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DE602005020005D1 - Induktive Anordnung - Google Patents

Induktive Anordnung

Info

Publication number
DE602005020005D1
DE602005020005D1 DE602005020005T DE602005020005T DE602005020005D1 DE 602005020005 D1 DE602005020005 D1 DE 602005020005D1 DE 602005020005 T DE602005020005 T DE 602005020005T DE 602005020005 T DE602005020005 T DE 602005020005T DE 602005020005 D1 DE602005020005 D1 DE 602005020005D1
Authority
DE
Germany
Prior art keywords
inductive arrangement
inductive
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602005020005T
Other languages
English (en)
Inventor
Giancarlo Ripamonti
Paolo Pulici
Gian Pietro Vanalli
Tito Lessio
Pier Paolo Stoppino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Publication of DE602005020005D1 publication Critical patent/DE602005020005D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H10W44/501—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H10W72/536—
    • H10W72/5473—
    • H10W74/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
DE602005020005T 2005-09-09 2005-09-09 Induktive Anordnung Expired - Lifetime DE602005020005D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05425635A EP1763043B1 (de) 2005-09-09 2005-09-09 Induktive Anordnung

Publications (1)

Publication Number Publication Date
DE602005020005D1 true DE602005020005D1 (de) 2010-04-29

Family

ID=35717593

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005020005T Expired - Lifetime DE602005020005D1 (de) 2005-09-09 2005-09-09 Induktive Anordnung

Country Status (3)

Country Link
US (1) US20070062027A1 (de)
EP (1) EP1763043B1 (de)
DE (1) DE602005020005D1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601412B2 (en) * 2007-06-08 2017-03-21 Cyntec Co., Ltd. Three-dimensional package structure
US8115567B2 (en) * 2007-12-13 2012-02-14 Broadcom Corporation Method and system for matching networks embedded in an integrated circuit package
US7859360B2 (en) * 2007-12-13 2010-12-28 Broadcom Corporation Method and system for controlling MEMS switches in an integrated circuit package
US8384500B2 (en) 2007-12-13 2013-02-26 Broadcom Corporation Method and system for MEMS switches fabricated in an integrated circuit package
US20090153281A1 (en) * 2007-12-13 2009-06-18 Ahmadreza Rofougaran Method and system for an integrated circuit package with ferri/ferromagnetic layers
US8134425B2 (en) * 2007-12-13 2012-03-13 Broadcom Corporation Method and system for filters embedded in an integrated circuit package
US7859359B2 (en) * 2008-02-25 2010-12-28 Broadcom Corporation Method and system for a balun embedded in an integrated circuit package
US7863998B2 (en) * 2008-02-25 2011-01-04 Broadcom Corporation Method and system for processing signals via directional couplers embedded in an integrated circuit package
US20090219908A1 (en) * 2008-02-29 2009-09-03 Ahmadreza Rofougaran Method and system for processing signals via diplexers embedded in an integrated circuit package
WO2009118694A1 (en) * 2008-03-25 2009-10-01 Nxp B.V. Integrated 3d high density and high quality inductive element
US7982555B2 (en) 2008-03-28 2011-07-19 Broadcom Corporation Method and system for processing signals via power splitters embedded in an integrated circuit package
US8269344B2 (en) * 2008-03-28 2012-09-18 Broadcom Corporation Method and system for inter-chip communication via integrated circuit package waveguides
US20090309683A1 (en) * 2008-06-16 2009-12-17 Cochran William T Sensor inductors, sensors for monitoring movements and positioning, apparatus, systems and methods therefore
US8450846B2 (en) * 2008-06-19 2013-05-28 Broadcom Corporation Method and system for communicating via flip-chip die and package waveguides
US8384596B2 (en) * 2008-06-19 2013-02-26 Broadcom Corporation Method and system for inter-chip communication via integrated circuit package antennas
US8238842B2 (en) * 2009-03-03 2012-08-07 Broadcom Corporation Method and system for an on-chip and/or an on-package transmit/receive switch and antenna
US8521106B2 (en) * 2009-06-09 2013-08-27 Broadcom Corporation Method and system for a sub-harmonic transmitter utilizing a leaky wave antenna
US20140347157A1 (en) * 2011-08-16 2014-11-27 Georgia Tech Research Corporation Magnetic device utilizing nanocomposite films layered with adhesives
AU2013208273B2 (en) 2012-01-10 2015-11-26 Hzo, Inc. Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture
US9146207B2 (en) * 2012-01-10 2015-09-29 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture
WO2014110159A1 (en) 2013-01-08 2014-07-17 Hzo, Inc. Apparatuses, systems, and methods for detecting and reacting to exposure of an electronic device to moisture
US9177925B2 (en) * 2013-04-18 2015-11-03 Fairfchild Semiconductor Corporation Apparatus related to an improved package including a semiconductor die
DE102015000317A1 (de) 2014-01-10 2015-07-16 Fairchild Semiconductor Corporation Isolierung zwischen Halbleiterkomponenten
WO2018099078A1 (zh) * 2016-12-01 2018-06-07 中山市科彼特自动化设备有限公司 一种全自动磁环绕线机
US10930604B2 (en) 2018-03-29 2021-02-23 Semiconductor Components Industries, Llc Ultra-thin multichip power devices
CN109976597B (zh) * 2019-04-11 2022-04-22 业成科技（成都）有限公司 触控模组及其制造方法
FR3130445B1 (fr) * 2021-12-14 2024-12-13 St Microelectronics Grenoble 2 Composant inductif et procédé de fabrication

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4825166A (en) * 1987-01-27 1989-04-25 Sundstrand Data Control, Inc. Bobbin for a magnetic sensor
US5793272A (en) * 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
KR100530871B1 (ko) 1998-08-14 2006-06-16 이해영 본딩와이어인덕터와그것을이용한본딩와이어인덕터배열구조,칩인덕터,커플러및변압기
US6249039B1 (en) * 1998-09-10 2001-06-19 Bourns, Inc. Integrated inductive components and method of fabricating such components
US6240622B1 (en) * 1999-07-09 2001-06-05 Micron Technology, Inc. Integrated circuit inductors
US6765467B2 (en) * 2001-04-25 2004-07-20 Dung A. Ngo Core support assembly for large wound transformer cores
US6696910B2 (en) * 2001-07-12 2004-02-24 Custom One Design, Inc. Planar inductors and method of manufacturing thereof
US6744114B2 (en) * 2001-08-29 2004-06-01 Honeywell International Inc. Package with integrated inductor and/or capacitor
US7005955B2 (en) * 2003-04-23 2006-02-28 Hewlett-Packard Development Company, L.P. Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board
US6998952B2 (en) * 2003-12-05 2006-02-14 Freescale Semiconductor, Inc. Inductive device including bond wires
US7745918B1 (en) * 2004-11-24 2010-06-29 Amkor Technology, Inc. Package in package (PiP)

Also Published As

Publication number Publication date
EP1763043A1 (de) 2007-03-14
EP1763043B1 (de) 2010-03-17
US20070062027A1 (en) 2007-03-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition