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DE60140769D1 - Schwallötvorrichtung und -methode - Google Patents

Schwallötvorrichtung und -methode

Info

Publication number
DE60140769D1
DE60140769D1 DE60140769T DE60140769T DE60140769D1 DE 60140769 D1 DE60140769 D1 DE 60140769D1 DE 60140769 T DE60140769 T DE 60140769T DE 60140769 T DE60140769 T DE 60140769T DE 60140769 D1 DE60140769 D1 DE 60140769D1
Authority
DE
Germany
Prior art keywords
soldering device
wave soldering
wave
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140769T
Other languages
English (en)
Inventor
Yasuji Kawashima
Kenichiro Suetsugu
Shunji Hibino
Hiroaki Takano
Tatsuo Okuji
Shoshi Kabashima
Yukio Maeda
Mikiya Nataka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000299423A external-priority patent/JP2002111194A/ja
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60140769D1 publication Critical patent/DE60140769D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
DE60140769T 2000-09-26 2001-09-25 Schwallötvorrichtung und -methode Expired - Lifetime DE60140769D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000292271 2000-09-26
JP2000299423A JP2002111194A (ja) 2000-09-29 2000-09-29 フローはんだ付け方法および装置

Publications (1)

Publication Number Publication Date
DE60140769D1 true DE60140769D1 (de) 2010-01-21

Family

ID=26600739

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140769T Expired - Lifetime DE60140769D1 (de) 2000-09-26 2001-09-25 Schwallötvorrichtung und -methode

Country Status (4)

Country Link
US (1) US6805282B2 (de)
EP (2) EP1259101A4 (de)
DE (1) DE60140769D1 (de)
WO (1) WO2002028156A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100482043C (zh) 2004-04-16 2009-04-22 P.凯金属股份有限公司 焊接方法
TW200610122A (en) * 2004-09-14 2006-03-16 P Kay Metal Inc Soldering process
US20060226199A1 (en) * 2005-03-30 2006-10-12 Visteon Global Technologies, Inc. Selective soldering of flat flexible cable with lead-free solder to a substrate
US7971627B2 (en) 2005-07-27 2011-07-05 Panasonic Corporation Device for producing metal sample and process for producing metal sample
US20080296348A1 (en) * 2007-06-04 2008-12-04 Slater Jr Richard F Heater for select solder machine
DE102007053857A1 (de) * 2007-11-09 2009-05-14 Endress + Hauser Gmbh + Co. Kg Verfahren zum Betrieb einer Wellenlötanlage
EP2138258B1 (de) * 2008-06-23 2022-08-24 Siemens Energy Global GmbH & Co. KG Verfahren zum Löten mit mehrstufigem Temperaturprofil
EP2299501A1 (de) * 2009-09-16 2011-03-23 3S Industries AG Verfahren und Vorrichtung zur Ausstattung einer Solarzelle mit einem Lötband
KR20110129151A (ko) * 2010-05-25 2011-12-01 삼성전자주식회사 부력 인가 수단을 가진 웨이브 솔더링 장치와 솔더링 방법 및 플립 칩용 솔더 범프 형성 방법
TWI435674B (zh) 2011-01-28 2014-04-21 Wistron Corp 焊接插件式元件於電路板之方法及焊接系統
KR20130059760A (ko) * 2011-11-29 2013-06-07 삼성전기주식회사 솔더범프 형성장치 및 이를 구비하는 솔더링 설비
FI20125384L (fi) * 2012-04-04 2013-10-05 Tellabs Oy Juotosliitoksella varustettu järjestelmä
US9198300B2 (en) 2014-01-23 2015-11-24 Illinois Tool Works Inc. Flux management system and method for a wave solder machine
US9161459B2 (en) 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
DE102014110720B4 (de) * 2014-07-29 2025-12-31 Illinois Tool Works Inc. Lötmodul
JP6227580B2 (ja) * 2015-03-03 2017-11-08 ファナック株式会社 板金と樹脂から作製された基板、該基板を備えたモータ、および半田付け方法
TWI600240B (zh) * 2017-02-08 2017-09-21 嵩技企業股份有限公司 全自動ｒｆ端子鉚壓沾錫機
CN110710338B (zh) * 2017-06-05 2021-06-18 千住金属工业株式会社 软钎焊装置
JP6566021B2 (ja) 2017-12-25 2019-08-28 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing
JP7141001B1 (ja) * 2021-05-14 2022-09-22 千住金属工業株式会社 噴流はんだ付け装置
KR20240053276A (ko) 2022-10-17 2024-04-24 삼성전자주식회사 솔더 리플로우 장치

