DE602004031701D1 - Sprühbares Klebematerial zur Lasermarkierung von Halbleiterscheiben, Chips und Vorrichtungen - Google Patents

Sprühbares Klebematerial zur Lasermarkierung von Halbleiterscheiben, Chips und Vorrichtungen

Info

Publication number: DE602004031701D1
Authority: DE; Germany
Prior art keywords: chips; devices; adhesive material; semiconductor wafers; laser marking
Prior art date: 2003-10-15
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE602004031701T

Other languages

English (en)

Inventor

Xiping He

Torey Tomaso

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Henkel AG and Co KGaA

Original Assignee

Henkel AG and Co KGaA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-10-15

Filing date

2004-10-14

Publication date

2011-04-21

2004-10-14 Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA

2011-04-21 Publication of DE602004031701D1 publication Critical patent/DE602004031701D1/de

2024-10-15 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- H10W46/00—
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H10W46/601—

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Inorganic Chemistry (AREA)
Adhesives Or Adhesive Processes (AREA)

DE602004031701T 2003-10-15 2004-10-14 Sprühbares Klebematerial zur Lasermarkierung von Halbleiterscheiben, Chips und Vorrichtungen Expired - Lifetime DE602004031701D1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US10/685,818 US7186945B2 (en)	2003-10-15	2003-10-15	Sprayable adhesive material for laser marking semiconductor wafers and dies

Publications (1)

Publication Number	Publication Date
DE602004031701D1 true DE602004031701D1 (de)	2011-04-21

Family

ID=34377628

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE602004031701T Expired - Lifetime DE602004031701D1 (de)	2003-10-15	2004-10-14	Sprühbares Klebematerial zur Lasermarkierung von Halbleiterscheiben, Chips und Vorrichtungen

Country Status (7)

Country	Link
US (1)	US7186945B2 (de)
EP (1)	EP1524306B1 (de)
JP (1)	JP4875294B2 (de)
KR (1)	KR101112527B1 (de)
CN (1)	CN100430451C (de)
DE (1)	DE602004031701D1 (de)
TW (1)	TWI367245B (de)

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US20070212551A1 (en) *	2006-03-10	2007-09-13	Andrew Collins	Adhesive composition
US7422707B2 (en) *	2007-01-10	2008-09-09	National Starch And Chemical Investment Holding Corporation	Highly conductive composition for wafer coating
JP5422921B2 (ja) *	2008-05-28	2014-02-19	デクセリアルズ株式会社	接着フィルム
JP5372665B2 (ja) *	2009-08-31	2013-12-18	株式会社日立メディアエレクトロニクス	光硬化型接着剤、光ピックアップ装置及びその製造方法
CN102133776A (zh) *	2010-12-31	2011-07-27	常州天合光能有限公司	一种多晶铸锭的线切割方法
DE102014113323A1 (de) *	2014-09-16	2016-03-17	BMA Automation GmbH	Verfahren und Vorrichtung zur Entfernung einer Kunststoffbeschichtung von einem Lebensmittellaib
BR112017010453A2 (pt)	2014-11-18	2017-12-26	3M Innovative Properties Co	composição adesiva com mudança de cor
US10020264B2 (en)	2015-04-28	2018-07-10	Infineon Technologies Ag	Integrated circuit substrate and method for manufacturing the same
CN105259859B (zh) *	2015-10-14	2018-03-13	上海哥瑞利软件有限公司	基于视觉设备改造塑封设备识别模拟编号方法及设备
US9774919B2 (en) *	2015-12-04	2017-09-26	Verizon Patent And Licensing Inc.	Automated suggestions and corrections of content clips
JP6495214B2 (ja) *	2016-09-23	2019-04-03	株式会社タムラ製作所	感光性樹脂組成物
EP3483231A1 (de)	2017-11-14	2019-05-15	3M Innovative Properties Company	Farbverändernde zusammensetzung
US12128442B2 (en)	2020-04-10	2024-10-29	S+S Industries Technology Llc	Coated fluid handling components and methods for protecting and extending the service life of fluid handling components
CN112289700A (zh) *	2020-12-08	2021-01-29	西安奕斯伟硅片技术有限公司	一种硅片检测方法

