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DE602004006639D1 - Verfahren zur herstellung einer elektrostatischen mems-einspannvorrichtung - Google Patents

Verfahren zur herstellung einer elektrostatischen mems-einspannvorrichtung

Info

Publication number
DE602004006639D1
DE602004006639D1 DE602004006639T DE602004006639T DE602004006639D1 DE 602004006639 D1 DE602004006639 D1 DE 602004006639D1 DE 602004006639 T DE602004006639 T DE 602004006639T DE 602004006639 T DE602004006639 T DE 602004006639T DE 602004006639 D1 DE602004006639 D1 DE 602004006639D1
Authority
DE
Germany
Prior art keywords
producing
clamping device
electrostatic mems
mems
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004006639T
Other languages
English (en)
Other versions
DE602004006639T2 (de
Inventor
Peter Kellerman
Shu Qin
Ernie Allen
Douglas Brown
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of DE602004006639D1 publication Critical patent/DE602004006639D1/de
Application granted granted Critical
Publication of DE602004006639T2 publication Critical patent/DE602004006639T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10P72/76—
    • H10P72/722—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
DE602004006639T 2003-10-28 2004-10-28 Verfahren zur herstellung einer elektrostatischen mems-einspannvorrichtung Expired - Lifetime DE602004006639T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US695153 1991-05-03
US10/695,153 US6946403B2 (en) 2003-10-28 2003-10-28 Method of making a MEMS electrostatic chuck
PCT/US2004/035891 WO2005045921A1 (en) 2003-10-28 2004-10-28 Method of making a mems electrostatic chuck

Publications (2)

Publication Number Publication Date
DE602004006639D1 true DE602004006639D1 (de) 2007-07-05
DE602004006639T2 DE602004006639T2 (de) 2008-01-31

Family

ID=34549968

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004006639T Expired - Lifetime DE602004006639T2 (de) 2003-10-28 2004-10-28 Verfahren zur herstellung einer elektrostatischen mems-einspannvorrichtung

Country Status (8)

Country Link
US (1) US6946403B2 (de)
EP (1) EP1678752B1 (de)
JP (1) JP4725740B2 (de)
KR (1) KR20060092245A (de)
CN (1) CN100524683C (de)
DE (1) DE602004006639T2 (de)
TW (1) TWI360856B (de)
WO (1) WO2005045921A1 (de)

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KR100666039B1 (ko) * 2003-12-05 2007-01-10 동경 엘렉트론 주식회사 정전척
US7457097B2 (en) * 2004-07-27 2008-11-25 International Business Machines Corporation Pressure assisted wafer holding apparatus and control method
US20070081880A1 (en) * 2005-09-29 2007-04-12 Riordon Benjamin B Wafer-handling method, system, and apparatus
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US8877253B2 (en) * 2006-05-11 2014-11-04 Regenics As Cellular extracts
US8075920B2 (en) 2006-05-11 2011-12-13 Regenics A/S Administration of cells and cellular extracts for rejuvenation
WO2008051369A2 (en) * 2006-10-25 2008-05-02 Axcelis Technologies, Inc. Low-cost electrostatic clamp with fast declamp time and the manufacture
US20090115060A1 (en) * 2007-11-01 2009-05-07 Infineon Technologies Ag Integrated circuit device and method
DE102008054982A1 (de) * 2008-12-19 2010-07-01 Carl Zeiss Smt Ag Wafer-Chuck für die EUV-Lithographie
US7932570B1 (en) * 2009-11-09 2011-04-26 Honeywell International Inc. Silicon tab edge mount for a wafer level package
CN102782827B (zh) * 2009-12-30 2014-08-06 速力斯公司 用于薄晶片的可移动静电载具
CA2798137C (en) 2010-05-06 2016-06-28 Regenics As Use of fish egg extracts for cellular rejuvenation
JP5796076B2 (ja) * 2010-09-08 2015-10-21 インテグリス・インコーポレーテッド 高導電性静電チャック
US10242890B2 (en) * 2011-08-08 2019-03-26 Applied Materials, Inc. Substrate support with heater
NL2009874A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
JP6359236B2 (ja) * 2012-05-07 2018-07-18 トーカロ株式会社 静電チャック
WO2014008110A1 (en) * 2012-07-06 2014-01-09 LuxVue Technology Corporation Compliant bipolar micro device transfer head with silicon electrodes
US8569115B1 (en) 2012-07-06 2013-10-29 LuxVue Technology Corporation Method of forming a compliant bipolar micro device transfer head with silicon electrodes
JP5441021B1 (ja) * 2012-09-12 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
EP3459522B1 (de) 2012-12-10 2021-02-17 Regenics AS Verwendung von zellextrakten zur wundbehandlung
CN104854511B (zh) * 2013-02-07 2017-08-25 Asml控股股份有限公司 光刻设备和方法
US9878901B2 (en) 2014-04-04 2018-01-30 Analog Devices, Inc. Fabrication of tungsten MEMS structures
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
US10381248B2 (en) 2015-06-22 2019-08-13 Lam Research Corporation Auto-correction of electrostatic chuck temperature non-uniformity
US10763142B2 (en) 2015-06-22 2020-09-01 Lam Research Corporation System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US10386821B2 (en) 2015-06-22 2019-08-20 Lam Research Corporation Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
US9673025B2 (en) * 2015-07-27 2017-06-06 Lam Research Corporation Electrostatic chuck including embedded faraday cage for RF delivery and associated methods for operation, monitoring, and control
US20180025931A1 (en) * 2016-07-22 2018-01-25 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
US20180102247A1 (en) * 2016-10-06 2018-04-12 Asm Ip Holding B.V. Substrate processing apparatus and method of manufacturing semiconductor device
US10535505B2 (en) * 2016-11-11 2020-01-14 Lam Research Corporation Plasma light up suppression
US10943808B2 (en) * 2016-11-25 2021-03-09 Applied Materials, Inc. Ceramic electrostatic chuck having a V-shape seal band
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
EP3884513A4 (de) * 2018-11-19 2022-08-03 Entegris, Inc. Elektrostatisches futter mit ladungsableitbeschichtung
WO2021177047A1 (ja) * 2020-03-04 2021-09-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
US12497697B2 (en) * 2021-10-08 2025-12-16 Applied Materials, Inc. Layer with discrete islands formed on a substrate support
KR102715367B1 (ko) * 2021-12-02 2024-10-08 세메스 주식회사 기판 지지 유닛 및 이를 포함하는 기판 처리 장치

