtrennen von hochtemperaturfilmen und/oder vorrichtungen von metallsubstraten |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US8356407B2 (de) |
| EP (1) | EP1940989B1 (de) |
| JP (1) | JP2009510216A (de) |
| KR (1) | KR101285575B1 (de) |
| CN (1) | CN101278025A (de) |
| AT (1) | ATE491762T1 (de) |
| DE (1) | DE602006018976D1 (de) |
| TW (1) | TWI404221B (de) |
| WO (1) | WO2007040870A1 (de) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7612143B2 (en) * | 1999-08-04 | 2009-11-03 | Hybrid Plastics, Inc. | Metallized nanostructured chemicals alloyed into polymers |
| US7737228B2 (en) * | 2003-12-18 | 2010-06-15 | Hybrid Plastics, Inc. | Metallized polyhedral oligomeric silsesquioxanes as catalysts for polyurethanes |
| JP5313478B2 (ja) * | 2007-10-05 | 2013-10-09 | 東レ・ダウコーニング株式会社 | セラミック状酸化ケイ素系被膜の形成方法、セラミック状酸化ケイ素系被膜を有する無機質基材の製造方法、セラミック状酸化ケイ素系被膜形成剤および半導体装置 |
| WO2009099484A1 (en) | 2008-01-30 | 2009-08-13 | Dow Corning Corporation | The use of glassy silicone-based hard coating as release coatings for printable electronics |
| US9336925B1 (en) * | 2008-11-26 | 2016-05-10 | Thin Film Electronics Asa | Siloxanes, doped siloxanes, methods for their synthesis, compositions containing the same, and films formed therefrom |
| JP5337572B2 (ja) * | 2009-04-30 | 2013-11-06 | 日東電工株式会社 | 積層体およびそれを用いた配線回路基板 |
| KR101079650B1 (ko) | 2009-05-21 | 2011-11-03 | 주식회사 엠에스하이텍 | 반도체 리젝트 다이로부터 합성수지 필름을 제거하는 방법 |
| WO2011142804A1 (en) * | 2010-05-10 | 2011-11-17 | The University Of Toledo | Flexible photovoltaic cells and modules having an improved adhesion characteristic |
| WO2011150290A2 (en) | 2010-05-26 | 2011-12-01 | The University Of Toledo | Photovoltaic structures having a light scattering interface layer and methods of making the same |
| CN101968127B (zh) * | 2010-09-17 | 2012-05-30 | 北京海林节能设备股份有限公司 | 集水器 |
| US8871425B2 (en) * | 2012-02-09 | 2014-10-28 | Az Electronic Materials (Luxembourg) S.A.R.L. | Low dielectric photoimageable compositions and electronic devices made therefrom |
| JP2015104843A (ja) * | 2013-11-29 | 2015-06-08 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 積層体とその製造方法、及び該積層体を用いた電子デバイスの製造方法 |
| KR101844204B1 (ko) * | 2014-12-03 | 2018-03-30 | 도오꾜오까고오교 가부시끼가이샤 | 적층체의 제조 방법, 기판의 처리 방법 및 적층체 |
| CN105118893A (zh) * | 2015-08-31 | 2015-12-02 | 苏州瑞晟纳米科技有限公司 | 一种微晶玻璃覆盖柔性薄膜太阳能电池样片的热处理方法 |
| DE102015015452A1 (de) * | 2015-12-02 | 2017-06-08 | Forschungszentrum Jülich GmbH | Verfahren zum Planarisieren von Nanostrukturen |
| TW201806779A (zh) | 2016-05-16 | 2018-03-01 | 道康寧公司 | 用於顯示裝置基板處理之包括矽倍半氧烷聚合物及矽烷中至少一者的黏合劑剝離層 |
| CN106009016A (zh) * | 2016-08-11 | 2016-10-12 | 潘忠宁 | 一种单分散聚倍半硅氧烷球形薄膜制备方法 |
| CN117021715A (zh) * | 2018-01-17 | 2023-11-10 | Agc株式会社 | 层叠体、层叠体的制造方法和电子设备的制造方法 |
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| WO2009099484A1 (en) | 2008-01-30 | 2009-08-13 | Dow Corning Corporation | The use of glassy silicone-based hard coating as release coatings for printable electronics |
| US7838332B2 (en) * | 2008-11-26 | 2010-11-23 | Infineon Technologies Ag | Method of manufacturing a semiconductor package with a bump using a carrier |
-
2006
- 2006-08-30 DE DE200660018976 patent/DE602006018976D1/de active Active
- 2006-08-30 US US11/991,831 patent/US8356407B2/en not_active Expired - Fee Related
- 2006-08-30 WO PCT/US2006/033548 patent/WO2007040870A1/en not_active Ceased
- 2006-08-30 CN CNA2006800360886A patent/CN101278025A/zh active Pending
- 2006-08-30 EP EP20060802491 patent/EP1940989B1/de not_active Not-in-force
- 2006-08-30 JP JP2008533362A patent/JP2009510216A/ja active Pending
- 2006-08-30 AT AT06802491T patent/ATE491762T1/de not_active IP Right Cessation
- 2006-08-30 KR KR1020087007670A patent/KR101285575B1/ko not_active Expired - Fee Related
- 2006-09-15 TW TW95134153A patent/TWI404221B/zh not_active IP Right Cessation
-
2012
- 2012-12-12 US US13/711,780 patent/US20130108501A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| ATE491762T1 (de) | 2011-01-15 |
| EP1940989B1 (de) | 2010-12-15 |
| US8356407B2 (en) | 2013-01-22 |
| TW200721524A (en) | 2007-06-01 |
| TWI404221B (zh) | 2013-08-01 |
| KR101285575B1 (ko) | 2013-07-15 |
| US20090098393A1 (en) | 2009-04-16 |
| JP2009510216A (ja) | 2009-03-12 |
| EP1940989A1 (de) | 2008-07-09 |
| US20130108501A1 (en) | 2013-05-02 |
| KR20080063761A (ko) | 2008-07-07 |
| CN101278025A (zh) | 2008-10-01 |
| WO2007040870A1 (en) | 2007-04-12 |
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