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DE60131222D1 - Mehrzweckbehandlungskammer mit ausnehmbarer Kammerauskleidung - Google Patents

Mehrzweckbehandlungskammer mit ausnehmbarer Kammerauskleidung

Info

Publication number
DE60131222D1
DE60131222D1 DE60131222T DE60131222T DE60131222D1 DE 60131222 D1 DE60131222 D1 DE 60131222D1 DE 60131222 T DE60131222 T DE 60131222T DE 60131222 T DE60131222 T DE 60131222T DE 60131222 D1 DE60131222 D1 DE 60131222D1
Authority
DE
Germany
Prior art keywords
chamber
removable
lining
multipurpose treatment
treatment chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60131222T
Other languages
English (en)
Other versions
DE60131222T2 (de
Inventor
Jonathan D Mohn
John J Helmsen
Michael Barnes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE60131222D1 publication Critical patent/DE60131222D1/de
Application granted granted Critical
Publication of DE60131222T2 publication Critical patent/DE60131222T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
DE60131222T 2000-07-07 2001-07-06 Mehrzweckverarbeitungskammer mit herausnehmbarer Kammerauskleidung Expired - Fee Related DE60131222T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US611817 1984-05-18
US09/611,817 US7011039B1 (en) 2000-07-07 2000-07-07 Multi-purpose processing chamber with removable chamber liner

Publications (2)

Publication Number Publication Date
DE60131222D1 true DE60131222D1 (de) 2007-12-20
DE60131222T2 DE60131222T2 (de) 2008-09-04

Family

ID=24450518

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60131222T Expired - Fee Related DE60131222T2 (de) 2000-07-07 2001-07-06 Mehrzweckverarbeitungskammer mit herausnehmbarer Kammerauskleidung

Country Status (4)

Country Link
US (1) US7011039B1 (de)
EP (1) EP1170777B1 (de)
JP (1) JP2002075974A (de)
DE (1) DE60131222T2 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303309A (ja) * 2005-04-22 2006-11-02 Hitachi High-Technologies Corp プラズマ処理装置
US8440049B2 (en) 2006-05-03 2013-05-14 Applied Materials, Inc. Apparatus for etching high aspect ratio features
KR101346081B1 (ko) 2006-06-20 2013-12-31 참엔지니어링(주) 플라스마 에칭 챔버
KR100906392B1 (ko) * 2007-12-13 2009-07-07 (주)트리플코어스코리아 반도체 챔버 라이너
US20090151872A1 (en) * 2007-12-17 2009-06-18 Tugrul Samir Low cost high conductance chamber
US20090188624A1 (en) * 2008-01-25 2009-07-30 Applied Materials, Inc. Method and apparatus for enhancing flow uniformity in a process chamber
US20090188625A1 (en) * 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
JP5282008B2 (ja) * 2009-10-26 2013-09-04 株式会社日立ハイテクノロジーズ 真空処理装置
US8840725B2 (en) * 2009-11-11 2014-09-23 Applied Materials, Inc. Chamber with uniform flow and plasma distribution
US20110226739A1 (en) * 2010-03-19 2011-09-22 Varian Semiconductor Equipment Associates, Inc. Process chamber liner with apertures for particle containment
US20110315319A1 (en) * 2010-06-25 2011-12-29 Applied Materials, Inc. Pre-clean chamber with reduced ion current
JP5725911B2 (ja) * 2011-03-04 2015-05-27 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US20130105085A1 (en) * 2011-10-28 2013-05-02 Applied Materials, Inc. Plasma reactor with chamber wall temperature control
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner
US9679751B2 (en) 2012-03-15 2017-06-13 Lam Research Corporation Chamber filler kit for plasma etch chamber useful for fast gas switching
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
CN110690098A (zh) * 2014-02-06 2020-01-14 应用材料公司 基板支撑组件以及用于处理基板的设备
US9673092B2 (en) * 2014-03-06 2017-06-06 Asm Ip Holding B.V. Film forming apparatus, and method of manufacturing semiconductor device
US10883168B2 (en) 2014-09-11 2021-01-05 Massachusetts Institute Of Technology Processing system for small substrates
JP6544902B2 (ja) * 2014-09-18 2019-07-17 東京エレクトロン株式会社 プラズマ処理装置
KR101792941B1 (ko) * 2015-04-30 2017-11-02 어드밴스드 마이크로 패브리케이션 이큅먼트 인코퍼레이티드, 상하이 화학기상증착장치 및 그 세정방법
US10559451B2 (en) * 2017-02-15 2020-02-11 Applied Materials, Inc. Apparatus with concentric pumping for multiple pressure regimes
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
KR101987451B1 (ko) * 2017-10-18 2019-06-11 세메스 주식회사 기판 지지부재 및 이를 포함하는 기판 처리 장치
CN110065936B (zh) * 2018-01-24 2024-04-02 清华大学 胶带装置
CN110065935B (zh) * 2018-01-24 2024-04-02 清华大学 胶带装置
US11270898B2 (en) * 2018-09-16 2022-03-08 Applied Materials, Inc. Apparatus for enhancing flow uniformity in a process chamber
JP1638504S (de) * 2018-12-06 2019-08-05
JP2020147772A (ja) * 2019-03-11 2020-09-17 東京エレクトロン株式会社 成膜装置及び成膜方法
KR102404571B1 (ko) * 2019-11-05 2022-06-07 피에스케이 주식회사 기판 처리 장치
US11499223B2 (en) 2020-12-10 2022-11-15 Applied Materials, Inc. Continuous liner for use in a processing chamber