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US4446358A (en) * 1981-12-15 1984-05-01 Cooper Industries, Inc. Preheater for use in mass soldering apparatus
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
US4538757A (en) 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
US4600137A (en) * 1985-02-21 1986-07-15 Hollis Automation, Inc. Method and apparatus for mass soldering with subsequent reflow soldering
JPS63174778A (ja) * 1987-01-11 1988-07-19 Daiichi Tsusho:Kk 自動半田付け方法及び装置
DE3737563A1 (de) * 1987-11-05 1989-05-18 Ernst Hohnerlein Loetmaschine
US5044542A (en) * 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
US5121874A (en) * 1989-11-22 1992-06-16 Electrovert Ltd. Shield gas wave soldering
US5230460A (en) * 1990-06-13 1993-07-27 Electrovert Ltd. High volume convection preheater for wave soldering
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
US5240169A (en) * 1991-12-06 1993-08-31 Electrovert Ltd. Gas shrouded wave soldering with gas knife
US5203489A (en) * 1991-12-06 1993-04-20 Electrovert Ltd. Gas shrouded wave soldering
JP3235877B2 (ja) * 1992-08-31 2001-12-04 松下電器産業株式会社 ディップ半田付け装置
US5297724A (en) * 1993-05-26 1994-03-29 The Boc Group, Inc. Wave soldering method and apparatus
US5520320A (en) * 1994-04-22 1996-05-28 Air Liquide America Corporation Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere
DE4416788C2 (de) * 1994-05-06 1999-08-19 Siemens Ag Verfahren zum Wellenlöten von Leiterplatten
US5630542A (en) * 1994-12-05 1997-05-20 Soltec B.V. Soldering apparatus with abrupt separation of solder streams
JPH08242074A (ja) * 1995-03-03 1996-09-17 Toshiba Fa Syst Eng Kk プリント基板半田付け装置
JP3311547B2 (ja) * 1995-08-02 2002-08-05 日本電熱計器株式会社 はんだ付け装置
US5772101A (en) * 1995-08-07 1998-06-30 Ns Tekuno Co., Ltd. Wave soldering machine
US5685475A (en) * 1995-09-08 1997-11-11 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
JPH09237964A (ja) * 1996-02-28 1997-09-09 Sony Corp 窒素ガス封入式半田付け装置
JP3963501B2 (ja) * 1996-06-12 2007-08-22 内橋エステック株式会社 電子部品の実装方法
JPH10125618A (ja) * 1996-10-23 1998-05-15 Fujitsu Ltd 半導体装置の製造方法
JP3592486B2 (ja) * 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置
JP3241013B2 (ja) 1998-02-27 2001-12-25 松下電器産業株式会社 はんだ付け装置とはんだ回収装置と酸化物の除去方法と酸化物の分離剤
JP2899584B1 (ja) 1998-02-27 1999-06-02 松下電器産業株式会社 酸化物の分離剤と分離方法と容器
EP0938944B1 (de) 1998-02-27 2004-11-24 Matsushita Electric Industrial Co., Ltd. Lötvorrichtung und Verfahren zum Entzweien des Lötmaterials von der Oxidslötung
JP2000244108A (ja) * 1999-02-22 2000-09-08 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置
JP2000252620A (ja) * 1999-03-04 2000-09-14 Matsushita Electric Ind Co Ltd はんだ付け装置とはんだ回収装置と酸化物の除去方法と酸化物の分離剤
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JP2002062273A (ja) 2000-06-06 2002-02-28 Matsushita Electric Ind Co Ltd 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム
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Also Published As

Publication number Publication date
EP1405687B1 (de) 2009-12-09
WO2002028156A1 (en) 2002-04-04
EP1405687A2 (de) 2004-04-07
US20020179693A1 (en) 2002-12-05
EP1259101A4 (de) 2003-04-09
US6805282B2 (en) 2004-10-19
EP1259101A1 (de) 2002-11-20
EP1405687A3 (de) 2005-03-30

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Legal Events

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8364 No opposition during term of opposition