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DE602005006569D1 - Abgeschirmter Zwischenraum zur Montage eines Hochfrequenz-Radarbauteils auf eine Leiterplatte - Google Patents

Abgeschirmter Zwischenraum zur Montage eines Hochfrequenz-Radarbauteils auf eine Leiterplatte

Info

Publication number
DE602005006569D1
DE602005006569D1 DE602005006569T DE602005006569T DE602005006569D1 DE 602005006569 D1 DE602005006569 D1 DE 602005006569D1 DE 602005006569 T DE602005006569 T DE 602005006569T DE 602005006569 T DE602005006569 T DE 602005006569T DE 602005006569 D1 DE602005006569 D1 DE 602005006569D1
Authority
DE
Germany
Prior art keywords
mounting
circuit board
printed circuit
shielded space
frequency radar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005006569T
Other languages
English (en)
Inventor
Michael Dolson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Canada Ltd
Original Assignee
Siemens Milltronics Process Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Milltronics Process Instruments Inc filed Critical Siemens Milltronics Process Instruments Inc
Publication of DE602005006569D1 publication Critical patent/DE602005006569D1/de
Anticipated expiration legal-status Critical
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE602005006569T 2005-09-28 2005-09-28 Abgeschirmter Zwischenraum zur Montage eines Hochfrequenz-Radarbauteils auf eine Leiterplatte Active DE602005006569D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05021185A EP1771056B1 (de) 2005-09-28 2005-09-28 Abgeschirmter Zwischenraum zur Montage eines Hochfrequenz-Radarbauteils auf eine Leiterplatte

Publications (1)

Publication Number Publication Date
DE602005006569D1 true DE602005006569D1 (de) 2008-06-19

Family

ID=35219347

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005006569T Active DE602005006569D1 (de) 2005-09-28 2005-09-28 Abgeschirmter Zwischenraum zur Montage eines Hochfrequenz-Radarbauteils auf eine Leiterplatte

Country Status (3)

Country Link
US (1) US7564399B2 (de)
EP (1) EP1771056B1 (de)
DE (1) DE602005006569D1 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63204914A (ja) * 1987-02-20 1988-08-24 Matsushita Electric Ind Co Ltd 高周波高出力増幅器
US5392051A (en) * 1992-09-11 1995-02-21 Honda Giken Kogyo Kabushiki Kaisha High-frequency signal generator
JPH08138847A (ja) * 1994-11-16 1996-05-31 Hitachi Home Tec Ltd 誘導加熱式調理器
US6163455A (en) * 1999-01-11 2000-12-19 Intel Corporation Thermal attachment bracket for mini cartridge package technology
CN1244969C (zh) * 2001-01-19 2006-03-08 松下电器产业株式会社 高频电路元件及高频电路模块
US7298235B2 (en) * 2004-01-13 2007-11-20 Raytheon Company Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces

Also Published As

Publication number Publication date
EP1771056A1 (de) 2007-04-04
US7564399B2 (en) 2009-07-21
US20070103361A1 (en) 2007-05-10
EP1771056B1 (de) 2008-05-07

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