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0056611B1 (de) * 1981-01-19 1984-04-04 Herbert Rieger Liegender Behälter, insbesondere zur Behandlung von Weinmaische
US5186718A (en) 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US6077384A (en) * 1994-08-11 2000-06-20 Applied Materials, Inc. Plasma reactor having an inductive antenna coupling power through a parallel plate electrode
US6063233A (en) * 1991-06-27 2000-05-16 Applied Materials, Inc. Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
US5800686A (en) 1993-04-05 1998-09-01 Applied Materials, Inc. Chemical vapor deposition chamber with substrate edge protection
US5900103A (en) * 1994-04-20 1999-05-04 Tokyo Electron Limited Plasma treatment method and apparatus
EP0680072B1 (de) 1994-04-28 2003-10-08 Applied Materials, Inc. Verfahren zum Betreiben eines CVD-Reaktors hoher Plasma-Dichte mit kombinierter induktiver und kapazitiver Einkopplung
US5730801A (en) * 1994-08-23 1998-03-24 Applied Materials, Inc. Compartnetalized substrate processing chamber
US5885356A (en) * 1994-11-30 1999-03-23 Applied Materials, Inc. Method of reducing residue accumulation in CVD chamber using ceramic lining
US5558717A (en) * 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
US5891350A (en) * 1994-12-15 1999-04-06 Applied Materials, Inc. Adjusting DC bias voltage in plasma chambers
JP3150056B2 (ja) * 1995-10-19 2001-03-26 東京エレクトロン株式会社 プラズマ処理装置
US5820723A (en) 1996-06-05 1998-10-13 Lam Research Corporation Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support
US5788799A (en) * 1996-06-11 1998-08-04 Applied Materials, Inc. Apparatus and method for cleaning of semiconductor process chamber surfaces
US5952060A (en) * 1996-06-14 1999-09-14 Applied Materials, Inc. Use of carbon-based films in extending the lifetime of substrate processing system components
JPH1022263A (ja) * 1996-06-28 1998-01-23 Sony Corp プラズマエッチング装置
US6120640A (en) * 1996-12-19 2000-09-19 Applied Materials, Inc. Boron carbide parts and coatings in a plasma reactor
JP3582287B2 (ja) * 1997-03-26 2004-10-27 株式会社日立製作所 エッチング装置
US6251216B1 (en) * 1997-12-17 2001-06-26 Matsushita Electronics Corporation Apparatus and method for plasma processing
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers

Also Published As

Publication number Publication date
JP2002075974A (ja) 2002-03-15
EP1170777A2 (de) 2002-01-09
EP1170777B1 (de) 2007-11-07
EP1170777A3 (de) 2005-03-16
US7011039B1 (en) 2006-03-14
DE60131222T2 (de) 2008-09-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee