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DE60132906D1 - Prüfsystem in einer leiterplatten-herstellungslinie für die automatisierte prüfung von leiterplatten - Google Patents

Prüfsystem in einer leiterplatten-herstellungslinie für die automatisierte prüfung von leiterplatten

Info

Publication number
DE60132906D1
DE60132906D1 DE60132906T DE60132906T DE60132906D1 DE 60132906 D1 DE60132906 D1 DE 60132906D1 DE 60132906 T DE60132906 T DE 60132906T DE 60132906 T DE60132906 T DE 60132906T DE 60132906 D1 DE60132906 D1 DE 60132906D1
Authority
DE
Germany
Prior art keywords
pcb
testing
test modules
test
inspection system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60132906T
Other languages
English (en)
Other versions
DE60132906T2 (de
Inventor
Hannu Seppaelae
Pekka Kurppa
Jarmo Teeri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CENCORP Oyj
Original Assignee
CENCORP Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CENCORP Oyj filed Critical CENCORP Oyj
Publication of DE60132906D1 publication Critical patent/DE60132906D1/de
Application granted granted Critical
Publication of DE60132906T2 publication Critical patent/DE60132906T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53196—Means to apply magnetic force directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
  • Selective Calling Equipment (AREA)
  • Maintenance And Management Of Digital Transmission (AREA)
  • General Factory Administration (AREA)
  • Monitoring And Testing Of Transmission In General (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Time-Division Multiplex Systems (AREA)
DE60132906T 2000-09-21 2001-09-21 Prüfsystem in einer leiterplatten-herstellungslinie für die automatisierte prüfung von leiterplatten Expired - Fee Related DE60132906T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20002086A FI117809B (fi) 2000-09-21 2000-09-21 Testausjärjestelmä piirilevyvalmistuslinjassa piirilevyjen automaattiseksi testaamiseksi
FI20002086 2000-09-21
PCT/FI2001/000829 WO2002025301A1 (en) 2000-09-21 2001-09-21 Testing system in a circuit board manufacturing line for automatic testing of circuit boards

Publications (2)

Publication Number Publication Date
DE60132906D1 true DE60132906D1 (de) 2008-04-03
DE60132906T2 DE60132906T2 (de) 2009-02-12

Family

ID=8559134

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60132906T Expired - Fee Related DE60132906T2 (de) 2000-09-21 2001-09-21 Prüfsystem in einer leiterplatten-herstellungslinie für die automatisierte prüfung von leiterplatten
DE60132908T Expired - Fee Related DE60132908T2 (de) 2000-09-21 2001-09-21 Prüfsystem in einer leiterplatten-herstellungslinie zum automatischen prüfen von leiterplatten

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60132908T Expired - Fee Related DE60132908T2 (de) 2000-09-21 2001-09-21 Prüfsystem in einer leiterplatten-herstellungslinie zum automatischen prüfen von leiterplatten

Country Status (10)

Country Link
US (2) US6876192B2 (de)
EP (2) EP1327154B1 (de)
AT (2) ATE386947T1 (de)
AU (2) AU2001287784A1 (de)
CA (2) CA2423002A1 (de)
DE (2) DE60132906T2 (de)
DK (2) DK1328820T3 (de)
ES (2) ES2299513T3 (de)
FI (1) FI117809B (de)
WO (2) WO2002025300A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7292023B2 (en) * 2004-06-30 2007-11-06 Intel Corporation Apparatus and method for linked slot-level burn-in
US7339387B2 (en) * 2004-06-30 2008-03-04 Intel Corporation System and method for linked slot-level burn-in
KR20080051762A (ko) * 2006-12-06 2008-06-11 삼성전자주식회사 번인 보드 접속 장치, 이를 구비한 번인 테스트 장치 및번인 보드 접속 방법
US8413577B2 (en) 2008-11-19 2013-04-09 Illinois Tool Works Inc. Vertically separated pass through conveyor system and method in surface mount technology process equipment
CN201348650Y (zh) * 2009-01-16 2009-11-18 鸿富锦精密工业（深圳）有限公司 电路板测试治具
US8035409B2 (en) * 2009-04-29 2011-10-11 International Business Machines Corporation System and method implementing short-pulse propagation technique on production-level boards with incremental accuracy and productivity levels
DE102011112532B4 (de) * 2011-09-05 2019-03-21 Audi Ag Prüfeinrichtung und Verfahren zum Prüfen von Batteriezellen
TWM436911U (en) * 2012-02-10 2012-09-01 Cal Comp Electronics & Comm Co Network attached storage device
CN104597388B (zh) * 2013-10-31 2017-06-06 纬创资通股份有限公司 用来检测主机板的自动化检测系统
ITTO20130954A1 (it) * 2013-11-25 2015-05-26 Bitron Spa Modulo automatizzato per linee di assemblaggio e metodo di attuazione e controllo associato.
CN107840109A (zh) * 2016-09-19 2018-03-27 珠海迈超智能装备有限公司 自动测试设备和方法
CN113030519B (zh) * 2021-04-02 2022-09-27 昆山威典电子有限公司 一种电路板的检测设备
CN113203941A (zh) * 2021-05-06 2021-08-03 苏州明良智能科技有限公司 Ict测试设备
CN114985297B (zh) * 2021-09-16 2024-01-23 上海一航凯迈光机电设备有限公司 一种雷达电源模块电路板测试装置及使用方法
CN114453851B (zh) * 2022-02-09 2022-12-23 苏州天准科技股份有限公司 用于机动车热交换器内零部件的上料装置及上料方法
CN115166491B (zh) * 2022-08-22 2025-08-08 深圳市兆驰股份有限公司 电路板测试装置及测试线
CN115494374B (zh) * 2022-10-18 2023-10-10 苏州欧菲特电子股份有限公司 一种多工位在线电路板测试站
KR102902798B1 (ko) * 2023-05-12 2025-12-29 주식회사 쎄믹스 단열 구조를 갖는 번인 테스트 장치
CN120646477B (zh) * 2025-08-20 2025-11-07 晋城市光机电产业协调服务中心(晋城市光机电产业研究院) 一种快速上下料的自动化激光器老化测试柜