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US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
JP2779950B2 (ja) * 1989-04-25 1998-07-23 東陶機器株式会社 静電チャックの電圧印加方法および電圧印加装置
US5452177A (en) * 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5444597A (en) * 1993-01-15 1995-08-22 Blake; Julian G. Wafer release method and apparatus
JPH07153825A (ja) * 1993-11-29 1995-06-16 Toto Ltd 静電チャック及びこの静電チャックを用いた被吸着体の処理方法
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
US5583736A (en) * 1994-11-17 1996-12-10 The United States Of America As Represented By The Department Of Energy Micromachined silicon electrostatic chuck
US5792562A (en) * 1995-01-12 1998-08-11 Applied Materials, Inc. Electrostatic chuck with polymeric impregnation and method of making
JP3005461B2 (ja) * 1995-11-24 2000-01-31 日本電気株式会社 静電チャック
US5838529A (en) * 1995-12-22 1998-11-17 Lam Research Corporation Low voltage electrostatic clamp for substrates such as dielectric substrates
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
US5958813A (en) * 1996-11-26 1999-09-28 Kyocera Corporation Semi-insulating aluminum nitride sintered body
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
JPH10284583A (ja) 1997-04-04 1998-10-23 Mitsubishi Electric Corp 静電チャック除電方法及び半導体製造装置
US6138745A (en) * 1997-09-26 2000-10-31 Cvc Products, Inc. Two-stage sealing system for thermally conductive chuck
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
US6149774A (en) * 1998-06-10 2000-11-21 Delsys Pharmaceutical Corporation AC waveforms biasing for bead manipulating chucks
JP3323135B2 (ja) * 1998-08-31 2002-09-09 京セラ株式会社 静電チャック
TW432453B (en) * 1998-11-12 2001-05-01 Applied Materials Inc Apparatus for protecting a substrate support surface and method of fabricating same
US6067222A (en) * 1998-11-25 2000-05-23 Applied Materials, Inc. Substrate support apparatus and method for fabricating same
US6236555B1 (en) * 1999-04-19 2001-05-22 Applied Materials, Inc. Method for rapidly dechucking a semiconductor wafer from an electrostatic chuck utilizing a hysteretic discharge cycle
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP3859937B2 (ja) * 2000-06-02 2006-12-20 住友大阪セメント株式会社 静電チャック
JP2002009139A (ja) * 2000-06-20 2002-01-11 Nikon Corp 静電チャック
WO2002001611A2 (en) * 2000-06-23 2002-01-03 Applied Materials, Inc. Electrostatic chuck and method of fabricating the same

Also Published As

Publication number Publication date
EP1678752B1 (de) 2007-05-23
DE602004006639T2 (de) 2008-01-31
CN1894788A (zh) 2007-01-10
JP2007510310A (ja) 2007-04-19
JP4725740B2 (ja) 2011-07-13
TWI360856B (en) 2012-03-21
TW200518144A (en) 2005-06-01
WO2005045921A1 (en) 2005-05-19
US20050099758A1 (en) 2005-05-12
KR20060092245A (ko) 2006-08-22
EP1678752A1 (de) 2006-07-12
CN100524683C (zh) 2009-08-05
US6946403B2 (en) 2005-09-20

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