DE60126957D1 - Polyaryletherketon-polyetherimid-zusammensetzungen - Google Patents

Polyaryletherketon-polyetherimid-zusammensetzungen

Info

Publication number: DE60126957D1
Authority: DE; Germany
Prior art keywords: polyaryletherketone; polyetherimide compositions; polyetherimide; compositions; polyaryletherketone polyetherimide
Prior art date: 2000-08-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60126957T

Other languages

English (en)

Other versions

DE60126957T2 (de

Inventor

Kouichirou Taniguchi

Shingetsu Yamada

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Chemical Corp

Original Assignee

Mitsubishi Plastics Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-08-10

Filing date

2001-08-06

Publication date

2007-04-12

2001-08-06 Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc

2007-04-12 Publication of DE60126957D1 publication Critical patent/DE60126957D1/de

2007-11-08 Application granted granted Critical

2007-11-08 Publication of DE60126957T2 publication Critical patent/DE60126957T2/de

2021-08-07 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Laminated Bodies (AREA)
Compositions Of Macromolecular Compounds (AREA)
Manufacture Of Macromolecular Shaped Articles (AREA)

DE60126957T 2000-08-10 2001-08-06 Polyaryletherketon-polyetherimid-zusammensetzungen Expired - Lifetime DE60126957T2 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2000242614		2000-08-10
JP2000242614A JP4201965B2 (ja)	2000-08-10	2000-08-10	耐熱性樹脂組成物及びこれよりなる耐熱性フィルムまたはシート並びにこれを基材とする積層板
PCT/JP2001/006749 WO2002014404A2 (en)	2000-08-10	2001-08-06	Polyarylether-polyetherimide compositions

Publications (2)

Publication Number	Publication Date
DE60126957D1 true DE60126957D1 (de)	2007-04-12
DE60126957T2 DE60126957T2 (de)	2007-11-08

Family

ID=18733614

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60126957T Expired - Lifetime DE60126957T2 (de)	2000-08-10	2001-08-06	Polyaryletherketon-polyetherimid-zusammensetzungen

Country Status (8)

Country	Link
US (1)	US6824884B2 (de)
EP (1)	EP1311616B1 (de)
JP (1)	JP4201965B2 (de)
KR (1)	KR100747402B1 (de)
CN (1)	CN1266218C (de)
DE (1)	DE60126957T2 (de)
TW (1)	TW548294B (de)
WO (1)	WO2002014404A2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4073631B2 (ja) *	2001-01-22	2008-04-09	三菱樹脂株式会社	ポリアリールケトン系樹脂フィルム及びそれを用いてなる金属積層体
US7498086B2 (en) *	2002-08-07	2009-03-03	Mitsubishi Platics, Inc.	Heat resistant film and metal laminate thereof
US7549220B2 (en) *	2003-12-17	2009-06-23	World Properties, Inc.	Method for making a multilayer circuit
DE10361504A1 (de) *	2003-12-23	2005-07-28	Basf Ag	Kraft- und Schmierstoffadditiv-Konzentrate, enthaltend mindestens ein Anthrachinon-derivat als Markierungsstoff
JP2005330379A (ja) *	2004-05-20	2005-12-02	Mitsubishi Plastics Ind Ltd	熱可塑性樹脂組成物及びこれを用いた成形体
JP4701735B2 (ja) *	2004-07-09	2011-06-15	株式会社豊田自動織機	摺動部材
US8043704B2 (en) *	2005-04-08	2011-10-25	The Boeing Company	Layered, transparent thermoplastic for flammability resistance
US20070066739A1 (en) *	2005-09-16	2007-03-22	General Electric Company	Coated articles of manufacture made of high Tg polymer blends
WO2007035402A2 (en)	2005-09-16	2007-03-29	General Electric Company	Improved poly aryl ether ketone polymer blends
US9006348B2 (en)	2005-09-16	2015-04-14	Sabic Global Technologies B.V.	Poly aryl ether ketone polymer blends
US20080274360A1 (en) *	2007-05-04	2008-11-06	General Electric Company	Polyaryl ether ketone - polycarbonate copolymer blends
DE112007003643B4 (de)	2007-08-31	2014-12-24	Mitsubishi Electric Corp.	Ölpuffer für Aufzüge
DE102008000073A1 (de) *	2008-01-17	2009-07-23	Alstom Technology Ltd.	Leiterstab für eine rotierende elektrische Maschine
US8912272B2 (en)	2008-12-19	2014-12-16	Sabic Innovative Plastics Ip B.V.	Moisture resistant polyimide compositions
KR101203459B1 (ko)	2010-05-14	2012-11-21	주식회사 카노	가열조리용 시트
US9158251B2 (en)	2013-08-30	2015-10-13	Canon Kabushiki Kaisha	Film and image heating device using film
JP6192443B2 (ja) *	2013-08-30	2017-09-06	キヤノン株式会社	定着フィルム及びそれを備えた定着装置
JP6483596B2 (ja) *	2015-12-15	2019-03-13	信越ポリマー株式会社	高耐熱・高摺動性フィルムの製造方法
JP7173124B2 (ja)	2018-02-27	2022-11-16	三菱ケミカル株式会社	繊維強化熱可塑性樹脂プリプレグおよび成形体
JP6709302B2 (ja) *	2019-02-14	2020-06-10	信越ポリマー株式会社	高耐熱・高摺動性フィルム
US11708491B2 (en) *	2019-10-02	2023-07-25	Essex Furukawa Magnet Wire Usa Llc	Polymeric insulating films
US12227647B2 (en) *	2021-11-19	2025-02-18	The Boeing Company	Thermoplastic films and methods for coating thermoplastic substrates with thermoset materials
JP2023127806A (ja) *	2022-03-02	2023-09-14	三菱ケミカル株式会社	プリプレグ及びその製造方法と、成形体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA1235835A (en) *	1982-12-09	1988-04-26	James E. Harris	Composition useful for making circuit board substrates and/or electrical connectors
JPS59187054A (ja)	1983-04-06	1984-10-24	Toray Ind Inc	耐熱性熱可塑性樹脂組成物
FI852148A0 (fi)	1983-09-29	1985-05-29	Union Carbide Corp	Blandningar av en poly(arylketon) och en polyeterimid.
EP0163464A1 (de) *	1984-05-18	1985-12-04	RAYCHEM CORPORATION (a California corporation)	Mischungen von Poly(arylether)ketonen
US5538789A (en)	1990-02-09	1996-07-23	Toranaga Technologies, Inc.	Composite substrates for preparation of printed circuits
US5852085A (en) *	1996-12-31	1998-12-22	General Electric Company	Transparent blends of polyetherimide resins
JP3355142B2 (ja) *	1998-01-21	2002-12-09	三菱樹脂株式会社	耐熱性積層体用フィルムとこれを用いたプリント配線基板用素板および基板の製造方法
JP3514646B2 (ja)	1999-01-05	2004-03-31	三菱樹脂株式会社	フレキシブルプリント配線基板およびその製造方法

2000
- 2000-08-10 JP JP2000242614A patent/JP4201965B2/ja not_active Expired - Lifetime
2001
- 2001-08-06 CN CNB018139531A patent/CN1266218C/zh not_active Expired - Lifetime
- 2001-08-06 EP EP01954468A patent/EP1311616B1/de not_active Expired - Lifetime
- 2001-08-06 KR KR1020037001700A patent/KR100747402B1/ko not_active Expired - Lifetime
- 2001-08-06 DE DE60126957T patent/DE60126957T2/de not_active Expired - Lifetime
- 2001-08-06 WO PCT/JP2001/006749 patent/WO2002014404A2/en not_active Ceased
- 2001-08-06 US US10/343,959 patent/US6824884B2/en not_active Expired - Lifetime
- 2001-08-07 TW TW090119209A patent/TW548294B/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
US20030186068A1 (en)	2003-10-02
JP4201965B2 (ja)	2008-12-24
JP2002053749A (ja)	2002-02-19
WO2002014404A2 (en)	2002-02-21
KR100747402B1 (ko)	2007-08-07
EP1311616A2 (de)	2003-05-21
TW548294B (en)	2003-08-21
KR20030022364A (ko)	2003-03-15
US6824884B2 (en)	2004-11-30
EP1311616B1 (de)	2007-02-28
CN1266218C (zh)	2006-07-26
DE60126957T2 (de)	2007-11-08
WO2002014404A3 (en)	2002-06-06
CN1446248A (zh)	2003-10-01

Publication	Publication Date	Title
DE60126957D1 (de)	2007-04-12	Polyaryletherketon-polyetherimid-zusammensetzungen
ATE303787T1 (de)	2005-09-15	Schergelzusammensetzungen
AR028197A1 (es)	2003-04-30	Composiciones antitranspirantes
IS2932B (is)	2015-12-15	Fúlvestrant samsetning
NO20031256D0 (no)	2003-03-19	Koplingsinnretning
EP1248673A4 (de)	2005-04-27	Mischapparat
DE60139185D1 (de)	2009-08-20	Vernetzbare perfluoroelastomarzusammensetzung
DZ3409A1 (fr)	2002-02-21	Association therapeuthique
DE50109775D1 (de)	2006-06-14	Sägeblatt
FR2816106B1 (fr)	2005-09-23	Disjoncteur
NO20030996D0 (no)	2003-03-04	Avföringspreparat
ATE286109T1 (de)	2005-01-15	Benzinzusammensetzung
DE60125415D1 (de)	2007-02-01	Formeinsatz
ATE369830T1 (de)	2007-09-15	Schweisshemmende zusammensetzungen
ATE314049T1 (de)	2006-01-15	Schweisshemmende zusammensetzungen
DE60117753D1 (de)	2006-05-04	Raupenband kaoutchouk
AR028336A1 (es)	2003-05-07	4-hidroxi-tetrahidropiridonas fenilsubstituidas
DE60139499D1 (de)	2009-09-17	Reinigungsmittelzusammensetzungen
DE60139896D1 (de)	2009-10-22	Ldenden zusammensetzungen
DE60116858D1 (de)	2006-04-13	Zusammensetzung
BR0113157B1 (pt)	2013-11-26	Composições depilatórias
DE60100278D1 (de)	2003-06-26	Schaltgerät
AR027931A1 (es)	2003-04-16	Antitranspirantes
DE60016743D1 (de)	2005-01-20	Schutzschalter
DE60123812D1 (de)	2006-11-23	Tensidsystem

Legal Events

Date	Code	Title	Description
2008-03-20	8364	No opposition during term of opposition