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US4344006A (en)	1980-03-28	1982-08-10	Westinghouse Electric Corp.	Epoxy-elastomer low temperature curable, solventless, sprayable, stator winding adhesive-bracing compositions
US4298656A (en) *	1980-03-28	1981-11-03	Westinghouse Electric Corp.	Epoxy-elastomer low temperature curable, solventless, sprayable, stator winding adhesive-bracing compositions
JPS59175751A (ja) *	1983-03-26	1984-10-04	Mitsubishi Electric Corp	樹脂封止形半導体装置
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JPH07304251A (ja) *	1994-05-12	1995-11-21	Konica Corp	画像形成方法及びそれに用いる記録材料
JP2830756B2 (ja) *	1994-11-10	1998-12-02	株式会社デンソー	レーザマーキング方法
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US6432796B1 (en) *	2000-06-28	2002-08-13	Micron Technology, Inc.	Method and apparatus for marking microelectronic dies and microelectronic devices
US6824849B2 (en) *	2000-08-07	2004-11-30	3M Innovative Properties Company	Laser-cuttable multi-layer sheet material
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JP2002124603A (ja) *	2000-10-18	2002-04-26	Mitsubishi Electric Corp	エポキシ樹脂組成物、半導体装置およびレーザマークの視認性の判断方法
JP4254248B2 (ja) *	2002-04-05	2009-04-15	株式会社村田製作所	電子装置

2003
- 2003-10-15 US US10/685,818 patent/US7186945B2/en not_active Expired - Lifetime
2004
- 2004-10-14 KR KR1020040082233A patent/KR101112527B1/ko not_active Expired - Fee Related
- 2004-10-14 DE DE602004031701T patent/DE602004031701D1/de not_active Expired - Lifetime
- 2004-10-14 TW TW093131069A patent/TWI367245B/zh not_active IP Right Cessation
- 2004-10-14 EP EP04024487A patent/EP1524306B1/de not_active Expired - Lifetime
- 2004-10-15 JP JP2004301706A patent/JP4875294B2/ja not_active Expired - Fee Related
- 2004-10-15 CN CNB2004100951198A patent/CN100430451C/zh not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CN100430451C (zh)	2008-11-05
TWI367245B (en)	2012-07-01
JP4875294B2 (ja)	2012-02-15
US7186945B2 (en)	2007-03-06
KR20050036782A (ko)	2005-04-20
TW200530356A (en)	2005-09-16
KR101112527B1 (ko)	2012-02-15
CN1629242A (zh)	2005-06-22
EP1524306A1 (de)	2005-04-20
EP1524306B1 (de)	2011-03-09
US20050082338A1 (en)	2005-04-21
JP2005120381A (ja)	2005-05-12

Publication	Publication Date	Title
DE60238361D1 (de)	2010-12-30	Halbleitersubstratschablone
DE602004031701D1 (de)	2011-04-21	Sprühbares Klebematerial zur Lasermarkierung von Halbleiterscheiben, Chips und Vorrichtungen
DE60319898D1 (de)	2008-05-08	Halbleiter-Bauelement und Herstellungsverfahren
DE602004024451D1 (de)	2010-01-14	Halbleiterlaser-bauelement und laserprojektor
EP1576655A4 (de)	2010-05-05	Stabilisierte halbleiternanokristalle
DE50214662D1 (de)	2010-10-28	Strahlungsemittierender halbleiterchip, verfahren zu dessen herstellung und strahlungsemittierendes bauelement
DE10397015A5 (de)	2015-05-28	Biosensor, Biosensorchip und Biosensoreinrichtung
DE10216633B8 (de)	2012-02-02	Halbleiteranordnung und Verfahren zur Herstellung der Halbleiteranordnung
DE60225375D1 (de)	2008-04-17	Druckempfindlicher Klebebogen zur Bearbeitung von Halbleiter-Wafers
DE60224957D1 (de)	2008-03-27	Harzzusammensetzung zur Einkapselung von Halbleitern und diese enthaltende Halbleiteranordnungen
ITMO20030057A0 (it)	2003-03-04	Dispositivo per la confezione,la miscelazione e l'applicazione di cemento osseo.
DE10238843B8 (de)	2008-01-03	Halbleiterbauelement
DE60322001D1 (de)	2008-08-21	Halbleiterchip-Testsystem und entsprechendes Testverfahren
DE50306271D1 (de)	2007-02-22	Halbleiterlaservorrichtung
ITMO20020050A1 (it)	2003-08-28	Dispositivo per la depalletizzazione di pacchi di piastrelle
DE50213650D1 (de)	2009-08-13	Einrichtung zur Herstellung von Stapelpaketen
DE60332140D1 (de)	2010-05-27	Halbleiterlaserbauelement und dessen herstellungsverfahren
DE60225790D1 (de)	2008-05-08	Halbleiterbauelement
DE60302916D1 (de)	2006-02-02	Halbleiterlaser und Herstellungsverfahren
DE60328501D1 (de)	2009-09-03	Diborideinkristallsubstrat, halbleitervorrichtung damit und herstellungsverfahren dafür
DE60327426D1 (de)	2009-06-10	Markierung von substraten
DE60313118D1 (de)	2007-05-24	Halbleiterschaltkreis zur Entschlüsselung
DE60318643D1 (de)	2008-03-06	Halbleiter-Bauelement und Herstellungsverfahren
DE60327115D1 (de)	2009-05-20	Halbleiterbauelement
TW200731373A (en)	2007-08-16	Semiconductor chip and cut-out method therefor