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845843A (en) * 1985-10-28 1989-07-11 Cimm, Inc. System for configuring, automating and controlling the test and repair of printed circuit boards
JPH01259271A (ja) * 1988-04-07 1989-10-16 Awa Eng Co 記録媒体検査装置
GB8904663D0 (en) * 1989-03-01 1989-04-12 Engineering & Electronic Suppl Pcb testing apparatus
US5009306A (en) * 1989-06-19 1991-04-23 Simplimatic Engineering Company Printed circuit board conveyor and method
US5093984A (en) * 1990-05-18 1992-03-10 Aehr Test Systems Printed circuit board loader/unloader
US5184068A (en) * 1990-09-24 1993-02-02 Symtek Systems, Inc. Electronic device test handler
US5479694A (en) * 1993-04-13 1996-01-02 Micron Technology, Inc. Method for mounting integrated circuits onto printed circuit boards and testing
DE4416755C2 (de) * 1994-05-13 1996-10-31 Pematech Rohwedder Gmbh Vorrichtung zum Testen von Leiterplatten o. dgl. Prüflingen mittels eines Wechselsatzes
IT1272853B (it) * 1994-11-30 1997-06-30 Circuit Line Spa Metodo e apparecchiatura per il carico e lo scarico automatico di circuiti stampati su macchine per l'esecuzione del test elettrico
US5680936A (en) * 1995-03-14 1997-10-28 Automated Technologies Industries, Inc. Printed circuit board sorting device
JPH0989960A (ja) * 1995-09-26 1997-04-04 Kokusai Electric Co Ltd 自動感度測定装置
US6232766B1 (en) * 1997-12-31 2001-05-15 Gte Communication Systems Corporation Test station for sequential testing
ITMI991140A1 (it) * 1999-05-24 2000-11-24 O M G Di G Pessina E A Perobel Apparecchio di convogliamento e rotazione di pacchi di libri fascicoli o simili
IT1319290B1 (it) * 2000-10-19 2003-10-10 Mania Tecnologie Italia S P A Metodo e dispositivo per la regolazione automatica dei mezzi ditrasporto di circuiti stampati in una macchina da test

Also Published As

Publication number Publication date
FI20002086L (fi) 2002-03-22
EP1327154A1 (de) 2003-07-16
FI20002086A0 (fi) 2000-09-21
FI117809B (fi) 2007-02-28
DK1328820T3 (da) 2008-06-23
EP1328820B1 (de) 2008-02-20
AU2001289976A1 (en) 2002-04-02
ATE386948T1 (de) 2008-03-15
ES2299510T3 (es) 2008-06-01
WO2002025301A1 (en) 2002-03-28
US20030179006A1 (en) 2003-09-25
AU2001287784A1 (en) 2002-04-02
DE60132908T2 (de) 2009-01-08
CA2423003A1 (en) 2002-03-28
US20030184281A1 (en) 2003-10-02
DK1327154T3 (da) 2008-06-16
WO2002025300A1 (en) 2002-03-28
US6867579B2 (en) 2005-03-15
US6876192B2 (en) 2005-04-05
EP1328820A1 (de) 2003-07-23
DE60132908D1 (de) 2008-04-03
ATE386947T1 (de) 2008-03-15
DE60132906T2 (de) 2009-02-12
EP1327154B1 (de) 2008-02-20
ES2299513T3 (es) 2008-06-01
CA2423002A1 (en) 2002-03-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee